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    • 2. 发明申请
    • HIGH SPEED, LOW POWER SPIN-ORBIT TORQUE (SOT) ASSISTED SPIN-TRANSFER TORQUE MAGNETIC RANDOM ACCESS MEMORY (STT-MRAM) BIT CELL ARRAY
    • 高速,低功率旋转轨道转矩(SOT)辅助自旋转换转矩磁随机存取存储器(STT-MRAM)BIT CELL ARRAY
    • WO2018038849A1
    • 2018-03-01
    • PCT/US2017/043691
    • 2017-07-25
    • QUALCOMM INCORPORATED
    • KAN, Jimmy JiananPARK, ChandoWANG, PeiyuanKIM, SungryulKANG, Seung Hyuk
    • G11C11/16
    • A magnetic random access memory (MRAM) array including several bit cells is described. Each of the bit cells includes a perpendicular magnetic tunnel junction (pMTJ) -a magnetic tunnel junction with perpendicular anisotropy- including a reference layer, a barrier layer supporting the reference layer, and a free layer supporting the barrier layer. A spin-hall conductive material layer supports the free layer. A driver is operable to set a state of at least one of the plurality of bit cells, the driver being configured to simultaneously drive a current along the spin-Hall conductive material to generate via a Spin Hall effect a Spin Orbit Transfer -SOT- current flowing through the pMTJ and drive a further current through the pMTJ and a portion of the spin- hall conductive material layer, the further current generating with the reference layer a Spin-transfer-torque -STT- current through the pMTJ.
    • 描述了包括几个位单元的磁性随机存取存储器(MRAM)阵列。 每个位单元包括垂直磁隧道结(pMTJ) - 具有垂直各向异性的磁隧道结 - 包括参考层,支撑参考层的阻挡层和支撑阻挡层的自由层。 自旋层导电材料层支撑自由层。 驱动器可操作以设置所述多个位单元中的至少一个的状态,所述驱动器被配置为沿着自旋霍尔导电材料同时驱动电流以经由自旋霍尔效应产生自旋轨道传输-SOT-电流 流过pMTJ并驱动另一电流通过pMTJ和自旋霍尔导电材料层的一部分,进一步的电流与参考层一起产生通过pMTJ的自旋转移 - 转矩 - 电流 - 电流。
    • 3. 发明申请
    • METHOD FOR FABRICATING A MAGNETIC TUNNEL JUNCTION
    • 制造磁性隧道结的方法
    • WO2015148059A1
    • 2015-10-01
    • PCT/US2015/018274
    • 2015-03-02
    • QUALCOMM INCORPORATED
    • LI, XiaLEE, KanghoCHEN, Wei-ChuanLU, YuPARK, ChandoKANG, Seung Hyuk
    • H01L43/12
    • H01L43/02G11C11/161H01L27/222H01L27/224H01L43/08H01L43/12
    • An improved magnetic tunnel junction device and methods for fabricating the improved magnetic tunnel junction device are provided. The provided two-etch process reduces etching damage and ablated material redeposition. In an example, provided is a method for fabricating a magnetic tunnel junction (MTJ). The method includes forming a buffer layer on a substrate, forming a bottom electrode on the substrate, forming a pin layer on the bottom electrode, forming a barrier layer on the pin layer, and forming a free layer on the barrier layer. A first etching includes etching the free layer, without etching the barrier layer, the pin layer, and the bottom electrode. The method also includes forming a top electrode on the free layer, as well as forming a hardmask layer on the top electrode. A second etching includes etching the hardmask layer; the top electrode layer, the barrier layer, the pin layer, and the bottom electrode.
    • 提供了一种改进的磁性隧道结装置和用于制造改进的磁性隧道结装置的方法。 所提供的双蚀刻工艺减少蚀刻损伤和烧蚀材料再沉积。 在一个实例中,提供了一种用于制造磁性隧道结(MTJ)的方法。 该方法包括在衬底上形成缓冲层,在衬底上形成底电极,在底电极上形成引脚层,在引脚层上形成阻挡层,并在阻挡层上形成自由层。 第一蚀刻包括蚀刻自由层,而不蚀刻阻挡层,引脚层和底部电极。 该方法还包括在自由层上形成顶部电极,以及在顶部电极上形成硬掩模层。 第二蚀刻包括蚀刻硬掩模层; 顶部电极层,阻挡层,针层和底部电极。
    • 9. 发明申请
    • SHADOW-EFFECT COMPENSATED FABRICATION OF MAGNETIC TUNNEL JUNCTION (MTJ) ELEMENTS
    • 磁悬浮连接(MTJ)元件的阴影补偿制造
    • WO2017027221A1
    • 2017-02-16
    • PCT/US2016/044380
    • 2016-07-28
    • QUALCOMM INCORPORATED
    • CHEN, Wei-ChuanLU, YuPARK, ChandoKANG, Seung, Hyuk
    • H01L43/08H01L43/12
    • H01L43/12H01L27/222H01L43/02H01L43/08
    • Shadow-effect compensated fabrication of magnetic tunnel junction (MTJ) semiconductor elements is disclosed. Providing shadow-effect compensated fabrication of MTJ elements can provide reduced free layer sizing for enhanced MTJ operational margin. In certain aspects, to reduce size of a free layer during fabrication of an MTJ to provide enhanced write and retention symmetry, ion beam etching (IBE) fabrication process is employed to fabricate a free layer smaller than the pinned layer. To avoid asymmetrical footing being fabricated in free layer due to shadow-effect of neighboring MTJs, an ion beam directed at the MTJ is shadow-effect compensated. The angle of incidence of the ion beam directed at the MTJ is varied as the MTJ is rotated to be less steep when another MTJ is in directional line of the ion beam and the MTJ being fabricated. Thus, the free layer is etched more uniformly in the MTJ while avoiding increased etching damage.
    • 公开了磁隧道结(MTJ)半导体元件的阴影效应补偿制造。 提供影子补偿制造的MTJ元件可以提供减少的自由层施胶,以提高MTJ的运行裕度。 在某些方面,为了减少制造MTJ期间的自由层的尺寸以提供增强的写入和保持对称性,使用离子束蚀刻(IBE)制造工艺来制造小于被钉扎层的自由层。 为了避免由于相邻的MTJ的阴影效应而在自由层中制造不对称的基脚,指向MTJ的离子束是阴影效应补偿的。 当MTJ在离子束的方向线和制造的MTJ的方向线上时,指向MTJ的离子束的入射角度随着MTJ旋转而不太陡峭而变化。 因此,在MTJ中更均匀地蚀刻自由层,同时避免增加蚀刻损伤。