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1. 发明授权

US06777267B2 Die singulation using deep silicon etching 失效
公开(公告)号：US06777267B2
公开(公告)日：2004-08-17
申请号：US10286729
申请日：2002-11-01
申请人： Richard C. Ruby , Frank S. Geefay , Cheol Hyun Han , Qing Gan , Andrew T. Barfknecht
发明人： Richard C. Ruby , Frank S. Geefay , Cheol Hyun Han , Qing Gan , Andrew T. Barfknecht
IPC分类号： H01L2144
CPC分类号： H01L21/6836 , H01L21/50 , H01L21/78 , H01L2221/68327
摘要： A method for separating dies on a wafer includes etching channels around the dies on a first side of the wafer, mounting the first side of the wafer to a quartz plate with an UV adhesive, and grinding a second side of the wafer until the channels are exposed on the second side of the wafer. At this point, the dies are separated but held together by the UV adhesive on the quartz plate. The method further includes mounting a second side of the wafer to a tack tape, exposing UV radiation through the quartz plate to the UV adhesive. At this point, the UV adhesive looses its adhesion so the dies are held together by the tack tape. The method further includes dismounting the quartz plate from the first side of the wafer and picking up the individual dies from the tack tape.

2. 发明授权

US06777263B1 Film deposition to enhance sealing yield of microcap wafer-level package with vias 失效
标题翻译：薄膜沉积，以提高具有通孔的微型晶圆级封装的密封产量
公开(公告)号：US06777263B1
公开(公告)日：2004-08-17
申请号：US10647040
申请日：2003-08-21
申请人： Qing Gan , Richard C. Ruby , Frank S. Geefay , Andrew T. Barfknecht
发明人： Qing Gan , Richard C. Ruby , Frank S. Geefay , Andrew T. Barfknecht
IPC分类号： H01L2144
CPC分类号： B81C1/00269 , H01L21/50
摘要： A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first wafer with a first seal ring around the device and a second seal ring around a via contact. The method further includes forming a trench in the second wafer around the first seal ring, filling the trench and the via contact with a sealing agent, patterning a topside of the second wafer to removed the excessive sealing agent and to expose a contact pad of the via contact, and singulating a die around the first seal ring.
摘要翻译：一种用于形成晶片封装的方法，包括形成管芯结构，其中管芯结构包括第一晶片，安装在第一晶片上的器件，安装在第一晶片顶部的第二晶片，具有围绕器件的第一密封环，第二密封环绕通道接触。所述方法还包括在所述第二晶片周围形成沟槽，围绕所述第一密封环，用密封剂填充所述沟槽和所述通孔接触，图案化所述第二晶片的顶侧以除去所述过量的密封剂并露出所述第二晶片的接触垫通过接触，并且围绕第一密封环分开模具。

3. 发明授权

US08102044B2 Bonded wafer structure and method of fabrication 失效
标题翻译：粘合晶片结构和制造方法
公开(公告)号：US08102044B2
公开(公告)日：2012-01-24
申请号：US12254536
申请日：2008-10-20
申请人： Richard C. Ruby , James P. Roland , Frank S. Geefay
发明人： Richard C. Ruby , James P. Roland , Frank S. Geefay
IPC分类号： H01L23/12 , H01L21/00
CPC分类号： H03H9/0547 , B81B2201/0271 , B81C1/00333 , B81C2203/0118 , B81C2203/032 , H01L21/187 , H01L23/10 , H01L2924/0002 , H03H9/1014 , H01L2924/00
摘要： A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.
摘要翻译：包装电子器件的方法包括提供第一晶片并提供第二晶片。该方法还包括在第一晶片的表面上沉积聚合物材料; 并且从第一晶片选择性地去除聚合物的一部分以在聚合物中产生空隙。该方法还包括将第一晶片放置在第二晶片上并与聚合物接触; 并固化聚合物以将第一晶片结合到第二晶片。还描述了接合晶片结构。

