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1. 发明申请

US20120017437A1 CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE 有权
标题翻译：具有导电性浆料的电路基板，包括公知的基板的电气装置和制造基板的方法
公开(公告)号：US20120017437A1
公开(公告)日：2012-01-26
申请号：US13252256
申请日：2011-10-04
申请人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
发明人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
IPC分类号： H05K3/40
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
摘要翻译：一种电路化基板，包括用于提供电连接的导电浆料。在一个实施方案中，糊状物包括包含纳米颗粒的金属组分，并且可以包括附加元素，例如焊料或其它金属微粒，以及导电聚合物和有机物。糊料组合物的颗粒烧结并且根据添加的另外的元素而熔化，因为层压，从而形成通过糊料的有效连续的电路。还提供了制造这种基板的方法，以及利用该基板并且包括诸如与其耦合的半导体芯片的电子部件的电组件。

2. 发明授权

US09756724B2 Method of making a circuitized substrate 有权
公开(公告)号：US09756724B2
公开(公告)日：2017-09-05
申请号：US13252256
申请日：2011-10-04
申请人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
发明人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
IPC分类号： H05K3/40 , H05K1/03 , H05K3/46 , B23K26/382 , B23K26/40 , H01B1/22 , H05K1/09 , B23K103/00 , B23K101/40 , B23K103/16
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.

3. 发明授权

US08063315B2 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate 有权
标题翻译：具有导电浆料的电路基板，包括所述电路化基板的电气组件和制造所述基板的方法
公开(公告)号：US08063315B2
公开(公告)日：2011-11-22
申请号：US11802434
申请日：2007-05-23
申请人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
发明人： Rabindra N. Das , Kostas I. Papathomas , Voya R. Markovich
IPC分类号： H05K1/11
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.
摘要翻译：一种电路化基板，包括用于提供电连接的导电浆料。在一个实施方案中，糊状物包括包含纳米颗粒的金属组分，并且可以包括附加元素，例如焊料或其它金属微粒，以及导电聚合物和有机物。糊料组合物的颗粒烧结并且根据添加的另外的元素而熔化，因为层压，从而形成通过糊料的有效连续的电路。还提供了制造这种基板的方法，以及利用该基板并且包括诸如与其耦合的半导体芯片的电子部件的电组件。

4. 发明授权

US08211790B2 Multilayered circuitized substrate with P-aramid dielectric layers and method of making same 失效
标题翻译：具有P型芳族聚酰胺介电层的多层电路基板及其制造方法
公开(公告)号：US08211790B2
公开(公告)日：2012-07-03
申请号：US12380617
申请日：2009-03-02
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： H01L21/4763
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
摘要翻译：一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分，电路层位于第一介电层上。还提供了制造该基板的方法。

5. 发明授权

US08084863B2 Circuitized substrate with continuous thermoplastic support film dielectric layers 失效
标题翻译：具有连续热塑性支撑膜电介质层的电路基板
公开(公告)号：US08084863B2
公开(公告)日：2011-12-27
申请号：US12081051
申请日：2008-04-10
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： H01L23/50
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , H01L2224/0401
摘要： A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.
摘要翻译：一种电路化基板，包括具有浸渍有无卤低吸湿树脂的对芳族聚酰胺纸，并且不包括作为其一部分的连续或半连续玻璃纤维纤维的介电层和位于介电层上的第一电路层。还提供了制造该基板的方法。

6. 发明授权

US07646098B2 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same 失效
标题翻译：具有对芳族聚酰胺介电层的多层电路基板及其制造方法
公开(公告)号：US07646098B2
公开(公告)日：2010-01-12
申请号：US12081042
申请日：2008-04-10
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： H01L23/485
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
摘要翻译：一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分，电路层位于第一介电层上。还提供了制造该基板的方法。

