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    • 3. 发明申请
    • SUBSTRATE-SUPPORTED CIRCUIT PARTS WITH FREE-STANDING THREE-DIMENSIONAL STRUCTURES
    • 具有自由立体三维结构的基板支持电路部件
    • WO2013087101A8
    • 2013-08-29
    • PCT/EP2011072753
    • 2011-12-14
    • REINHARDT MICROTECH GMBHRUESS KARINKAISER ALEXANDERFEURER ERNSTHOLL BRUNO
    • RUESS KARINKAISER ALEXANDERFEURER ERNSTHOLL BRUNO
    • H01L23/482H01L21/48H01L21/60H01L23/538H01L25/065H05K3/40
    • H01L23/4822B81C1/00095H01L23/5385H01L25/0652H01L25/0655H01L2225/06524H01L2924/0002H01L2924/19107H05K1/0306H05K1/148H05K3/4092H05K2201/0397H01L2924/00
    • In a method of manufacturing a substrate-supported circuit part (1) with a freestanding three-dimensional structure (2), the manufacturing method comprises the steps of: providing a pre-cleaned substrate plate (3); structuring at least one low-adhesion-strength layer (9) on an upper surface (4) of the substrate plate (3); depositing an adhesion layer (10) onto the upper surface (4) of the substrate plate (3) and onto the at least one low-adhesion-strength layer (9); depositing a conducting layer (11) onto the adhesion layer (10); structuring of conductive path material (15) on the conducting layer (11); forming a separating gap (19) between at least one resting substrate portion (20) and at least one removable substrate portion (21) that carries the later free-standing three-dimensional structure (2); and removing the at least one removable substrate portion (21) below the later free-standing three-dimensional structure (2) in the area of the low-adhesion strength layer (9). Manufacturing combinations (23) of substrate-supported circuit parts (1) with a free-standing three-dimensional structure (2) that have been produced with the inventive method and manufacturing 3D stacking assemblies (24) from such combinations (23) of substrate-supported circuit parts (1) with freestanding three-dimensional structures (2) is disclosed as well.
    • 在制造具有独立三维结构(2)的基板支撑电路部分(1)的方法中,所述制造方法包括以下步骤:提供预清洁的基板(3); 在所述基板(3)的上表面(4)上构造至少一个低粘附强度层(9); 在所述基板(3)的上表面(4)上沉积粘附层(10)并且至少一个低粘附强度层(9)上; 在所述粘合层(10)上沉积导电层(11); 在导电层(11)上构造导电路径材料(15); 在至少一个搁置的基底部分(20)和至少一个可移除的基底部分(21)之间形成分离间隙(19),所述至少一个可移除的基底部分(21)承载后来独立的三维结构(2); 以及在所述低粘附强度层(9)的区域中移除所述随后独立的三维结构(2)下方的所述至少一个可移除基板部分(21)。 使用本发明方法制造的具有独立三维结构(2)的基板支撑电路部件(1)的制造组合(23)和从基板的这种组合(23)制造3D堆叠组件(24) 还公开了具有独立三维结构(2)的支撑电路部件(1)。
    • 6. 发明申请
    • SUBSTRATE-SUPPORTED CIRCUIT PARTS WITH FREE-STANDING THREE-DIMENSIONAL STRUCTURES
    • 具有自由站立的三维结构的基板支撑电路部件
    • WO2013087101A1
    • 2013-06-20
    • PCT/EP2011/072753
    • 2011-12-14
    • REINHARDT MICROTECH GMBHRUESS, KarinKAISER, AlexanderFEURER, ErnstHOLL, Bruno
    • RUESS, KarinKAISER, AlexanderFEURER, ErnstHOLL, Bruno
    • H01L23/482H01L25/065H01L21/48H01L23/538H01L21/60H05K3/40
    • H01L23/4822B81C1/00095H01L23/5385H01L25/0652H01L25/0655H01L2225/06524H01L2924/0002H01L2924/19107H05K1/0306H05K1/148H05K3/4092H05K2201/0397H01L2924/00
    • In a method of manufacturing a substrate-supported circuit part (1) with a freestanding three-dimensional structure (2), the manufacturing method comprises the steps of: providing a pre-cleaned substrate plate (3); structuring at least one low-adhesion-strength layer (9) on an upper surface (4) of the substrate plate (3); depositing an adhesion layer (10) onto the upper surface (4) of the substrate plate (3) and onto the at least one low-adhesion-strength layer (9); depositing a conducting layer (11) onto the adhesion layer (10); structuring of conductive path material (15) on the conducting layer (11); forming a separating gap (19) between at least one resting substrate portion (20) and at least one removable substrate portion (21) that carries the later free-standing three-dimensional structure (2); and removing the at least one removable substrate portion (21) below the later free-standing three-dimensional structure (2) in the area of the low-adhesion strength layer (9). Manufacturing combinations (23) of substrate-supported circuit parts (1) with a free-standing three-dimensional structure (2) that have been produced with the inventive method and manufacturing 3D stacking assemblies (24) from such combinations (23) of substrate-supported circuit parts (1) with freestanding three-dimensional structures (2) is disclosed as well.