4. 发明授权

US07422929B2 Wafer-level packaging of optoelectronic devices 有权
标题翻译：晶圆级封装的光电器件
公开(公告)号：US07422929B2
公开(公告)日：2008-09-09
申请号：US11071550
申请日：2005-03-02
申请人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
发明人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01S5/02288 , G02B6/4206 , H01L2924/0002 , H01S5/02248 , H01S5/02292 , H01L2924/00
摘要： In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.
摘要翻译：在一个实施例中，本发明提供了一种用于形成晶片级封装的方法。在第一晶片上形成接合焊盘。在形成接合焊盘之后，光电子器件位于第一晶片上。在第二晶片上形成垫圈。在第二晶片上形成垫圈之后，第二晶片通过垫片和焊盘之间的接合附接到第一晶片。

5. 发明授权

US06953990B2 Wafer-level packaging of optoelectronic devices 有权
标题翻译：晶圆级封装的光电器件
公开(公告)号：US06953990B2
公开(公告)日：2005-10-11
申请号：US10666363
申请日：2003-09-19
申请人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
发明人： Kendra J. Gallup , Frank S. Geefay , Ronald Shane Fazzio , Martha Johnson , Carrie Ann Guthrie , Tanya Jegeris Snyder , Richard C. Ruby
IPC分类号： H01L23/02 , B81B7/00 , B81C3/00 , G02B6/42 , H01L21/00 , H01L21/46 , H01L21/60 , H01L23/495 , H01L31/0203 , H01L31/0232 , H01L33/00 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/026
CPC分类号： H01S5/02288 , G02B6/4206 , H01L2924/0002 , H01S5/02248 , H01S5/02292 , H01L2924/00
摘要： A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.
摘要翻译：晶片级封装包括第一晶片，其包括接合焊盘，第一晶片上的光电器件，以及包括垫片的第二晶片。第二晶片通过垫圈和接合垫之间的接合附接到第一晶片。

6. 发明授权

US06265246B1 Microcap wafer-level package 有权
标题翻译：微型晶圆级封装
公开(公告)号：US06265246B1
公开(公告)日：2001-07-24
申请号：US09359844
申请日：1999-07-23
申请人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
发明人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
IPC分类号： H01L2144
CPC分类号： B81C1/00301 , B81B2207/07 , B81C1/00484 , H01L2224/48463 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist, semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.
摘要翻译：提供了一种微型晶片级封装，其中微型器件连接到基片上的焊盘。基底晶片上的外围焊盘包围接合焊盘和微型器件。盖晶片使用厚的光致抗蚀剂，半导体光刻工艺在其上形成垫圈。接合垫垫片与焊盘的周长相匹配，外围衬垫垫片与基底晶片上的外围焊盘相匹配。孔位于接合垫垫片的周边内，并且形成在盖晶片中的预定深度。然后将盖晶片放置在基底晶片上，以将焊垫冷却焊接到焊盘，并在焊盘垫片和外围焊盘垫圈之间形成气密密封的体积。然后将盖晶片减薄到预定深度以下，直到阱变成通孔，其提供对封装内的接合焊盘的访问，但是在气密密封的体积外部，用于从微器件利用系统连接引线。

7. 发明授权

US06429511B2 Microcap wafer-level package 有权
公开(公告)号：US06429511B2
公开(公告)日：2002-08-06
申请号：US09969432
申请日：2001-10-01
申请人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
发明人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
IPC分类号： H01L2348
CPC分类号： B81C1/00301 , B81B2207/095 , H01L2224/48463 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.

