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1. 发明授权

US4265943A Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions 失效
标题翻译：在钴或镍离子存在下使用次亚磷酸盐还原剂进行连续化学镀铜沉积的方法和组成
公开(公告)号：US4265943A
公开(公告)日：1981-05-05
申请号：US964128
申请日：1978-11-27
申请人： Rachel Goldstein , Peter E. Kukanskis , John J. Grunwald
发明人： Rachel Goldstein , Peter E. Kukanskis , John J. Grunwald
IPC分类号： C23C18/40 , C23C18/48 , C23C3/02
CPC分类号： C23C18/40
摘要： Electroless copper deposition solutions, and method of continuously electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, a non-formaldehyde copper reducing agent, such as hypophosphite, effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution, and a soluble source of non-copper metallic ions, such as nickel or cobalt ions, which act as an autocatalysis promoter to enable continuous plating using the solutions. The solutions are maintained in an alkaline condition and preferably in a pH range of 11-14 through the addition of pH adjusters. The properties of plating baths using the solutions, such as bath stability as well as plating process parameters such as plating rate, and the quality of deposit may be advantageously controlled through the appropriate selection of the non-copper metallic ion added and the complexing agent used. Optional additives, such as polymers, wetting agents, and various soluble unsaturated organic compounds, may also be utilized to influence these variables.
摘要翻译：公开了无电镀铜沉积溶液以及使用这些溶液将铜连续无电沉积到工件上的方法。该溶液除了作为常规溶剂的水外，还含有一种可溶的铜离子源，一种络合剂或者在溶液中保持铜的试剂混合物，一种非甲醛铜还原剂，如次磷酸盐，有效减少铜离子作为金属铜沉积或镀在与溶液接触的工件的制备表面上，以及作为自催化促进剂的非铜金属离子的可溶性源，例如镍或钴离子，使得能够使用溶液进行连续电镀。通过添加pH调节剂将溶液保持在碱性条件下，优选在11-14的pH范围内。使用溶液的电镀浴的性质，例如浴稳定性以及电镀工艺参数如电镀速率和沉积质量可以有利地通过适当选择加入的非铜金属离子和使用的络合剂来进行控制。还可以使用任选的添加剂，例如聚合物，润湿剂和各种可溶性不饱和有机化合物来影响这些变量。

2. 发明授权

US4608275A Oxidizing accelerator 失效
标题翻译：氧化促进剂
公开(公告)号：US4608275A
公开(公告)日：1986-08-26
申请号：US712981
申请日：1985-03-18
申请人： Peter E. Kukanskis , John J. Grunwald , David Sawoska
发明人： Peter E. Kukanskis , John J. Grunwald , David Sawoska
IPC分类号： C23C18/28 , H05K3/42 , C23C18/30
CPC分类号： H05K3/422 , C23C18/28
摘要： A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an alkaline accelerator bath containing an agent which oxidizes the tin.
摘要翻译：公开了一种在非导电基底上无电沉积金属的方法，包括在用含有混合锡 - 钯催化剂的催化剂组合物进行无电沉积之前处理基底。通过使经处理的基板与含有氧化锡的试剂的碱性加速槽接触来获得金属沉积的改进。

3. 发明授权

US4209331A Electroless copper composition solution using a hypophosphite reducing agent 失效
标题翻译：使用次磷酸还原剂的无电铜组合物溶液
公开(公告)号：US4209331A
公开(公告)日：1980-06-24
申请号：US909209
申请日：1978-05-25
申请人： Peter E. Kukanskis , John J. Grunwald , Donald R. Ferrier , David A. Sawoska
发明人： Peter E. Kukanskis , John J. Grunwald , Donald R. Ferrier , David A. Sawoska
IPC分类号： C23C18/40 , H05K3/18 , C23C3/02
CPC分类号： C23C18/40
摘要： Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.
摘要翻译：公开了无电镀铜沉积溶液以及使用这些溶液将铜无机沉积在工件上的方法。该溶液除了作为常规溶剂的水外还含有一种可溶的铜离子源，一种络合剂或将溶液中的铜保持在一起的试剂混合物，以及一种有效地将铜离子还原为金属铜的铜还原剂，作为在与溶液接触的工件的制备表面上沉积或电镀。本发明通过配合所用的特定络合剂和浴的pH来理解用非甲醛型试剂，特别是次磷酸盐代替通常的商业无电解铜浴的甲醛型还原剂，以将铜离子还原成金属镀铜在基底的制备表面上，其中所得到的无电金属沉积物具有至少令人满意的导电性能，以通过标准电镀技术积累额外的金属厚度。获得了现有的甲醛还原的无电解铜溶液的改进，因为本发明教导了本领域技术人员如何在较长时间的浴操作中实现比迄今为止实际的更好的铜沉积。组分浓度和浴温度的波动在浴的商业使用过程中是固有的和不可避免的，并且这些通常不利于延长使用降低甲醛的铜溶液。在本发明中，尽管存在这些固有的波动，浴的稳定性仍然更好。