7. 发明授权

US6125531A Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means 有权
公开(公告)号：US6125531A
公开(公告)日：2000-10-03
申请号：US259977
申请日：1999-03-01
申请人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
发明人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
IPC分类号： H05K1/03 , H05K1/11 , H05K3/00 , H05K3/24 , H05K3/40 , H01K3/10
CPC分类号： H05K3/0094 , H05K3/4069 , H05K1/0366 , H05K1/113 , H05K2201/0347 , H05K2201/0959 , H05K2203/0278 , H05K2203/0338 , H05K2203/1453 , H05K3/246 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, providing a fill member including a quantity of fill material and reinforcement means located within the fill material, positioning the fill member on the dielectric over the holes and thereafter applying a predetermined force sufficient to cause only the fill material to be forcibly driven into the accommodating hole(s), not the reinforcement means. Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.

8. 发明授权

US6079100A Method of making a printed circuit board having filled holes and fill member for use therewith 失效
标题翻译：制造具有填充孔和填充构件的印刷电路板的方法
公开(公告)号：US6079100A
公开(公告)日：2000-06-27
申请号：US76649
申请日：1998-05-12
申请人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
发明人： Donald S. Farquhar , Voya R. Markovich , Kostas I. Papathomas , Leonard L. Schmidt
IPC分类号： H05K1/11 , H05K3/00 , H01K3/10 , H01R9/09
CPC分类号： H05K3/0094 , H05K1/113 , H05K2201/0959 , H05K2203/0191 , H05K2203/025 , H05K2203/0278 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, positioning a thin layer of support material atop the dielectric layer and over the hole(s), positioning a quantity of fill material on the thin layer of support material (preferably before positioning the thin layer on the dielectric) and thereafter applying a predetermined force sufficient to cause the thin support layer to rupture or otherwise deform (including melting from heat application thereto) such that the fill material is forcibly driven into the accommodating hole(s). Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.
摘要翻译：一种制造诸如印刷电路板的电路化基板的方法，其中具有至少一个孔，其包括以下步骤：提供介电层，在其中形成至少一个（并且优选几个）孔，将薄层的支撑材料定位在顶部电介质层和孔之上，将一定量的填充材料定位在支撑材料的薄层上（优选在将薄层定位在电介质上之前），然后施加足以使薄载体层破裂的预定力或以其他方式变形（包括从其加热熔化）使得填充材料被强制地驱动到容纳孔中。随后的步骤可以包括在衬底的外表面上和填充的孔上形成电路层，使得电子部件例如球栅阵列（BGA），半导体芯片等可以直接定位在孔的上和/或上方（s）。还提供了可用于该方法的填充构件。

9. 发明申请

US20080191353A1 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same 失效
标题翻译：具有对芳族聚酰胺介电层的多层电路基板及其制造方法
公开(公告)号：US20080191353A1
公开(公告)日：2008-08-14
申请号：US12081042
申请日：2008-04-10
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： H01L23/485 , H05K3/30
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
摘要翻译：一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分，电路层位于第一介电层上。还提供了制造该基板的方法。

10. 发明申请

US20110017498A1 Photosensitive dielectric film 审中-公开
标题翻译：感光电介质膜
公开(公告)号：US20110017498A1
公开(公告)日：2011-01-27
申请号：US12460975
申请日：2009-07-27
申请人： John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
发明人： John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
IPC分类号： H05K1/09 , C08J3/28 , B05D5/12
CPC分类号： H05K3/4676 , H05K3/0023 , H05K2201/0209
摘要： A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.
摘要翻译：根据本发明的一个实施方案提供一种适用于形成用于电路化基底的电介质膜层的光敏电介质组合物，该组合物包括含环氧化物的组分，该组分包括至少一种可通过电磁辐射固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，预定量的树脂组分的光引发剂和陶瓷填料，所述光敏介电组合物形成在其中不溶剂的电介质膜层。在另一个实施方案中，提供热活化电介质组合物，其可通过加热固化，并且包括含环氧化物的组分，其包含至少一种可热固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，热活化固化剂加速氰酸酯和聚环氧树脂组分的反应，以及陶瓷填料。还提供了从上述组合物制备电路化基底的方法。

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