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    • 6. 发明授权
    • Thin-film transistor (TFT) device
    • 薄膜晶体管(TFT)器件
    • US07952104B2
    • 2011-05-31
    • US12564719
    • 2009-09-22
    • Salvatore LeonardiClaudia Caligiore
    • Salvatore LeonardiClaudia Caligiore
    • H01L29/04H01L31/036
    • H01L21/02686H01L21/02488H01L21/02532H01L21/2026H01L27/1229H01L27/1281H01L29/66757
    • A process for manufacturing a thin-film transistor device includes forming a dielectric insulation layer on a substrate, forming an amorphous silicon layer on the dielectric insulation layer, crystallizing the amorphous silicon layer, so as to obtain polycrystalline silicon, forming gate structures on the polycrystalline silicon, and forming first doped regions within the polycrystalline silicon laterally with respect to the gate structures. The crystallizing step includes forming first capping dielectric regions on the amorphous silicon layer, and then irradiating the amorphous silicon layer using a laser so as to form active areas of polycrystalline silicon separated by separation portions of amorphous silicon underlying the first capping dielectric regions.
    • 一种薄膜晶体管器件的制造方法,其特征在于,在基板上形成介电绝缘层,在所述绝缘层上形成非晶硅层,使所述非晶硅层结晶化,得到多晶硅,在所述多晶硅上形成栅极结构 硅,并且相对于栅极结构横向地在多晶硅内形成第一掺杂区域。 所述结晶步骤包括在所述非晶硅层上形成第一覆盖电介质区域,然后使用激光照射所述非晶硅层,以便形成由所述第一覆盖电介质区域下方的非晶硅的分离部分分离的多晶硅的有源区域。