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    • 1. 发明授权
    • Ultrasonic laminating of materials for ink jet printheads
    • 用于喷墨打印头的材料的超声层压
    • US08919915B2
    • 2014-12-30
    • US13401178
    • 2012-02-21
    • Peter J. NystromMark A. CelluraBijoyraj Sahu
    • Peter J. NystromMark A. CelluraBijoyraj Sahu
    • B41J2/01
    • B41J2/1621B32B27/34B32B2310/028B41J2/161B41J2002/14403
    • A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
    • 用于组装诸如喷墨打印头的打印头的方法可以包括使用超声波接合工艺将两个或更多个打印头层粘合在一起。 在一个实施例中,超声波频率被引导到第一层和第二层之间的界面,以在界面处产生热量。 在一个实施例中,热量熔化第一层和第二层中的至少一层,并且将层冷却以固化熔融层。 在另一个实施例中,使用超声频率产生的热量固化在第一层和第二层之间的粘合剂层。 所描述的超声波层压方法可以产生流体密封,其在基于粘合剂的方法上需要较少的处理时间和材料。
    • 4. 发明申请
    • BONDED SILICON STRUCTURE FOR HIGH DENSITY PRINT HEAD
    • 用于高密度打印头的粘结硅结构
    • US20130120505A1
    • 2013-05-16
    • US13293235
    • 2011-11-10
    • Peter J. NystromBijoyraj Sahu
    • Peter J. NystromBijoyraj Sahu
    • B41J2/045H01L21/306
    • B41J2/1629B41J2/161B41J2/1631B41J2/1642B41J2/1646B41J2002/14241
    • A print head including a jet stack can be formed using semiconductor device manufacturing techniques. A blanket metal layer, a blanket piezoelectric element layer, and a blanket conductive layer can be formed over a semiconductor substrate such as a semiconductor wafer or wafer section. The piezoelectric element layer and the blanket conductive layer can be patterned to provide a plurality of transducer piezoelectric elements and top electrodes respectively, while the metal layer forms a bottom electrode for the plurality of transducers. Subsequently, the semiconductor substrate can be patterned to form a body plate for the print head jet stack. Forming a print head jet stack using semiconductor device manufacturing techniques can provide a high resolution device with small feature sizes.
    • 可以使用半导体器件制造技术形成包括喷射堆叠的打印头。 可以在诸如半导体晶片或晶片部分的半导体衬底上形成覆盖金属层,覆盖层压电元件层和覆盖层导电层。 压电元件层和覆盖层导电层可以被图案化以分别提供多个换能器压电元件和顶电极,而金属层形成用于多个换能器的底电极。 随后,可以对半导体衬底进行图案化以形成用于打印头喷射叠层的主体板。 使用半导体器件制造技术形成打印头喷射堆叠可以提供具有小特征尺寸的高分辨率设备。
    • 6. 发明授权
    • High density electrical interconnect for printing devices using flex circuits and dielectric underfill
    • 使用柔性电路和电介质底层填料的印刷设备的高密度电气互连
    • US08585187B2
    • 2013-11-19
    • US13097182
    • 2011-04-29
    • Peter J. NystromGary D. ReddingMark A. Cellura
    • Peter J. NystromGary D. ReddingMark A. Cellura
    • B41J2/045H01L41/22
    • B41J2/14233B41J2002/14491
    • A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.
    • 用于形成喷墨打印头的方法可以包括将多个压电元件附接到喷射堆叠子组件的隔膜,将柔性电路电连接到多个压电元件,然后在柔性电路和喷射之间分配电介质底部填充物 堆栈子组件。 在安装柔性电路之后使用底部填料消除了从压电元件的顶部图案化去除间隙材料的需要,并且消除了对图案化间隔层的要求。 在一个实施例中,柔性电路和压电元件之间的电接触通过柔性电路的凸起电极与压电元件之间的物理接触来建立,而不使用单独的导体,从而消除了由于误插入引起的电气短路的可能性 指挥