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1. 发明申请

WO2019147144A1 A MULTI-LEVEL MODULAR CONVERTER 审中-公开
公开(公告)号：WO2019147144A1
公开(公告)日：2019-08-01
申请号：PCT/NZ2019/050006
申请日：2019-01-25
申请人： RIAR, Baljit Singh , THRIMAWITHANA, Duleepa Jayanath , ZANE, Regan Andrew , WANG, Victor
发明人： RIAR, Baljit Singh , THRIMAWITHANA, Duleepa Jayanath , ZANE, Regan Andrew , WANG, Victor
IPC分类号： H02M7/501 , H02M7/49 , H02J50/10 , H02J50/05 , B60L53/12 , H02M7/19 , H02J5/00 , H02M7/44
摘要： The present disclosure relates to an integrated boost modular multilevel converter, which has particular, but not sole, relevance to a converter for an inductive or capacitive (wireless) power transfer system. More particularly, the present invention according to an embodiment discloses a modular multilevel power converter (MMPC) comprising: at least one submodule stack having an output for connection to a load and an input for connection to an input power source, at least one inductive element provided between the input and the output, the at least one submodule stack including at least two submodules, each submodule comprising at least one capacitor and a plurality of controllable switches, and the submodules being operable to selectively transfer energy from the at least one inductive element to boost a voltage at the output relative to a voltage at the input.

2. 发明申请

WO2005056112A1 PORTABLE THERAPEUTIC DEVICE AND METHOD FOR PAIN RELIEF 审中-公开
标题翻译：便携式治疗装置和疼痛缓解方法
公开(公告)号：WO2005056112A1
公开(公告)日：2005-06-23
申请号：PCT/US2004/015422
申请日：2004-05-18
申请人： WANG, Tianxin , ZOU, Shazhou , WANG, Victor
发明人： WANG, Tianxin , ZOU, Shazhou , WANG, Victor
IPC分类号： A61N01/18
CPC分类号： A61N1/36021
摘要： The invention relates to a method and device of reducing pain and other symptoms in a patient utilizing a non-invasive electrical stimulation device applied over acupuncture points and adjacent nerves of a patient. The non-invasive electrical stimulation device is a portable electrical therapeutic device. The device includes electronic circuitry for imparting electrical impulses to the desired acupuncture points and areas. Batteries within the device power the electric circuitry, and an operable switch on the device controls on/off and pulse frequency and amplitude.
摘要翻译：本发明涉及一种利用应用于患者的穴位和相邻神经的非侵入性电刺激装置来减轻患者的疼痛和其它症状的方法和装置。非侵入性电刺激装置是便携式电疗治疗装置。该装置包括用于将电脉冲施加到期望的针灸点和区域的电子电路。设备内的电池为电路供电，设备上的可操作开关控制开/关以及脉冲频率和幅度。

3. 发明申请

WO2009085163A1 A COMPOSITE SHOWERHEAD ELECTRODE ASSEMBLY FOR A PLASMA PROCESSING APPARATUS 审中-公开
标题翻译：用于等离子体加工设备的复合淋浴电极组件
公开(公告)号：WO2009085163A1
公开(公告)日：2009-07-09
申请号：PCT/US2008/013782
申请日：2008-12-17
申请人： LAM RESEARCH CORPORATION , LARSON, Dean, Jay , STEVENSON, Tom , WANG, Victor
发明人： LARSON, Dean, Jay , STEVENSON, Tom , WANG, Victor
IPC分类号： H01L21/205
CPC分类号： H01L21/3065 , B29C65/483 , B29C65/4835 , B29C65/4855 , B29C65/4865 , B29C65/4875 , B29C65/4885 , B29C65/5028 , B29C65/5057 , B29C65/5071 , B29C66/73111 , B29C66/73112 , B29C66/742 , B29K2305/00 , B32B37/025 , B32B37/1292 , B32B38/145 , B32B38/164 , B32B2307/202 , B32B2309/02 , B32B2309/10 , B32B2309/105 , B32B2457/00 , C23C16/45565 , H01J37/32009 , H01J37/3244 , H01J37/32541 , H01J37/3255 , H05K13/0023 , Y10T29/49 , Y10T29/49002 , Y10T29/5313 , Y10T29/532 , Y10T29/53204 , Y10T156/10 , Y10T156/1062
摘要： A showerhead electrode for a plasma processing apparatus includes an elastomeric sheet adhesive bond between mating surfaces of an electrode and a backing member to accommodate stresses generated during temperature cycling due to mismatch in coefficients of thermal expansion. The elastomeric sheet comprises a thermally conductive silicone adhesive able to withstand a high shear strain of ≥300% in a temperature range of room temperature to 3000C such as heat curable high molecular weight dimethyl silicone with fillers. The sheet form adhesive has bond thickness control for parallelism of bonded surfaces over large areas. The sheet adhesive may be cast or die cut into pre-form shapes that can conform to irregularly shaped features, maximize surface contact area with mating electrode surfaces, and installed into cavities of the mating assembly. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.
摘要翻译：用于等离子体处理装置的喷头电极包括在电极的配合表面和背衬构件之间的弹性片粘合剂粘合，以适应由于热膨胀系数的失配而在温度循环期间产生的应力。弹性体片材包括能够在室温至300℃的温度范围内承受= 300％的高剪切应变的导热硅酮粘合剂，例如具有填料的热固化高分子量二甲基硅氧烷。片状粘合剂具有用于在大面积上的接合表面的平行度的结合厚度控制。片状粘合剂可以被铸造或模切成预成形的形状，其可以符合不规则形状的特征，使与配合的电极表面的表面接触面积最大化并且安装到配合组件的空腔中。安装可以手动，手动安装工具或自动化机械。具有不同物理性质的片状粘合剂的复合层可以层压或共面。

