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    • 2. 发明授权
    • Non-volatile memory cells with selectively formed floating gate
    • 具有选择性形成的浮动栅极的非易失性存储单元
    • US06777741B2
    • 2004-08-17
    • US10393603
    • 2003-03-19
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • H01L29788
    • H01L27/11521H01L27/115
    • Non-volatile memory transistors are provided that include a floating gate formed from first and second layers of material such as polysilicon. The second floating gate layer is selectively grown or deposited on top of the first gate layer, eliminating the need to mask for positioning of the second floating gate layer. The memory transistors are separated by isolation regions. The second floating gate layer overlaps portions of the isolation regions to provide a high control gate-to-floating gate coupling ratio. The process enables smaller memory transistors. Floating gate to isolation overlap, and therefore floating gate to floating gate spacing, is controlled by selective deposition or selective epitaxial growth of the second polysilicon layer.
    • 提供了非易失性存储晶体管,其包括由第一和第二层材料(例如多晶硅)形成的浮置栅极。 第二浮栅层选择性地生长或沉积在第一栅极层的顶部上,消除了对第二浮栅层定位的掩模的需要。 存储晶体管由隔离区域分隔开。 第二浮栅层与隔离区域的一部分重叠以提供高控制栅 - 浮栅耦合比。 该过程使更小的存储晶体管。 浮栅为隔离重叠,因此浮栅为浮栅间隔,通过第二多晶硅层的选择性沉积或选择性外延生长来控制。
    • 3. 发明授权
    • Method of forming a non-volatile memory cell using off-set spacers
    • 使用偏置间隔物形成非易失性存储单元的方法
    • US08288219B2
    • 2012-10-16
    • US12052374
    • 2008-03-20
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • H01L21/8238
    • H01L27/11526H01L21/823418H01L21/823468H01L27/105H01L27/11546H01L29/42324
    • A stack of two polysilicon layers is formed over a semiconductor body region. A DDD implant is performed to form a DDD source region in the semiconductor body region along a source side of the polysilicon stack but not along a drain side of the polysilicon stack. Off-set spacers are formed along opposing side-walls of the polysilicon stack. A source/drain implant is performed to form a drain region in the semiconductor body region along the drain side of the polysilicon stack and to form a highly doped region within the DDD source region such that the extent of an overlap between the polysilicon stack and each of the drain region and the highly doped region is inversely dependent on a thickness of the off-set spacers, and a lateral spacing directly under the polysilicon stack between adjacent edges of the DDD source region and the highly doped region is directly dependent on the thickness of the off-set spacers.
    • 在半导体主体区域上形成一叠两层多晶硅层。 执行DDD注入以在半导体主体区域中沿着多晶硅堆叠的源极侧形成DDD源极区域,但不沿着多晶硅叠层的漏极侧。 偏移间隔物沿着多晶硅堆叠的相对侧壁形成。 进行源极/漏极注入以沿着多晶硅堆叠的漏极侧在半导体主体区域中形成漏极区域,并且在DDD源极区域内形成高度掺杂的区域,使得多晶硅堆叠和每个 漏极区域和高掺杂区域的反向取决于偏置间隔物的厚度,并且在DDD源极区域和高度掺杂区域的相邻边缘之间直接在多晶硅堆叠下面的横向间隔直接取决于厚度 的偏置间隔物。
    • 4. 发明授权
    • Method of forming transistors with ultra-short gate feature
    • 具有超短栅极特性的晶体管形成方法
    • US07202134B2
    • 2007-04-10
    • US11022005
    • 2004-12-21
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • H01L21/336
    • H01L27/11526H01L21/823418H01L21/823468H01L27/105H01L27/11546H01L29/42324
    • A gate electrode is formed over but insulated from a semiconductor body region for each of first and second transistors. A DDD implant is carried out to from DDD source and DDD drain regions in the body region for the first transistor. After the DDD implant, off-set spacers are formed along side-walls of the gate electrode of each of the first and second transistors. After forming the off-set spacers, a LDD implant is carried out to from LDD source and drain regions in the body region for the second transistor. After the LDD implant, main spacers are formed adjacent the off-set spacers of at least the second transistor. After forming the main spacers, a source/drain implant is carried out to form a highly doped region within each of the DDD drain and source regions and the LDD drain and source regions.
    • 对于第一和第二晶体管中的每一个,栅电极形成在半导体本体区域的绝缘上。 从DDD源和DDD漏极区域对第一晶体管进行DDD注入。 在DDD植入之后,沿着第一和第二晶体管的每一个的栅电极的侧壁形成偏置间隔物。 在形成偏置间隔物之后,从第二晶体管的体区中的LDD源极和漏极区域执行LDD注入。 在LDD注入之后,主间隔物形成在至少第二晶体管的偏置间隔物附近。 在形成主间隔物之后,进行源极/漏极注入以在每个DDD漏极和源极区域以及LDD漏极和源极区域内形成高掺杂区域。
    • 6. 发明授权
    • Transistor with ultra-short gate feature and method of fabricating the same
    • 具有超短栅极特性的晶体管及其制造方法
    • US06746906B2
    • 2004-06-08
    • US09808097
    • 2001-03-13
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • Peter RabkinHsingya Arthur WangKai-Cheng Chou
    • H01L21265
    • H01L27/11526H01L21/823418H01L21/823468H01L27/105H01L27/11546H01L29/42324
    • In one embodiment of the present invention, a method of forming semiconductor transistors includes: forming a gate electrode over but insulated from a semiconductor body region; forming off-set spacers along side-walls of the gate electrode; and after forming said off-set spacers, forming a source region and a drain region in the body region so that the extent of an overlap between the gate electrode and each of the source and drain regions is dependent on a thickness of the off-set spacers. In another embodiment, a method of forming a non-volatile memory cell includes: forming a first polysilicon layer over but insulated from a semiconductor body region; forming a second polysilicon layer over but insulated from the first polysilicon layer; forming an off-set spacer along at least one side-wall of the first and second polysilicon layers; and after forming said off-set spacer, forming at least one of source and drain regions in the body region so that the extent of an overlap between the first polysilicon layer and said one of source and drain regions is dependent on a thickness of the off-set spacer.
    • 在本发明的一个实施例中,形成半导体晶体管的方法包括:在半导体本体区域上形成绝缘的栅电极; 沿着栅电极的侧壁形成偏置间隔物; 并且在形成所述偏置间隔物之后,在体区域中形成源极区域和漏极区域,使得栅极电极和源极区域和漏极区域中的每一个之间的重叠程度取决于偏移的厚度 间隔物 在另一个实施例中,形成非易失性存储单元的方法包括:在半导体本体区域之上形成绝缘的第一多晶硅层; 在第一多晶硅层上形成第二多晶硅层,但与第一多晶硅层绝缘; 沿着所述第一和第二多晶硅层的至少一个侧壁形成偏置间隔物; 并且在形成所述偏置间隔物之后,在体区中形成源区和漏区中的至少一个,使得第一多晶硅层与所述源极和漏极区之间的重叠程度取决于关闭的厚度 设置间隔。