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1. 发明申请

WO2015188172A2 MANUFACTURE OF CIRCUIT ASSEMBLY WITH UNPACKAGED SEMICONDUCTOR DEVICES 审中-公开
标题翻译：电路组件与未封装的半导体器件的制造
公开(公告)号：WO2015188172A2
公开(公告)日：2015-12-10
申请号：PCT/US2015/034596
申请日：2015-06-06
申请人： ROHINNI, LLC , HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
发明人： HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
CPC分类号： H01L21/50 , H01L21/561 , H01L21/6835 , H01L21/6836 , H01L23/3121 , H01L24/24 , H01L24/76 , H01L24/82 , H01L25/03 , H01L2221/68327 , H01L2221/68354
摘要： Described herein are techniques related to the efficient and effective manufacture electronic products (e.g., mobile devices, computers, etc.) that incorporate circuitry with semiconductor devices. As described herein, a new manufacturing approach incorporates unpackaged semiconductor devices (i.e., dies) into the circuitry of electronic products during manufacturing. This is done using a direct carrier-to-circuit die transfer approach. In addition, the dies and/or their related circuitry are packaged in-place (i.e., "in-situ packaging"). This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：这里描述的是涉及具有半导体器件的电路的有效和有效的制造电子产品（例如，移动设备，计算机等）的技术。如本文所述，新的制造方法在制造期间将未封装的半导体器件（即，裸片）合并到电子产品的电路中。这是使用直接的载波到电路模转移方法完成的。此外，将模具和/或其相关电路封装就地（即，“原位包装”）。提交本摘要的理解是，它不会用于解释或限制权利要求的范围或含义。

2. 发明申请

WO2017197340A1 LIGHT VECTORING APPARATUS 审中-公开
标题翻译：光线传输装置
公开(公告)号：WO2017197340A1
公开(公告)日：2017-11-16
申请号：PCT/US2017/032522
申请日：2017-05-12
申请人： ROHINNI, LLC
发明人： PETERSON, Cody , WENDT, Justin , HUSKA, Andy , ADAMS, Clint
IPC分类号： F21V13/00
摘要： An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.
摘要翻译：一种装置包括其中具有空隙的覆盖层。背衬层靠着覆盖层的第一侧布置。传输层靠着与第一侧相对的覆盖层的第二侧设置，使得腔室形成在传输层和背衬层之间的空隙内。透射层包括具有第一水平透光率的第一区域和具有大于第一水平透光率的第二水平透光率的第二区域。传输层被定向为使得第一区域和第二区域中的每一个的至少一部分与空隙重叠。光源位于传输层的第一区域和背层之间的腔室中。

3. 发明公开

EP3455551A1 LIGHT VECTORING APPARATUS 审中-公开
公开(公告)号：EP3455551A1
公开(公告)日：2019-03-20
申请号：EP17796988.8
申请日：2017-05-12
申请人： Rohinni, LLC
发明人： PETERSON, Cody , WENDT, Justin , HUSKA, Andy , ADAMS, Clint
IPC分类号： F21V13/00

4. 发明公开

EP3152781A2 MANUFACTURE OF CIRCUIT ASSEMBLY WITH UNPACKAGED SEMICONDUCTOR DEVICES 审中-公开
标题翻译： HERSTELLUNG EINER SCHALTUNGSANORDNUNG MITGEHÄUSELOSENHALBLEITERBAUELEMENTEN
公开(公告)号：EP3152781A2
公开(公告)日：2017-04-12
申请号：EP15803526.1
申请日：2015-06-06
申请人： Rohinni, LLC , Huska, Andrew P. , Peterson, Cody G. , Christie, Kasey , Adams, Clinton , Ozias, Orin
发明人： HUSKA, Andrew , PETERSON, Cody , CHRISTIE, Kasey , ADAMS, Clint , OZIAS, Orin
IPC分类号： H01L21/50 , H01L25/03
CPC分类号： H01L21/50 , H01L21/561 , H01L21/6835 , H01L21/6836 , H01L23/3121 , H01L24/24 , H01L24/76 , H01L24/82 , H01L25/03 , H01L2221/68327 , H01L2221/68354
摘要： An apparatus includes a carrier-to-circuit transfer mechanism that is configured to obtain one or more unpackaged semiconductor devices on a carrier substratum and directly transfer the one or more unpackaged semiconductor devices from the carrier substratum to a circuit assembly. The apparatus further includes an in-situ packager that is configured to in-situ package the one or more transferred devices by interconnecting each semiconductor device of the one or more transferred devices to conductive links of the circuit assembly and applying a coating material to the one or more transferred devices.
摘要翻译：这里描述了与集成有半导体器件的电路的有效和有效的制造电子产品（例如，移动设备，计算机等）相关的技术。如本文所述，新的制造方法在制造期间将未封装的半导体器件（即，裸片）合并到电子产品的电路中。这是使用直接的载波到电路模转移方法完成的。此外，将模具和/或其相关电路封装就地（即，“原位包装”）。提交本摘要的理解是，它不会用于解释或限制权利要求的范围或含义。

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