    • 在制造具有独立立体结构(2)的基板支撑电路部件(1)的方法中,所述制造方法包括以下步骤:提供预清洁的基板(3) ); 在所述衬底板(3)的上表面(4)上构造至少一个低粘附强度层(9); 在所述衬底板(3)的上表面(4)上和所述至少一个低粘附强度层(9)上沉积粘附层(10); 将导电层(11)沉积到粘附层(10)上; 导电层(11)上的导电路径材料(15)的结构化; 在至少一个搁置的基底部分(20)和携带后来的自立式三维结构(2)的至少一个可移除的基底部分(21)之间形成分离间隙(19); 以及在低粘附强度层(9)的区域中去除后面的自立式三维结构(2)下面的至少一个可去除的基底部分(21)。 基板支撑电路部件(1)与用本发明方法制造的独立三维结构(2)的制造组合(23)以及由这种基板组合(23)制造3D堆叠组件(24) 也公开了具有独立三维结构(2)的支撑电路部件(1)。
    • 9. 发明申请
    • DEVICE FOR DYNAMICALLY STORING OBJECTS
    • 设备技术动态存储对象
    • WO2005073113A3
    • 2005-12-08
    • PCT/EP2005000942
    • 2005-02-01
    • KRONES AGKRONSEDER VOLKERHUMELE HEINZHAUSLADEN WOLFGANGKAISER ALEXANDER
    • KRONSEDER VOLKERHUMELE HEINZHAUSLADEN WOLFGANGKAISER ALEXANDER
    • B65G17/38B65G21/18B65G47/51
    • B65G47/5122B65G17/385B65G21/18B65G2201/0247B65G2207/24
    • The invention relates to a device (V) for dynamically storing objects (G) along a conveyor belt (F) between an input station (E) and an output station (A). Said device comprises a continuous, flexible conveying means (1) which is divided in a variable manner into a conveying strand (1a) and a slack strand (1b), at least one slide (2) which can be displaced in the conveyor plane and which is used to modify the storing capacity, said slide comprising a first deviation (3) for the conveyor strand and a second deviation for the slack strand, in addition to a first drive device (7) for the conveyor means in the region of the input station and a second drive device (8) for the conveyor means in the region of the output station. According to the invention, the conveyor means comprise grippers (9) for the objects, said grippers being arranged over the entire length thereof and at regular intervals, and also comprise a link chain (12) which is fitted with rotatable guide rollers (10, 11, 25, 73) which at least partially runs in at least one stationary guide rail (13, 14). At least one guide roller is arranged in a displaceable manner on the respective link chain (23).
    • 在用于沿一个输入站(E)和一个输出工位(A)具有环形柔性传送装置(1)在传送链(1a)和之间的输送路径(F)动态地存储物品(G)的装置(V) 返回链(1B)是可变的分割,具有至少一个可移动的搬运台车(2)的平面内,用于改变存储容量,其具有用于输送元件和空链的第二偏转的第一偏转(3),以及(第一驱动装置 7),用于输送装置在输入站的区域和一个第二驱动装置(8),用于输送在规定的物品输出站,输送机在其整个长度以相等的间隔与夹持器(9)的面积是指,具有输送装置一个具有可转动的 导辊(10,11,25,73)放养环链(12),其至少在至少一个固定区域 Ñ导轨(13,14)运行,至少一个导辊可移动地布置在相应的链节(23)上。
    • 10. 发明申请
    • VORRICHTUNG ZUM DYNAMISCHEN SPEICHERN VON GEGENSTÄNDEN
    • 设备技术动态存储对象
    • WO2005073113A2
    • 2005-08-11
    • PCT/EP2005/000942
    • 2005-02-01
    • KRONES AGKRONSEDER, VolkerHUMELE, HeinzHAUSLADEN, WolfgangKAISER, Alexander
    • KRONSEDER, VolkerHUMELE, HeinzHAUSLADEN, WolfgangKAISER, Alexander
    • B65G47/51
    • B65G47/5122B65G17/385B65G21/18B65G2201/0247B65G2207/24
    • Bei einer Vorrichtung zum dynamischen Speichern von Gegenständen entlang einer Förderstrecke zwischen einer Eingangsstation und einer Ausgangsstation mit einem endlosen, flexiblen Fördermittel, das in ein Fördertrum und ein Leertrum variabel unterteilt ist, mit mindestens einem in der Förderebene verfahrbaren Schlitten zur Veränderung der Speicherkapazität, der eine erste Umlenkung für das Fördertrum und eine zweite Umlenkung für das Leertrum aufweist, sowie mit einer ersten Antriebseinrichtung für das Fördermittel im Bereich der Eingangsstation und einer zweiten Antriebseinrichtung für das Fördermittel im Bereich der Ausgangsstation, ist das Fördermittel über seine gesamte Länge in gleichen Abständen mit Greifern für die Gegenstände versehen und weist das Fördermittel eine mit drehbaren Führungsrollen bestückte Gliederkette auf, die zumindest bereichsweise in mindestens einer stationären Führungsschiene läuft, wobei mindestens eine Führungsrolle beweglich am jeweiligen Kettenglied angeordnet ist.
    • 在用于在搬运台车的平面中动态地存储物品沿一个输入站和具有环形柔性输送机,其在输送运行和返回链划分可变输出站之间的传送路径,与至少一个可移动的用于改变的存储容量的装置 具有用于输送元件和空链的第二偏转第一重定向,以及用于在输入工位的输送机和在输出站的输送器的第二驱动装置的第一驱动装置,以相等的间隔与夹持器的输送器在其整个长度 规定的物品和所述传送装置包括配备有环链可旋转的导辊,其在至少一个固定导轨,至少一个导辊运行至少部分可移动上 每个链节被布置。