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1. 发明申请

US20060273872A1 Power transformer 有权
标题翻译：电力变压器
公开(公告)号：US20060273872A1
公开(公告)日：2006-12-07
申请号：US11141320
申请日：2005-06-01
申请人： Peter Hazucha , Gerhard Schrom , Weimin Shi , Edward Burton , Trang Nguyen , Bradley Bloechel , Mary Bloechel , Tanay Karnik
发明人： Peter Hazucha , Gerhard Schrom , Weimin Shi , Edward Burton , Trang Nguyen , Bradley Bloechel , Mary Bloechel , Tanay Karnik
IPC分类号： H01F30/12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F30/06 , H01F30/12 , H01F2038/006
摘要： A multi-phase transformer is provided that includes a first layer having at least a first planar wire and a second planar wire and a second layer formed on the first layer and having at least a third planar wire and a fourth planar wires. At least the first planar wire and the second planar wire of the first layer to form two transformers with at least two planar wires of the second layer. The multi-phase transformer may also include a coupling device to couple one end of the planar wires of the first layer with one of the planar wires of the second layer.
摘要翻译：提供一种多相变压器，其包括具有至少第一平面线和第二平面线的第一层和形成在第一层上并具有至少第三平面线和第四平面线的第二层的第一层。至少第一层的第一平面线和第二平面线，以形成具有第二层的至少两个平面线的两个变压器。多相变压器还可以包括将第一层的平面线的一端与第二层的平面线之一耦合的耦合装置。

2. 发明申请

US20060044717A1 Control of breakdown voltage for microelectronic packaging 有权
标题翻译：控制微电子封装的击穿电压
公开(公告)号：US20060044717A1
公开(公告)日：2006-03-02
申请号：US10932152
申请日：2004-08-31
申请人： Michael Hill , Weimin Shi
发明人： Michael Hill , Weimin Shi
IPC分类号： H02H9/00
CPC分类号： H01L23/62 , H01L2224/16 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H05K1/026 , H05K1/111 , H05K3/3452 , H05K2201/0989 , H05K2201/10734 , H01L2924/00
摘要： Reduce breakdown voltage and control breakdown path for electrostatic discharge to terminals of microelectronic packages, such as no-connect Land Grid Array (LGA) pads. In one embodiment, solder resist openings with a small separation distance are used to provide an air breakdown path between a no-connect LGA pad and the surrounding metal and to reduce the breakdown voltage. In one implementation, the no-connect pad has a non-round shape with a protruding portion on the dielectric layer. The air surrounding a solder resist opening over the tip of the protruding portion of the no-connect pad and a nearby solder resist opening over the surrounding metal provides a shortest air breakdown path and the lowest breakdown voltage. Alternatively, sharp features (e.g., metal traces) with a minimum separation distance can be arranged pointing at each other under the solder resist layer, or other dielectric layer inside the package, to provide a non-exposed breakdown path.
摘要翻译：降低击穿电压并控制静电放电到微电子封装端子的击穿路径，如无连接焊盘阵列（LGA）焊盘。在一个实施例中，使用具有小间隔距离的阻焊剂开口，以在非连接LGA焊盘和周围金属之间提供空气击穿路径并降低击穿电压。在一种实施方式中，无连接焊盘具有在电介质层上具有突出部分的非圆形形状。围绕在无连接焊盘的突出部分的尖端上的阻焊剂开口的空气和周围金属上的附近的阻焊剂开口提供了最短的击穿路径和最低的击穿电压。或者，可以布置具有最小间隔距离的尖锐特征（例如，金属迹线），其指向彼此下方的阻焊层或封装内的其它介电层，以提供非暴露的击穿路径。

