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1. 发明公开

EP3794636A1 METHOD AND APPARATUS FOR MULTIPLE DIRECT TRANSFERS OF SEMICONDUCTOR DEVICES 审中-公开
公开(公告)号：EP3794636A1
公开(公告)日：2021-03-24
申请号：EP19804301.0
申请日：2019-04-30
申请人： ROHINNI, LLC.
发明人： PETERSON, Cody , HUSKA, Andrew
IPC分类号： H01L21/67

2. 发明申请

WO2018098253A1 PATTERN ARRAY DIRECT TRANSFER APPARATUS AND METHOD THEREFOR 审中-公开
公开(公告)号：WO2018098253A1
公开(公告)日：2018-05-31
申请号：PCT/US2017/062981
申请日：2017-11-22
申请人： ROHINNI, LLC
发明人： PETERSON, Cody , HUSKA, Andy
IPC分类号： H01L21/687
摘要： An apparatus includes a first frame that holds a wafer tape and a second frame that clamps a product substrate. A transfer element is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate. At least one energy source is directed at a portion of the product substrate corresponding to the transfer position at which the group of dies contacts the circuit trace to apply energy to the circuit trace to affix the group of dies to the circuit trace.

3. 发明申请

WO2015188172A2 MANUFACTURE OF CIRCUIT ASSEMBLY WITH UNPACKAGED SEMICONDUCTOR DEVICES 审中-公开
标题翻译：电路组件与未封装的半导体器件的制造
公开(公告)号：WO2015188172A2
公开(公告)日：2015-12-10
申请号：PCT/US2015/034596
申请日：2015-06-06
申请人： ROHINNI, LLC , HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
发明人： HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
CPC分类号： H01L21/50 , H01L21/561 , H01L21/6835 , H01L21/6836 , H01L23/3121 , H01L24/24 , H01L24/76 , H01L24/82 , H01L25/03 , H01L2221/68327 , H01L2221/68354
摘要： Described herein are techniques related to the efficient and effective manufacture electronic products (e.g., mobile devices, computers, etc.) that incorporate circuitry with semiconductor devices. As described herein, a new manufacturing approach incorporates unpackaged semiconductor devices (i.e., dies) into the circuitry of electronic products during manufacturing. This is done using a direct carrier-to-circuit die transfer approach. In addition, the dies and/or their related circuitry are packaged in-place (i.e., "in-situ packaging"). This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：这里描述的是涉及具有半导体器件的电路的有效和有效的制造电子产品（例如，移动设备，计算机等）的技术。如本文所述，新的制造方法在制造期间将未封装的半导体器件（即，裸片）合并到电子产品的电路中。这是使用直接的载波到电路模转移方法完成的。此外，将模具和/或其相关电路封装就地（即，“原位包装”）。提交本摘要的理解是，它不会用于解释或限制权利要求的范围或含义。

4. 发明申请

WO2020180666A1 MULTI-AXIS MOVEMENT FOR TRANSFER OF SEMICONDUCTOR DEVICES 审中-公开
公开(公告)号：WO2020180666A1
公开(公告)日：2020-09-10
申请号：PCT/US2020/020347
申请日：2020-02-28
申请人： ROHINNI, LLC
发明人： PETERSON, Cody , HUSKA, Andrew
IPC分类号： H01L21/683
摘要： A method for executing a direct transfer of semiconductor device die from a first substrate to transfer locations on a second substrate. The method includes determining a position of impact wires disposed on a transfer head, semiconductor device die, and transfer locations; determining whether there are at least two positions that an impact wire, a semiconductor device die, and a transfer locations are aligned within a threshold tolerance; and transferring, by the impact wires, the semiconductor device die such that the semiconductor device die detaches from the first substrate and attaches to transfer locations on the second substrate. The transferring being completed based at least in part on determining that the impact wire, the semiconductor device die, and the circuit trace are aligned within the threshold tolerance.

5. 发明申请

WO2018136645A1 FLEXIBLE SUPPORT SUBSTRATE FOR TRANSFER OF SEMICONDUCTOR DEVICES 审中-公开
公开(公告)号：WO2018136645A1
公开(公告)日：2018-07-26
申请号：PCT/US2018/014256
申请日：2018-01-18
申请人： ROHINNI, LLC
发明人： HUSKA, Andrew , PETERSON, Cody , ADAMS, Clinton , KUPCOW, Sean
IPC分类号： H01L21/687
摘要： An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to hold the wafer tape and a support frame disposed adjacent to the wafer frame. A flexible support substrate is secured in the support frame and is configured to support the product substrate. The apparatus further includes an actuator configured to position the semiconductor die at a transfer position with respect to the product substrate. An energy-emitting device is configured to direct energy through the flexible support substrate to a portion of the product substrate corresponding to the transfer position at which the semiconductor die is positioned to be affixed to the product substrate.

