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    • 1. 发明申请
    • CURVILINEAR CAMERA LENS AS MONITOR COVER PLATE
    • CURVILINEAR相机镜头作为监视器盖板
    • WO2012037201A3
    • 2012-05-31
    • PCT/US2011051525
    • 2011-09-14
    • QUALCOMM MEMS TECHNOLOGIES INCCHUI CLARENCEGROB MATTHEW S
    • CHUI CLARENCEGROB MATTHEW S
    • G02B13/00G03B17/00G06F3/042
    • G03B17/00G02B26/001G03B15/00
    • Disclosed are various implementations of a camera lens that can be positioned between a display device and a user viewing the display device. The camera lens can be transparent to allow such viewing by the user, and also be configured to capture light rays from the user and turn such rays to an imaging sensor to form an image of the user. Such turning of light rays can be achieved by curved features formed on the camera lens. In some implementations, the camera lens is a substantially flat layer having such curved features. Various examples of the curved features are disclosed. Also disclosed are systems and methods for enhancing the image of the user in situations where a portion of a display being viewed is captured by the camera lens and combines with the image of the user.
    • 公开了可以位于显示设备和观看显示设备的用户之间的相机镜头的各种实现。 照相机镜头可以是透明的,以允许用户观看,并且还可被配置为捕获来自用户的光线并将这种光线转发到成像传感器以形成用户的图像。 这种光线的转动可以通过在相机镜头上形成的弯曲特征来实现。 在一些实施方案中,相机透镜是具有这种弯曲特征的基本平坦的层。 公开了各种曲面特征的例子。 还公开了用于在由相机镜头捕获正在观看的显示器的一部分并与用户的图像组合的情况下增强用户的图像的系统和方法。
    • 4. 发明申请
    • METHOD FOR PACKAGING AN OPTICAL MEMS DEVICE
    • 封装光学MEMS器件的方法
    • WO2007149475A3
    • 2008-06-05
    • PCT/US2007014359
    • 2007-06-19
    • QUALCOMM MEMS TECHNOLOGIES INCKHONSARI NASSIMCHUI CLARENCE
    • KHONSARI NASSIMCHUI CLARENCE
    • B81C1/00
    • B81C1/00269B81B2201/047B81C2203/0109B81C2203/019B81C2203/032
    • A microelectromechanical systems device (730) having a transparent substrate (710) joined to a planar backplate (720) with a raised perimeter structure (740a) forming a recessed cavity or cell (780). The raised perimeter structure (740a) is formed by applying a first layer (740a) around the peripheral area of the backplate (720) to form a recessed cell (780). A second layer (740b) is applied over the first layer. The first layer (740a) is thicker than the second layer (740b). The thicker layer (740a) comprises a viscous material. A second layer (740b) is a thinner adhesive layer, and is applied over the thicker layer (740a) to join the backplate (720) to the transparent substrate (710) to encapsulate the microelectromechanical systems device (730) formed on the transparent substrate (710).
    • 具有连接到平面背板(720)的透明衬底(710)的微机电系统装置(730)具有形成凹腔或电池(780)的凸起周边结构(740a)。 凸起的周边结构(740a)通过围绕背板(720)的周边区域施加第一层(740a)以形成凹陷单元(780)而形成。 在第一层上施加第二层(740b)。 第一层(740a)比第二层(740b)厚。 较厚的层(740a)包括粘性材料。 第二层(740b)是更薄的粘合剂层,并且被施加在较厚层(740a)上以将背板(720)连接到透明基板(710)以封装形成在透明基板上的微机电系统装置(730) (710)。