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    • 3. 发明授权
    • Method and composition for continuous electroless copper deposition
using a hypophosphite reducing agent in the presence of cobalt or
nickel ions
    • 在钴或镍离子存在下使用次亚磷酸盐还原剂进行连续化学镀铜沉积的方法和组成
    • US4265943A
    • 1981-05-05
    • US964128
    • 1978-11-27
    • Rachel GoldsteinPeter E. KukanskisJohn J. Grunwald
    • Rachel GoldsteinPeter E. KukanskisJohn J. Grunwald
    • C23C18/40C23C18/48C23C3/02
    • C23C18/40
    • Electroless copper deposition solutions, and method of continuously electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, a non-formaldehyde copper reducing agent, such as hypophosphite, effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution, and a soluble source of non-copper metallic ions, such as nickel or cobalt ions, which act as an autocatalysis promoter to enable continuous plating using the solutions. The solutions are maintained in an alkaline condition and preferably in a pH range of 11-14 through the addition of pH adjusters. The properties of plating baths using the solutions, such as bath stability as well as plating process parameters such as plating rate, and the quality of deposit may be advantageously controlled through the appropriate selection of the non-copper metallic ion added and the complexing agent used. Optional additives, such as polymers, wetting agents, and various soluble unsaturated organic compounds, may also be utilized to influence these variables.
    • 公开了无电镀铜沉积溶液以及使用这些溶液将铜连续无电沉积到工件上的方法。 该溶液除了作为常规溶剂的水外,还含有一种可溶的铜离子源,一种络合剂或者在溶液中保持铜的试剂混合物,一种非甲醛铜还原剂,如次磷酸盐,有效减少 铜离子作为金属铜沉积或镀在与溶液接触的工件的制备表面上,以及作为自催化促进剂的非铜金属离子的可溶性源,例如镍或钴离子,使得能够 使用溶液进行连续电镀。 通过添加pH调节剂将溶液保持在碱性条件下,优选在11-14的pH范围内。 使用溶液的电镀浴的性质,例如浴稳定性以及电镀工艺参数如电镀速率和沉积质量可以有利地通过适当选择加入的非铜金属离子和使用的络合剂来进行控制 。 还可以使用任选的添加剂,例如聚合物,润湿剂和各种可溶性不饱和有机化合物来影响这些变量。