6. 发明申请

WO2018035488A1 BACKLIGHTING COLOR TEMPERATURE CONTROL APPARATUS 审中-公开
标题翻译：背光彩色温度控制装置
公开(公告)号：WO2018035488A1
公开(公告)日：2018-02-22
申请号：PCT/US2017/047661
申请日：2017-08-18
申请人： ROHINNI, LLC
发明人： PETERSON, Cody , HUSKA, Andy
IPC分类号： G12B11/00 , G02F1/01
CPC分类号： G06F3/0202 , G02B6/0068 , H01H13/70
摘要： An apparatus includes a housing including a plurality of light sources to provide backlighting for the apparatus. A first portion of the plurality of light sources is configured to provide a first color temperature setting. A second portion of the plurality of light sources is configured to provide a second color temperature setting. The apparatus includes a controller including one or more processors configured to execute instructions stored on memory, which when executed, cause the one or more controllers to set at least one of an overall color temperature setting for the backlighting of the apparatus, or a partial color temperature setting for the backlighting of the apparatus.
摘要翻译：一种设备包括外壳，该外壳包括多个光源以为该设备提供背光。多个光源的第一部分被配置为提供第一色温设置。多个光源的第二部分被配置为提供第二色温设置。该设备包括控制器，该控制器包括被配置为执行存储在存储器上的指令的一个或多个处理器，所述指令在被执行时使所述一个或多个控制器设置用于所述设备的背光照明的整体色温设置或部分色设备背光照明的温度设置。

7. 发明申请

WO2017197340A1 LIGHT VECTORING APPARATUS 审中-公开
标题翻译：光线传输装置
公开(公告)号：WO2017197340A1
公开(公告)日：2017-11-16
申请号：PCT/US2017/032522
申请日：2017-05-12
申请人： ROHINNI, LLC
发明人： PETERSON, Cody , WENDT, Justin , HUSKA, Andy , ADAMS, Clint
IPC分类号： F21V13/00
摘要： An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.
摘要翻译：一种装置包括其中具有空隙的覆盖层。背衬层靠着覆盖层的第一侧布置。传输层靠着与第一侧相对的覆盖层的第二侧设置，使得腔室形成在传输层和背衬层之间的空隙内。透射层包括具有第一水平透光率的第一区域和具有大于第一水平透光率的第二水平透光率的第二区域。传输层被定向为使得第一区域和第二区域中的每一个的至少一部分与空隙重叠。光源位于传输层的第一区域和背层之间的腔室中。

8. 发明公开

EP3408728A1 APPARATUS AND METHOD OF BACKLIGHTING THROUGH A COVER ON THE APPARATUS 审中-公开
公开(公告)号：EP3408728A1
公开(公告)日：2018-12-05
申请号：EP17739164.6
申请日：2017-01-17
申请人： Rohinni, LLC
发明人： PETERSON, Cody , HUSKA, Andrew , ADAMS, Clinton , HUSCHKE, Lars , BOKMA, Peter
IPC分类号： G06F3/02 , F21V8/00
CPC分类号： G06F3/02 , G06F3/0202 , H01H13/83 , H01H2209/082 , H01H2209/086 , H01H2219/00 , H01H2219/028 , H01H2219/056 , H01H2223/044 , H01H2229/02
摘要： A keyboard apparatus includes a fabric key cover having a plurality of holes that extend through a thickness of the cover from a top side of the cover to a bottom side of the cover. The plurality of holes are arranged to collectively form a predetermined shape. A mask layer is disposed at the bottom side of the cover. A first region of the mask layer is opaque and a second region of the mask layer allows light to pass therethrough to the plurality of holes. A light source is disposed beneath the mask layer and positioned such that light emitted from the light source passes through the second region of the mask layer to the plurality of holes. A sensory contact terminal is disposed beneath the mask layer, and the terminal detects a keystroke movement.

9. 发明公开

EP3271937A1 METHOD FOR TRANSFER OF SEMICONDUCTOR DEVICES 审中-公开
标题翻译：转移半导体器件的方法
公开(公告)号：EP3271937A1
公开(公告)日：2018-01-24
申请号：EP16769455.3
申请日：2016-03-18
申请人： Rohinni, LLC
发明人： HUSKA, Andrew , CHRISTIE, Kasey , PETERSON, Cody , ADAMS, Clinton , KUPCOW, Sean
IPC分类号： H01L21/50 , H01L21/67 , H05K3/00
摘要： A system performs a direct transfer of a semiconductor device die from a first substrate to a second substrate. A semiconductor device die is disposed on a first side of the first substrate. The system includes a first conveyance mechanism to convey the first substrate, and a second conveyance mechanism to convey the second substrate with respect to the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also comprises a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.

10. 发明申请

WO2019221909A1 METHOD AND APPARATUS FOR MULTIPLE DIRECT TRANSFERS OF SEMICONDUCTOR DEVICES 审中-公开
公开(公告)号：WO2019221909A1
公开(公告)日：2019-11-21
申请号：PCT/US2019/029996
申请日：2019-04-30
申请人： ROHINNI, LLC
发明人： PETERSON, Cody , HUSKA, Andrew
IPC分类号： H01L21/67
摘要： An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. Two or more needles are disposed adjacent a second side of the wafer tape opposite the first side. A length of the two or more needles extends in a direction toward the wafer tape. A needle actuator actuates the two or more needles into a die transfer position at which at least one needle of the two or more needles presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.

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