8. 发明授权

US06376280B1 Microcap wafer-level package 失效
标题翻译：微型晶圆级封装
公开(公告)号：US06376280B1
公开(公告)日：2002-04-23
申请号：US09415284
申请日：1999-10-08
申请人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
发明人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
IPC分类号： H01L2144
CPC分类号： B81C1/00301 , B81B2207/07 , B81C1/00484 , H01L2224/48463 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.
摘要翻译：提供了一种微型晶片级封装，其中微型器件连接到基片上的焊盘。基底晶片上的外围焊盘包围接合焊盘和微型器件。盖晶片使用厚的光致抗蚀剂半导体光刻工艺在其上形成垫圈。接合垫垫片与焊盘的周长相匹配，外围衬垫垫片与基底晶片上的外围焊盘相匹配。孔位于接合垫垫片的周边内，并且形成在盖晶片中的预定深度。然后将盖晶片放置在基底晶片上，以将焊盘冷却焊接到焊盘，并在焊盘垫片和外围焊盘垫圈之间形成气密密封的体积。然后将盖晶片减薄到预定深度以下，直到阱变成通孔，其提供对封装内的接合焊盘的访问，但是在气密密封的体积外部，用于从微器件利用系统连接导线。

9. 发明授权

US06228675B1 Microcap wafer-level package with vias 有权
标题翻译：微孔晶圆级封装带通孔
公开(公告)号：US06228675B1
公开(公告)日：2001-05-08
申请号：US09360859
申请日：1999-07-23
申请人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
发明人： Richard C. Ruby , Tracy E. Bell , Frank S. Geefay , Yogesh M. Desai
IPC分类号： H01L2144
CPC分类号： B81B7/007 , H01L23/04 , H01L23/055 , H01L23/10 , H01L23/481 , H01L24/05 , H01L24/48 , H01L2224/04042 , H01L2224/05083 , H01L2224/05093 , H01L2224/05096 , H01L2224/05109 , H01L2224/05138 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/0603 , H01L2224/48463 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/30105 , H01L2224/45099 , H01L2924/00
摘要： A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer is processed to form wells of a predetermined depth in the cap wafer. A conductive material is made integral with the walls of the wells in the cap wafer. The cap wafer has contacts and a peripheral gasket formed thereon where the contacts are capable of being aligned with the bonding pads on the base wafer, and the gasket matches the peripheral pad on the base wafer. The cap wafer is then placed over the base wafer so as to bond the contact and gasket to the pads and form a hermetically sealed volume within the peripheral gasket. The cap wafer is thinned to form a “microcap”. The microcap is thinned below the predetermined depth until the semiconductor dopant is exposed to become conductive vias through the cap wafer to outside the hermetically sealed volume.
摘要翻译：提供了一种微型晶片级封装，其中微型器件连接到基片上的焊盘。基底晶片上的外围焊盘包围接合焊盘和微型器件。处理盖晶片以在盖晶片中形成预定深度的阱。导电材料与盖晶片中的阱的壁成一体。封盖晶片具有形成在其上的触点和外围垫圈，其中触点能够与基底晶片上的接合焊盘对准，并且垫圈与基底晶片上的外围焊盘匹配。然后将盖晶片放置在基底晶片上，以将接触垫片和垫圈粘合到垫上，并在外围垫圈内形成气密密封的体积。盖晶片变薄以形成“微帽”。微帽在预定深度之下变薄，直到半导体掺杂剂暴露成通过盖晶片的导电通孔到密封体积外部。

10. 发明申请

US20080283944A1 PHOTOSTRUCTURABLE GLASS MICROELECTROMECHANICAL (MEMs) DEVICES AND METHODS OF MANUFACTURE 审中-公开
标题翻译：可光致发光玻璃微电子（MEMs）器件及其制造方法
公开(公告)号：US20080283944A1
公开(公告)日：2008-11-20
申请号：US11750606
申请日：2007-05-18
申请人： Frank S. Geefay
发明人： Frank S. Geefay
IPC分类号： H01L29/84 , H01L21/324
CPC分类号： B81C1/00595 , B81B2201/0271 , B81C2203/0109
摘要： A Film Bulk Acoustic (FBA) MEMS device in a wafer level package including a photostructurable glass material and methods of manufacture are described.
摘要翻译：描述了包括可光固化玻璃材料和制造方法的晶片级封装中的薄膜体积声（FBA）MEMS器件。

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