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1. 发明申请

WO2013087101A1 SUBSTRATE-SUPPORTED CIRCUIT PARTS WITH FREE-STANDING THREE-DIMENSIONAL STRUCTURES 审中-公开
标题翻译：具有自由站立的三维结构的基板支撑电路部件
公开(公告)号：WO2013087101A1
公开(公告)日：2013-06-20
申请号：PCT/EP2011/072753
申请日：2011-12-14
申请人： REINHARDT MICROTECH GMBH , RUESS, Karin , KAISER, Alexander , FEURER, Ernst , HOLL, Bruno
发明人： RUESS, Karin , KAISER, Alexander , FEURER, Ernst , HOLL, Bruno
IPC分类号： H01L23/482 , H01L25/065 , H01L21/48 , H01L23/538 , H01L21/60 , H05K3/40
CPC分类号： H01L23/4822 , B81C1/00095 , H01L23/5385 , H01L25/0652 , H01L25/0655 , H01L2225/06524 , H01L2924/0002 , H01L2924/19107 , H05K1/0306 , H05K1/148 , H05K3/4092 , H05K2201/0397 , H01L2924/00
摘要： In a method of manufacturing a substrate-supported circuit part (1) with a freestanding three-dimensional structure (2), the manufacturing method comprises the steps of: providing a pre-cleaned substrate plate (3); structuring at least one low-adhesion-strength layer (9) on an upper surface (4) of the substrate plate (3); depositing an adhesion layer (10) onto the upper surface (4) of the substrate plate (3) and onto the at least one low-adhesion-strength layer (9); depositing a conducting layer (11) onto the adhesion layer (10); structuring of conductive path material (15) on the conducting layer (11); forming a separating gap (19) between at least one resting substrate portion (20) and at least one removable substrate portion (21) that carries the later free-standing three-dimensional structure (2); and removing the at least one removable substrate portion (21) below the later free-standing three-dimensional structure (2) in the area of the low-adhesion strength layer (9). Manufacturing combinations (23) of substrate-supported circuit parts (1) with a free-standing three-dimensional structure (2) that have been produced with the inventive method and manufacturing 3D stacking assemblies (24) from such combinations (23) of substrate-supported circuit parts (1) with freestanding three-dimensional structures (2) is disclosed as well.
摘要翻译：在制造具有独立立体结构（2）的基板支撑电路部件（1）的方法中，所述制造方法包括以下步骤：提供预清洁的基板（3））; 在所述衬底板（3）的上表面（4）上构造至少一个低粘附强度层（9）; 在所述衬底板（3）的上表面（4）上和所述至少一个低粘附强度层（9）上沉积粘附层（10）; 将导电层（11）沉积到粘附层（10）上; 导电层（11）上的导电路径材料（15）的结构化; 在至少一个搁置的基底部分（20）和携带后来的自立式三维结构（2）的至少一个可移除的基底部分（21）之间形成分离间隙（19）; 以及在低粘附强度层（9）的区域中去除后面的自立式三维结构（2）下面的至少一个可去除的基底部分（21）。基板支撑电路部件（1）与用本发明方法制造的独立三维结构（2）的制造组合（23）以及由这种基板组合（23）制造3D堆叠组件（24）也公开了具有独立三维结构（2）的支撑电路部件（1）。

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