4. 发明申请

WO2008048444A1 QUARTZ GUARD RING CENTERING FEATURES 审中-公开
标题翻译： QUARTZ GUARD戒指中心特点
公开(公告)号：WO2008048444A1
公开(公告)日：2008-04-24
申请号：PCT/US2007/021629
申请日：2007-10-10
申请人： LAM RESEARCH CORPORATION , LARSON, Dean, J. , BROWN, Daniel , COMENDANT, Keith , WANG, Victor
发明人： LARSON, Dean, J. , BROWN, Daniel , COMENDANT, Keith , WANG, Victor
IPC分类号： H01L21/3065
CPC分类号： H01J37/3255 , H01J37/32009 , H01J37/32568 , Y10T29/49002
摘要： An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.
摘要翻译：一种电极组件和使外环围绕用于半导体衬底处理的等离子体反应室中的电极组件对中的方法。该方法包括将外环围绕电极组件的背衬构件的外表面定位，并且在外环和背衬构件之间插入至少一个定心元件。定心元件可以是容纳在背衬构件的外表面上的空腔中的多个弹簧加载的定心元件，定心元件具有适于接触外圈的第一端和适于接收弹簧的第二端。外环围绕背衬构件的外表面，使得多个弹簧加载的定心元件位于背衬构件的外表面和外环的内表面之间。

5. 发明申请

WO2009078923A2 FILM ADHESIVE FOR SEMICONDUCTOR VACUUM PROCESSING APPARATUS 审中-公开
标题翻译：半导体真空处理装置的薄膜粘合剂
公开(公告)号：WO2009078923A2
公开(公告)日：2009-06-25
申请号：PCT/US2008/013466
申请日：2008-12-18
申请人： LAM RESEARCH CORPORATION , LARSON, Dean Jay , STEVENSON, Tom , WANG, Victor
发明人： LARSON, Dean Jay , STEVENSON, Tom , WANG, Victor
CPC分类号： H01L21/67069 , B32B37/12 , H01L21/67103 , H01L21/68757 , Y10T156/10 , Y10T156/1062 , Y10T428/31504
摘要： A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of =800% at a temperature range between room temperature and 300°C such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.
摘要翻译：提供了一种减少诸如等离子体处理设备的半导体真空室中的粒子污染的结合组件，其包括在部件和支撑构件的配合表面之间的弹性体片粘合剂结合以适应热应力。该弹性体片材包含有机硅粘合剂以在室温和300℃之间的温度范围内承受800％的高剪切应变，例如具有任选填料的可热固化高分子量二甲基硅氧烷。片材形式具有粘合厚度控制，用于粘合表面的平行度。可以将片状粘合剂切割成预成型形状以符合规则或不规则形状的特征，使与配合部件的表面接触面积最大化，并且可以将其安装到腔体中。可以手动安装，也可以使用安装工具手动安装，也可以使用自动化机械。具有不同物理特性的片状粘合剂复合层可以层压或共面。

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