4. 发明授权

US4279948A Electroless copper deposition solution using a hypophosphite reducing agent 失效
标题翻译：使用次磷酸还原剂的无电镀铜沉积溶液
公开(公告)号：US4279948A
公开(公告)日：1981-07-21
申请号：US69742
申请日：1979-08-27
申请人： Peter E. Kukanskis , John J. Grunwald , Donald R. Ferrier , David A. Sawoska
发明人： Peter E. Kukanskis , John J. Grunwald , Donald R. Ferrier , David A. Sawoska
IPC分类号： C23C18/40 , C23C3/02
CPC分类号： C23C18/40
摘要： Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with inorganic non-formaldehyde-type agents, for example hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.
摘要翻译：公开了无电镀铜沉积溶液以及使用这些溶液将铜无机沉积在工件上的方法。该溶液除了作为常规溶剂的水外还含有一种可溶的铜离子源，一种络合剂或将溶液中的铜保持在一起的试剂混合物，以及一种有效地将铜离子还原为金属铜的铜还原剂，作为在与溶液接触的工件的制备表面上沉积或电镀。本发明通过配合所用的特定络合剂和浴的pH来理解用无机非甲醛型试剂（例如次磷酸盐）代替通常的商业无电解铜浴的甲醛型还原剂，以将铜离子还原成金属在基材的制备表面上的镀铜，其中所得到的无电金属沉积物具有至少令人满意的导电性能，以通过标准电镀技术积累额外的金属厚度。获得了现有的甲醛还原的无电解铜溶液的改进，因为本发明教导了本领域技术人员如何在较长时间的浴操作中实现比迄今为止实际的更好的铜沉积。组分浓度和浴温度的波动在浴的商业使用过程中是固有的和不可避免的，并且这些通常不利于延长使用降低甲醛的铜溶液。在本发明中，尽管存在这些固有的波动，浴的稳定性仍然更好。

5. 发明授权

US3959523A Additive printed circuit boards and method of manufacture 失效
标题翻译：添加印刷电路板及其制造方法
公开(公告)号：US3959523A
公开(公告)日：1976-05-25
申请号：US424896
申请日：1973-12-14
申请人： John J. Grunwald , Peter E. Kukanskis , Elaine F. Jacovich , Eugene D. D'Ottavio
发明人： John J. Grunwald , Peter E. Kukanskis , Elaine F. Jacovich , Eugene D. D'Ottavio
IPC分类号： C23C18/16 , H05K3/18 , C23C3/02 , B05D5/12
CPC分类号： H05K3/187 , C23C18/1605 , C23C18/1651 , H05K3/184 , H05K2201/0344
摘要： Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.
摘要翻译：制造电子设备的电路板，其中电路形成导体金属通过全部添加剂无电沉积技术沉积在适当催化和掩蔽的树脂基板上，其中特征特征是使用两级金属沉积建立所需的金属总厚度。在第一阶段，在基材上产生细小的金属沉积物，然后水洗，并将其浸入具有足够高沉积速率的第二金属浴中，以在商业实用的时间段内产生所需的金属总厚度时间。在热冲击之前和之后，电镀金属对树脂基材的附着力都得到提高，通过这种两阶段电镀工艺来实现。

6. 发明授权

US5132038A Composition for preparing printed circuit through-holes for metallization 失效
标题翻译：用于制备用于金属化的印刷电路通孔的组合物
公开(公告)号：US5132038A
公开(公告)日：1992-07-21
申请号：US512067
申请日：1990-04-18
申请人： Peter E. Kukanskis , Joseph J. D'Ambrisi , John J. Kuzmik
发明人： Peter E. Kukanskis , Joseph J. D'Ambrisi , John J. Kuzmik
IPC分类号： C23C18/22 , H05K3/00
CPC分类号： C23C18/22 , H05K3/0055 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796 , H05K2203/122
摘要： Disclosed herein are compositions for use in a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) preparatory to a treatment of the through-holes with an alkaline permanganate solution, the composition being in the form of a substantially homogeneous, substantially clear mixture comprised of a substantially water-immiscible organic material which acts upon the insulating substrate of the circuit board, water, an alkakli metal compound and a surfactant component. The composition is useful as a pretreatment prior to the use of an alkaline permanganate solution in a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
摘要翻译：本文公开了用于制备用碱性高锰酸盐溶液处理通孔的印刷电路板（特别是多层印刷电路板）中的通孔表面的方法中的组合物，该组合物为基本均匀的，基本上澄清的混合物，其由基本上与水不混溶的有机材料组成，其作用于电路板的绝缘基材，水，烷基金属化合物和表面活性剂组分。该组合物可用作在使用碱金属高锰酸盐溶液进行去污和/或回蚀工艺，组合去污处理工艺或独立脱蜡工艺后的调节过程之前的预处理。

