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1. 发明授权

US3970968A Signal modulator apparatus 失效
标题翻译：信号调制装置
公开(公告)号：US3970968A
公开(公告)日：1976-07-20
申请号：US545378
申请日：1975-01-30
申请人： Thomas L. Sly
发明人： Thomas L. Sly
IPC分类号： H03C1/14
CPC分类号： H03C1/14
摘要： Signal modulation apparatus includes a PIN diode network which is fed a carrier signal from a carrier signal source and a modulation signal from modulating current output terminal which receives a modulation current directly from a temperature-compensated constant-current amplifier and a signal via a unity gain amplifier from a reference diode which is also fed from the constant-current amplifier which is adapted to receive a modulating signal.
摘要翻译：信号调制装置包括PIN二极管网络，其从载波信号源馈送载波信号和来自调制电流输出端的调制信号，其直接从温度补偿恒流放大器接收调制电流，并通过单位增益接收信号来自参考二极管的放大器，其也从适于接收调制信号的恒流放大器馈送。

2. 发明授权

US06496380B1 High capacity memory module with high electrical design margins 有权
标题翻译：高容量内存模块，具有高电气设计余量
公开(公告)号：US06496380B1
公开(公告)日：2002-12-17
申请号：US09645859
申请日：2000-08-24
申请人： Che-Yu Li , David A. Lysack , Thomas L. Sly
发明人： Che-Yu Li , David A. Lysack , Thomas L. Sly
IPC分类号： H05K702
CPC分类号： G11C5/06 , G11C5/04 , H05K1/0231 , H05K1/0233 , H05K1/0246 , H05K1/14 , H05K1/141 , H05K2201/044 , H05K2201/10022
摘要： The present invention features a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly thereto. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed-up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a motherboard or similar structure. A thermal control structure may be placed in the memory module, cooling the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.
摘要翻译：本发明的特征在于与高速，阻抗控制的总线一起使用的存储器模块。每个存储卡可以是具有与其直接连接的存储芯片的常规印刷电路卡。或者，可以使用由可插拔子模块组装的高密度存储器模块。这些子模块可以临时组装用于测试和/或老化。直接安装在存储卡或存储器模块上的总线终端消除了对总线出口连接的需要，允许释放连接容量来解决模块上的额外存储容量。创新的针孔接触系统用于将子模块连接到存储器模块，并且可选地将存储器模块连接到主板或类似结构。可以将热控制结构放置在存储器模块中，冷却更多数量的存储器芯片以防止过多的热量积聚并确保可靠的存储器操作。

3. 发明授权

US06172895B2 High capacity memory module with built-in-high-speed bus terminations 有权
标题翻译：高容量内存模块，内置高速总线终端
公开(公告)号：US06172895B2
公开(公告)日：2001-01-09
申请号：US09461069
申请日：1999-12-14
申请人： Dirk D. Brown , Weimin Shi , Thomas L. Sly
发明人： Dirk D. Brown , Weimin Shi , Thomas L. Sly
IPC分类号： G11C506
CPC分类号： G11C5/06
摘要： There is a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly to the card. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a mother board or similar structure. A thermal control structure may be placed in the memory module to cool the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.
摘要翻译：存在与高速，阻抗控制的总线一起使用的存储器模块。每个存储卡可以是传统的印刷电路卡，其中存储芯片直接附着在卡上。或者，可以使用由可插拔子模块组装的高密度存储器模块。这些子模块可以临时组装用于测试和/或老化。直接安装在存储卡或存储器模块上的总线终端不需要总线出口连接，可以利用释放的连接容量来解决模块上的额外存储容量。创新的针孔接触系统用于将子模块连接到存储器模块，并且可选地将存储器模块连接到母板或类似结构。可以将热控制结构放置在存储器模块中以冷却增加数量的存储器芯片，以防止过多的热积聚并确保可靠的存储器操作。

4. 发明授权

US4405895A Angle digitizing method 失效
标题翻译：角度数字化方法
公开(公告)号：US4405895A
公开(公告)日：1983-09-20
申请号：US272489
申请日：1981-06-11
申请人： Carl W. Gerst , Leonard J. Paciorek , Thomas L. Sly
发明人： Carl W. Gerst , Leonard J. Paciorek , Thomas L. Sly
IPC分类号： H03M1/00 , G01R25/00
CPC分类号： H03M1/34
摘要： An angle digitizer receives signal representing the sine and cosine of the angle to be digitized. The voltages are fed to orthogonal pairs of input terminals. Between each two input terminals is a set of equivalued resistors to form a resistor ring. At the junction of each pair of resistors is an output terminal. Each pair of output terminals is connected to the input terminals of a signal amplitude comparator which compares the magnitude of the signals at its inputs to give a digital signal in accordance with which is greater. For each comparator the output terminals of the resistor ring are selected such that the signals are in a direct antiphase relationship. An odd set of the comparators is activated first followed by the activation of the even set. Thereafter the binary output values of the comparators are interleaved to form a full digital word which is then tested to see if it is a valid digital word.
摘要翻译：角度数字转换器接收表示要数字化的角度的正弦和余弦的信号。电压被馈送到正交的输入端子对。在每个两个输入端之间是一组等效电阻器以形成电阻环。在每对电阻的结点处是输出端子。每一对输出端子连接到信号幅度比较器的输入端，信号幅度比较器的输入端比较其输入端的信号幅值，以给出根据其大的数字信号。对于每个比较器，选择电阻环的输出端子使得信号处于直接反相关系。首先激活一组奇偶比较器，然后启动偶数组。此后，比较器的二进制输出值被交织以形成完整的数字字，然后对其进行测试以查看其是否是有效的数字字。

5. 发明授权

US06480014B1 High density, high frequency memory chip modules having thermal management structures 有权
标题翻译：具有热管理结构的高密度高频存储器芯片模块
公开(公告)号：US06480014B1
公开(公告)日：2002-11-12
申请号：US09781089
申请日：2001-01-12
申请人： Che-yu Li , Thomas L. Sly , Weimin Shi
发明人： Che-yu Li , Thomas L. Sly , Weimin Shi
IPC分类号： G01R3102
CPC分类号： G11C5/143 , G11C5/00 , H05K1/0203 , H05K1/141 , H05K3/3447 , H05K3/366 , H05K2201/045 , H05K2201/066 , H05K2201/09709 , Y10T29/49004
摘要： The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.
摘要翻译：本发明具有适用于构造高容量，高速计算机存储卡等的超高密度三维电子电路封装。可拆卸的触点系统允许轻松测试和/或老化。存储卡具有适于接收子卡的许多电插座。子卡具有连接到其上的存储器件和沿着至少一个边缘放置的相应数量的电连接器，其适于可拆卸地与存储卡的电插座配合。可拆卸的连接器允许在可选的永久焊接附着之前轻松地返修模块。子卡上安装裸芯片或薄封装，子卡再次使用针/孔技术安装在主板或存储卡上。

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