3. 发明授权

US06264476B1 Wire segment based interposer for high frequency electrical connection 有权
标题翻译：用于高频电气连接的基于线段的插入器
公开(公告)号：US06264476B1
公开(公告)日：2001-07-24
申请号：US09457776
申请日：1999-12-09
申请人： Che-yu Li , Matti A. Korhonen , Weimin Shi
发明人： Che-yu Li , Matti A. Korhonen , Weimin Shi
IPC分类号： H01R909
CPC分类号： H01R13/2414 , G01R1/06716 , G01R1/06772 , G01R1/07378 , H01L2924/00013 , H01R12/57 , H05K7/1061 , H01L2224/29099
摘要： An interposer for a land grid array includes a dielectric grid having an array of holes and a resilient, conductive button disposed in one or more of the holes. The button includes an insulating core, a conducting element wound around the insulating core, and an outer shell surrounding the conducting element. The characteristics of the conducting element and the buttons may be chosen such that the contact force and resistance, and compressibility or relaxability of the conductive buttons can be selected within wide limits. Contact areas between the shell and the conducting element urge a substantially corresponding displacement in both the conducting element and the shell when the button is under compression or relaxation. The interposer alternatively can include an insulating sheet and rather than conductive buttons contain conducting elements disposed therein having contact areas with the block. The interposer when positioned between a land grid array and an electrical circuit component can accommodate relatively large nonplanarity between respective mating surfaces of the two interconnected components while establishing and maintaining contact between each conducting element and the opposing contact pads of each component. A high local contact force is produced at each end of the conducting element against an opposing electrical contact or contact pad of a circuit device to establish a good electrical connection with the interposer which thus electrically interconnects the land grid array and the circuit component. The new interposer design is eminently amenable to high frequency and high current applications.
摘要翻译：用于陆地栅格阵列的插入器包括具有孔阵列的电介质栅格和设置在一个或多个孔中的弹性导电按钮。按钮包括绝缘芯，缠绕在绝缘芯上的导电元件和围绕导电元件的外壳。可以选择导电元件和按钮的特征，使得可以在宽范围内选择导电按钮的接触力和电阻以及压缩性或松弛性。当按钮处于压缩或放松状态时，壳体和导电元件之间的接触区域促使导电元件和壳体中的基本对应的位移。插入器可以包括绝缘片，而不是包含设置在其中的具有与块的接触区域的导电元件的导电按钮。当位于平台栅格阵列和电路部件之间时，插入器可以适应相对较大的不平坦度两个相互连接的部件，同时建立和保持每个传导元件与每个部件的相对接触焊盘之间的接触。在导电元件的每个端部处，抵抗电路器件的相对的电接触或接触焊盘产生高的局部接触力，以与内插器建立良好的电连接，从而使电网互连阵列和电路部件。新的内插器设计非常适合高频和高电流应用。

4. 发明授权

US06172895B2 High capacity memory module with built-in-high-speed bus terminations 有权
标题翻译：高容量内存模块，内置高速总线终端
公开(公告)号：US06172895B2
公开(公告)日：2001-01-09
申请号：US09461069
申请日：1999-12-14
申请人： Dirk D. Brown , Weimin Shi , Thomas L. Sly
发明人： Dirk D. Brown , Weimin Shi , Thomas L. Sly
IPC分类号： G11C506
CPC分类号： G11C5/06
摘要： There is a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly to the card. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a mother board or similar structure. A thermal control structure may be placed in the memory module to cool the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.
摘要翻译：存在与高速，阻抗控制的总线一起使用的存储器模块。每个存储卡可以是传统的印刷电路卡，其中存储芯片直接附着在卡上。或者，可以使用由可插拔子模块组装的高密度存储器模块。这些子模块可以临时组装用于测试和/或老化。直接安装在存储卡或存储器模块上的总线终端不需要总线出口连接，可以利用释放的连接容量来解决模块上的额外存储容量。创新的针孔接触系统用于将子模块连接到存储器模块，并且可选地将存储器模块连接到母板或类似结构。可以将热控制结构放置在存储器模块中以冷却增加数量的存储器芯片，以防止过多的热积聚并确保可靠的存储器操作。

5. 发明授权

US07324317B2 Control of breakdown voltage for microelectronic packaging 有权
标题翻译：控制微电子封装的击穿电压
公开(公告)号：US07324317B2
公开(公告)日：2008-01-29
申请号：US10932152
申请日：2004-08-31
申请人： Michael J. Hill , Weimin Shi
发明人： Michael J. Hill , Weimin Shi
IPC分类号： H02H3/22
CPC分类号： H01L23/62 , H01L2224/16 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H05K1/026 , H05K1/111 , H05K3/3452 , H05K2201/0989 , H05K2201/10734 , H01L2924/00
摘要： Reduce breakdown voltage and control breakdown path for electrostatic discharge to terminals of microelectronic packages, such as no-connect Land Grid Array (LGA) pads. In one embodiment, solder resist openings with a small separation distance are used to provide an air breakdown path between a no-connect LGA pad and the surrounding metal and to reduce the breakdown voltage. In one implementation, the no-connect pad has a non-round shape with a protruding portion on the dielectric layer. The air surrounding a solder resist opening over the tip of the protruding portion of the no-connect pad and a nearby solder resist opening over the surrounding metal provides a shortest air breakdown path and the lowest breakdown voltage. Alternatively, sharp features (e.g., metal traces) with a minimum separation distance can be arranged pointing at each other under the solder resist layer, or other dielectric layer inside the package, to provide a non-exposed breakdown path.
摘要翻译：降低击穿电压并控制静电放电到微电子封装端子的击穿路径，如无连接焊盘阵列（LGA）焊盘。在一个实施例中，使用具有小间隔距离的阻焊剂开口，以在非连接LGA焊盘和周围金属之间提供空气击穿路径并降低击穿电压。在一种实施方式中，无连接焊盘具有在电介质层上具有突出部分的非圆形形状。围绕在无连接焊盘的突出部分的尖端上的阻焊剂开口的空气和周围金属上的附近的阻焊剂开口提供了最短的击穿路径和最低的击穿电压。或者，可以布置具有最小间隔距离的尖锐特征（例如，金属迹线），其指向彼此下方的阻焊层或封装内的其它介电层，以提供非暴露的击穿路径。