7. 发明授权

US4921571A Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces 失效
标题翻译：用于从铜表面汽提锡，铅或锡铅合金的组合物和方法
公开(公告)号：US4921571A
公开(公告)日：1990-05-01
申请号：US386887
申请日：1989-07-28
申请人： Peter E. Kukanskis , Bryan Whitmore
发明人： Peter E. Kukanskis , Bryan Whitmore
IPC分类号： C09K13/04 , C09K13/06 , C23F1/00 , C23F1/30 , C23F1/44 , H05K3/06 , H05K3/24
CPC分类号： C23F1/30 , C23F1/44 , H05K3/067
摘要： A composition for stripping tin, lead or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, an inorganic nitrate, preferably ferric nitrate, and an inhibitor component. The composition effects rapid stripping without any appreciable formation of sludge or precipitate or suspended particles, and without any substantial attack on the underlying copper surface.
摘要翻译：用于从包含烷烃磺酸，优选甲烷磺酸，无机硝酸盐，优选硝酸铁和阻聚剂组分的铜表面汽提锡，铅或焊料以及任何下面的铜 - 锡合金的组合物。该组合物快速剥离而没有任何可观的形成污泥或沉淀物或悬浮颗粒，并且对下面的铜表面没有任何实质性的攻击。

8. 发明授权

US5213840A Method for improving adhesion to polymide surfaces 失效
标题翻译：改善与聚酰亚胺表面粘附性的方法
公开(公告)号：US5213840A
公开(公告)日：1993-05-25
申请号：US713638
申请日：1991-06-10
申请人： Richard C. Retallick , Raymond A. Letize , Peter E. Kukanskis
发明人： Richard C. Retallick , Raymond A. Letize , Peter E. Kukanskis
IPC分类号： C23C18/22 , H05K3/00 , H05K3/38
CPC分类号： H05K3/381 , C23C18/22 , H05K3/0055 , H05K2201/0154 , H05K2203/0796
摘要： The adhesion between surfaces of polyimide, particularly the through hole surfaces of polyimide-based multilayer laminates used in the fabrication of multilayer printed circuits, is improved by pretreatment of the surfaces with an essentially non-alkaline aqueous permanganate solution.
摘要翻译：通过用基本上非碱性的高锰酸盐溶液预处理表面，改进了用于制造多层印刷电路的聚酰亚胺表面，特别是聚酰亚胺基多层叠层的通孔表面之间的粘附。

9. 发明授权

US4938853A Electrolytic method for the dissolution of copper particles formed during electroless copper deposition 失效
标题翻译：在无电铜沉积过程中形成的铜颗粒溶解的电解方法
公开(公告)号：US4938853A
公开(公告)日：1990-07-03
申请号：US350148
申请日：1989-05-10
申请人： Richard C. Retallick , Peter E. Kukanskis
发明人： Richard C. Retallick , Peter E. Kukanskis
IPC分类号： C23C18/38 , C23C18/31 , C23C18/40
CPC分类号： C23C18/40
摘要： Non-adherent copper metal particles ("fines") formed in a plating bath during the course of autocatalytic electroless copper deposition onto activated substrate surfaces are oxidized and redissolved in the bath by brief application of current between an anode element and a cathode element immersed in the bath, the anode element being comprised of an anode surface substantially parallel and proximate to the bottom surface of the vessel containing the bath.
摘要翻译：在自催化无电镀铜沉积到活性基板表面的过程中，在镀浴中形成的非粘附铜金属颗粒（“细粉”）被氧化并再次溶解在浴中，通过在阳极元件和浸入所述阳极元件由阳极表面构成，所述阳极表面基本上平行并且靠近所述容器的所述容器的底表面。

10. 发明授权

US4735694A Method for manufacture of printed circuit boards 失效
标题翻译：印刷电路板的制造方法
公开(公告)号：US4735694A
公开(公告)日：1988-04-05
申请号：US875613
申请日：1986-06-18
申请人： Peter E. Kukanskis
发明人： Peter E. Kukanskis
IPC分类号： H05K3/28 , C25D7/00 , H05K3/06 , H05K3/10 , H05K3/24 , H05K3/38 , H05K3/42 , C25D5/02
CPC分类号： H05K3/244 , H05K3/062 , H05K3/384 , H05K3/42 , H05K2203/0361 , H05K3/108 , H05K3/28 , H05K3/427
摘要： A method of preparing printed circuit boards is described in which the solder mask on the circuit pattern and, optionally, the solder on the through-holes surrounding pads, and like areas to receive solder, is applied over a layer of lead covering the copper layer at said loci. This method eliminates the need to strip tin-lead alloy etch resist which step is commonly employed in prior processes. The method overcomes the problems associated with migration of tin into the copper layer which can occur when tin-lead alloys are applied directly over copper.
摘要翻译：描述了一种制备印刷电路板的方法，其中电路图案上的焊料掩模，以及可选地围绕焊盘的通孔上的焊料和类似的接收焊料的区域被施加在覆盖铜层的引线层上在所述的位置。该方法消除了在先前工艺中通常采用步骤的锡 - 铅合金蚀刻抗蚀剂的需要。该方法克服了锡直接施加在铜上时可能发生的锡向铜层迁移的问题。

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