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1. 发明授权

US08556611B2 Method for interstitial polymer planarization using a flexible flat plate 有权
标题翻译：使用柔性平板的间隙聚合物平面化方法
公开(公告)号：US08556611B2
公开(公告)日：2013-10-15
申请号：US13165785
申请日：2011-06-21
申请人： Bryan R. Dolan , Peter J. Nystrom , Gary D. Redding , Mark A. Cellura , John R. Andrews
发明人： Bryan R. Dolan , Peter J. Nystrom , Gary D. Redding , Mark A. Cellura , John R. Andrews
IPC分类号： B29C43/20
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14362
摘要： A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.
摘要翻译：一种用于形成具有电介质间隙层的喷墨打印头的方法和结构。可以使用连接到压机的柔性顶板来对未固化的介质间隙层施加压力。在将未固化的介质间隙层与柔性顶板接触并使用压机施加压力的同时固化未固化的介质间隙层。已经发现使用柔性顶板而不是刚性顶板在压电元件阵列上形成固化的间隙层，所述压电元件阵列具有更均匀或平坦的上表面。这样形成的间隙层可以减少处理时间，减少在使用期间喷墨打印头中的墨水通信的问题以及降低的制造成本。

2. 发明申请

US20120328784A1 METHOD FOR INTERSTITIAL POLYMER PLANARIZATION USING A FLEXIBLE FLAT PLATE 有权
标题翻译：使用柔性平板的间隔聚合物平面化方法
公开(公告)号：US20120328784A1
公开(公告)日：2012-12-27
申请号：US13165785
申请日：2011-06-21
申请人： Bryan R. Dolan , Peter J. Nystrom , Gary D. Redding , Mark A. Cellura , John R. Andrews
发明人： Bryan R. Dolan , Peter J. Nystrom , Gary D. Redding , Mark A. Cellura , John R. Andrews
IPC分类号： B05D3/10 , B29C35/02
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14362
摘要： A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.
摘要翻译：一种用于形成具有电介质间隙层的喷墨打印头的方法和结构。可以使用连接到压机的柔性顶板来对未固化的介质间隙层施加压力。在将未固化的介质间隙层与柔性顶板接触并使用压机施加压力的同时固化未固化的介质间隙层。已经发现使用柔性顶板而不是刚性顶板在压电元件阵列上形成固化的间隙层，所述压电元件阵列具有更均匀或平坦的上表面。这样形成的间隙层可以减少处理时间，减少在使用期间喷墨打印头中的墨水通信的问题以及降低的制造成本。

3. 发明申请

US20130147881A1 POLYMER FILM AS AN INTERSTITIAL FILL FOR PZT PRINTHEAD FABRICATION 有权
标题翻译：聚合物膜作为PZT PRINTHEAD制造的间歇填充
公开(公告)号：US20130147881A1
公开(公告)日：2013-06-13
申请号：US13323867
申请日：2011-12-13
申请人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
发明人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
IPC分类号： B41J2/045 , H01L41/22
CPC分类号： B41J2/14233 , B41J2/1603 , B41J2/1623 , B41J2002/14491 , Y10T29/42
摘要： A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.
摘要翻译：用于喷墨打印头的方法和结构，以及包括喷墨打印头的打印机。打印头可以包括作为膜间隔件的聚合物，其将诸如印刷电路板或柔性电路的电互连与打印头隔膜分离，使得膜间隔件插入在电互连和隔膜之间。在一个实施例中，压电致动器不与膜间隔件接触。用于形成打印头的方法的实施例可以具有比一些其它工艺要求更少的制造工具的减少的处理阶段。所得到的打印头和打印机的实施例可以具有比一些其它打印头和打印机更少的结构部件。

4. 发明申请

US20130100212A1 Process for Adding Thermoset Layer to Piezoelectric Printhead 有权
标题翻译：将热固性层添加到压电打印头的工艺
公开(公告)号：US20130100212A1
公开(公告)日：2013-04-25
申请号：US13279778
申请日：2011-10-24
申请人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
发明人： Gary D. Redding , Bryan R. Dolan , Mark A. Cellura , Peter J. Nystrom
IPC分类号： B41J2/045 , B23P17/00
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1634
摘要： Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.
摘要翻译：公开了一种用于制备喷墨打印头的方法，其包括：（a）提供具有多个压电换能器的隔膜板，（b）将具有填充接头的电路板与压电换能器对准并将电路板临时附接到压电换能器，从而形成在隔膜板，压电换能器和电路板之间具有间隙的层叠结构 ; （c）通过填充接头施加热固性聚合物并允许其通过毛细管作用填充间隙空间; 和（d）固化热固性聚合物以形成间隙聚合物层。