6. 发明申请

US20050122575A1 Reflective illumination system 失效
标题翻译：反光照明系统
公开(公告)号：US20050122575A1
公开(公告)日：2005-06-09
申请号：US11006089
申请日：2004-12-07
申请人： Clark Pentico , Unsig Min , Weimin Shi
发明人： Clark Pentico , Unsig Min , Weimin Shi
IPC分类号： G03B21/14 , F21S2/00 , F21V13/00 , G02B17/06 , G02B17/08 , G02B27/09 , G02B1/00 , G02B27/10
CPC分类号： G02B17/0605 , G02B19/0023 , G02B19/0033 , G02B19/0047 , G02B27/0905 , G02B27/0977
摘要： This invention discloses a reflective illumination system for supplying an optical radiation beam along a folded path for illuminating a planar object. The system includes a radiation source, and two facing parabolic dish-shaped arrays of parabolic or dished reflectors. Divergent light received from the light source incident on a first of the arrays is reflected as a larger collimated beam comprising plural separated sub-beams. Each of the reflectors or facets from the first array directs one of the sub-beams to a facet on the second array. The second array reflects the light it receives with a substantially uniform intensity onto a rectangular target location.
摘要翻译：本发明公开了一种用于沿折叠路径提供光辐射束以照射平面物体的反射照明系统。该系统包括一个辐射源和两个面向抛物面的抛物面阵列或抛物面反射体。从入射在第一阵列上的光源接收的发散光被反射为包括多个分离的子光束的较大的准直光束。来自第一阵列的每个反射器或小面将一个子光束引导到第二阵列上的刻面。第二阵列将其以大致均匀的强度接收的光反射到矩形目标位置上。

7. 发明授权

US06862184B2 High performance microprocessor power delivery solution using flex connections 有权
标题翻译：高性能微处理器供电解决方案采用柔性连接
公开(公告)号：US06862184B2
公开(公告)日：2005-03-01
申请号：US10185194
申请日：2002-06-27
申请人： Weimin Shi , Zane A. Ball
发明人： Weimin Shi , Zane A. Ball
IPC分类号： G06F1/18 , H05K1/02 , H05K1/14 , H05K1/18 , H05K7/10 , H05K7/20
CPC分类号： G06F1/189 , H01R12/79 , H05K1/0231 , H05K1/0262 , H05K1/141 , H05K1/147 , H05K1/189 , H05K7/1092 , H05K2201/10015 , H05K2201/10689
摘要： An electronic assembly is disclosed which includes a printed circuit board. A computer processor package is centrally positioned on an upper surface of the printed circuit board. A computer processor is positioned on an upper surface of the computer processor package. A first plurality of power delivery components is positioned on an upper surface of the printed circuit board on one side of the computer processor package. One or more additional pluralities of power delivery components may be positioned on the upper surface of the printed circuit board on other sides of the computer processor package. A high frequency current may be routed from one or more of the first and/or additional pluralities of power delivery components over an elongate flex circuit to the computer processor. A series of decoupling capacitors may be coupled to the elongate flex circuit to enhance a transfer of high frequency current over the elongate flex circuit.
摘要翻译：公开了一种电子组件，其包括印刷电路板。计算机处理器封装集中地位于印刷电路板的上表面上。计算机处理器位于计算机处理器封装的上表面上。第一组多个电力输送部件位于计算机处理器封装的一侧上的印刷电路板的上表面上。一个或多个附加的多个电力输送部件可以位于计算机处理器封装的另一侧上的印刷电路板的上表面上。高频电流可以通过细长的柔性电路从一个或多个第一和/或另外多个功率输送部件路由到计算机处理器。一系列去耦电容器可以耦合到细长柔性电路，以增强在细长柔性电路上的高频电流的传递。

8. 发明授权

US06480014B1 High density, high frequency memory chip modules having thermal management structures 有权
标题翻译：具有热管理结构的高密度高频存储器芯片模块
公开(公告)号：US06480014B1
公开(公告)日：2002-11-12
申请号：US09781089
申请日：2001-01-12
申请人： Che-yu Li , Thomas L. Sly , Weimin Shi
发明人： Che-yu Li , Thomas L. Sly , Weimin Shi
IPC分类号： G01R3102
CPC分类号： G11C5/143 , G11C5/00 , H05K1/0203 , H05K1/141 , H05K3/3447 , H05K3/366 , H05K2201/045 , H05K2201/066 , H05K2201/09709 , Y10T29/49004
摘要： The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.
摘要翻译：本发明具有适用于构造高容量，高速计算机存储卡等的超高密度三维电子电路封装。可拆卸的触点系统允许轻松测试和/或老化。存储卡具有适于接收子卡的许多电插座。子卡具有连接到其上的存储器件和沿着至少一个边缘放置的相应数量的电连接器，其适于可拆卸地与存储卡的电插座配合。可拆卸的连接器允许在可选的永久焊接附着之前轻松地返修模块。子卡上安装裸芯片或薄封装，子卡再次使用针/孔技术安装在主板或存储卡上。

9. 发明授权

US5243638A Apparatus and method for generating a plasma x-ray source 失效
标题翻译：用于产生等离子体x射线源的装置和方法
公开(公告)号：US5243638A
公开(公告)日：1993-09-07
申请号：US848205
申请日：1992-03-10
申请人： Hui Wang , Weimin Shi
发明人： Hui Wang , Weimin Shi
IPC分类号： H05G2/00
CPC分类号： H05G2/003 , H05G2/005 , H05G2/008
摘要： A method and apparatus are provided for generating x-ray photon radiation. A liquid cone anode and an extraction electrode spaced therefrom are disposed in a vacuum chamber. The liquid cone anode comprises a liquid material, a reservoir for holding the liquid material having an opening for passage of the liquid material, and a liquid material feeding and cone forming mechanism operatively associated with the reservoir for feeding liquid material through the opening in the reservoir and for forming a liquid cone from the liquid material A power supply is connected to the liquid cone anode and the extraction electrode for creating an electric field therebetween of sufficient strength to cause particles to be extracted from the liquid cone anode to form a plasma ball in the space between the liquid cone anode and the extraction electrode which emits x-ray photon radiation.
摘要翻译：提供了一种用于产生x射线光子辐射的方法和装置。液体锥形阳极和与其分开的提取电极设置在真空室中。液体锥体阳极包括液体材料，用于保持具有用于液体材料通过的开口的液体材料的储存器，以及与储存器可操作地相关联的液体材料供给和锥形成机构，用于通过储存器中的开口供给液体材料并且用于从液体材料形成液体锥体电源连接到液体锥形阳极和引出电极，用于在其间产生足够强度的电场，以使得从液体锥形阳极中提取颗粒以形成等离子体球液体锥形阳极和引出电极之间的空间，其发射x射线光子辐射。

10. 发明授权

US07212347B2 Reflective illumination system 失效
标题翻译：反光照明系统
公开(公告)号：US07212347B2
公开(公告)日：2007-05-01
申请号：US11006089
申请日：2004-12-07
申请人： Clark Pentico , Unsig Min , Weimin Shi
发明人： Clark Pentico , Unsig Min , Weimin Shi
IPC分类号： G02B27/10 , G02B17/00
CPC分类号： G02B17/0605 , G02B19/0023 , G02B19/0033 , G02B19/0047 , G02B27/0905 , G02B27/0977
摘要： This invention discloses a reflective illumination system for supplying an optical radiation beam along a folded path for illuminating a planar object. The system includes a radiation source, and two facing parabolic dish-shaped arrays of parabolic or dished reflectors. Divergent light received from the light source incident on a first of the arrays is reflected as a larger collimated beam comprising plural separated sub-beams. Each of the reflectors or facets from the first array directs one of the sub-beams to a facet on the second array. The second array reflects the light it receives with a substantially uniform intensity onto a rectangular target location.
摘要翻译：本发明公开了一种用于沿折叠路径提供光辐射束以照射平面物体的反射照明系统。该系统包括一个辐射源和两个面向抛物面的抛物面阵列或抛物面反射体。从入射在第一阵列上的光源接收的发散光被反射为包括多个分离的子光束的较大的准直光束。来自第一阵列的每个反射器或小面将一个子光束引导到第二阵列上的刻面。第二阵列将其以大致均匀的强度接收的光反射到矩形目标位置上。

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