5. 发明授权

US08585187B2 High density electrical interconnect for printing devices using flex circuits and dielectric underfill 有权
标题翻译：使用柔性电路和电介质底层填料的印刷设备的高密度电气互连
公开(公告)号：US08585187B2
公开(公告)日：2013-11-19
申请号：US13097182
申请日：2011-04-29
申请人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
发明人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
IPC分类号： B41J2/045 , H01L41/22
CPC分类号： B41J2/14233 , B41J2002/14491
摘要： A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.
摘要翻译：用于形成喷墨打印头的方法可以包括将多个压电元件附接到喷射堆叠子组件的隔膜，将柔性电路电连接到多个压电元件，然后在柔性电路和喷射之间分配电介质底部填充物堆栈子组件。在安装柔性电路之后使用底部填料消除了从压电元件的顶部图案化去除间隙材料的需要，并且消除了对图案化间隔层的要求。在一个实施例中，柔性电路和压电元件之间的电接触通过柔性电路的凸起电极与压电元件之间的物理接触来建立，而不使用单独的导体，从而消除了由于误插入引起的电气短路的可能性指挥

6. 发明申请

US20120274708A1 HIGH DENSITY ELECTRICAL INTERCONNECT FOR PRINTING DEVICES USING FLEX CIRCUITS AND DIELECTRIC UNDERFILL 有权
标题翻译：使用柔性电路和电介质印刷设备的高密度电气互连
公开(公告)号：US20120274708A1
公开(公告)日：2012-11-01
申请号：US13097182
申请日：2011-04-29
申请人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
发明人： Peter J. Nystrom , Gary D. Redding , Mark A. Cellura
IPC分类号： B41J2/045 , H01L41/22
CPC分类号： B41J2/14233 , B41J2002/14491
摘要： A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.
摘要翻译：用于形成喷墨打印头的方法可以包括将多个压电元件附接到喷射堆叠子组件的隔膜，将柔性电路电连接到多个压电元件，然后在柔性电路和喷射之间分配电介质底部填充物堆栈子组件。在安装柔性电路之后使用底部填料消除了从压电元件的顶部图案化去除间隙材料的需要，并且消除了对图案化间隔层的要求。在一个实施例中，柔性电路和压电元件之间的电接触通过柔性电路的凸起电极与压电元件之间的物理接触来建立，而不使用单独的导体，从而消除了由于误插入引起的电气短路的可能性指挥

7. 发明授权

US08646881B1 Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays 有权
标题翻译：间隙材料，以实现高密度压电阵列的鲁棒电气互连
公开(公告)号：US08646881B1
公开(公告)日：2014-02-11
申请号：US13570056
申请日：2012-08-08
申请人： Bryan R. Dolan , Gary D. Redding , Peter J. Nystrom
发明人： Bryan R. Dolan , Gary D. Redding , Peter J. Nystrom
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2002/14491 , B41J2202/11
摘要： An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly.
摘要翻译：一种喷墨打印头，包括在相邻的压电元件之间的间隙区域中的多个支撑层支撑件和形成方法。多个间隔层支撑体可以由与压电元件相同的层，或者由诸如聚合物的电介质层形成。隔离层支撑增加了可以附接隔离层的区域，从而形成诸如柔性电路或印刷电路板的电路层的更安全的附接到喷射堆叠子组件。

8. 发明授权

US08182069B2 Method for modular arrangement of a silicon based array and modular silicon based array 有权
标题翻译：硅基阵列和模块化硅基阵列的模块化布置方法
公开(公告)号：US08182069B2
公开(公告)日：2012-05-22
申请号：US13246170
申请日：2011-09-27
申请人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
发明人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： H01L25/16 , H01L22/20 , H01L25/0655 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要翻译：一种硅基模块，包括：基板; 第一芯片组件，其固定到所述基板，所述第一芯片组件包括第一硅芯片和具有电路的第一驱动器芯片; 以及固定到所述基板的第二芯片组件，所述第二芯片组件包括第二硅芯片和具有电路的第二驱动器芯片。第一和第二芯片组件的部分在基板的纵向方向上排列; 并且所述第一和第二硅芯片的部分在与所述纵向正交的宽度方向上排列。硅基模块的形成方法。

9. 发明申请

US20120018838A1 METHOD FOR MODULAR ARRANGEMENT OF A SILICON BASED ARRAY AND MODULAR SILICON BASED ARRAY 有权
标题翻译：基于硅的阵列和基于模块硅的阵列的模块化布置方法
公开(公告)号：US20120018838A1
公开(公告)日：2012-01-26
申请号：US13246170
申请日：2011-09-27
申请人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
发明人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
IPC分类号： H01L25/00
CPC分类号： H01L25/16 , H01L22/20 , H01L25/0655 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要翻译：一种硅基模块，包括：基板; 第一芯片组件，其固定到所述基板，所述第一芯片组件包括第一硅芯片和具有电路的第一驱动器芯片; 以及固定到所述基板的第二芯片组件，所述第二芯片组件包括第二硅芯片和具有电路的第二驱动器芯片。第一和第二芯片组件的部分在基板的纵向方向上排列; 并且所述第一和第二硅芯片的部分在与所述纵向正交的宽度方向上排列。硅基模块的形成方法。

10. 发明授权

US08087753B2 Method for modular arrangement of a silicon based array and modular silicon based array 有权
公开(公告)号：US08087753B2
公开(公告)日：2012-01-03
申请号：US12689910
申请日：2010-01-19
申请人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
发明人： Mark A. Cellura , Peter J. Nystrom , Scott J. Phillips , John P. Meyers , Lyle G. Dingman , Bryan R. Dolan
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： H01L25/16 , H01L22/20 , H01L25/0655 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

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