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    • 1. 发明申请
    • METHOD OF REDUCING CORRECLATED COUPLING BETWEEN NETS
    • 减少网络之间校正耦合的方法
    • US20070226673A1
    • 2007-09-27
    • US11277541
    • 2006-03-27
    • Peter HabitzWilliam Livingstone
    • Peter HabitzWilliam Livingstone
    • G06F17/50
    • G06F17/5077G06F17/5081
    • Disclosed are embodiments of an interconnection array for a circuit. The interconnection array comprises a victim net that is positioned parallel to and adjacent to sections of multiple crossed aggressor nets, thereby, minimizing the exposure of the circuit to delay or false switching as a result of coupling capacitance. Also, disclosed are embodiments of an associated method of re-routing an interconnection array that incorporates identifying a victim net and at least two aggressor nets and crossing the aggressor nets so that sections of multiple aggressor nets are positioned parallel to and adjacent to the victim net in order to minimizes the impact of coupling capacitance on the victim net with minimal changes to the wiring environment.
    • 公开了用于电路的互连阵列的实施例。 互连阵列包括被平行于和相邻于多个交叉侵入网络的部分定位的受害网络,从而最小化电路由于耦合电容而导致的延迟或假开关的暴露。 还公开了一种重新路由互连阵列的相关联的方法的实施例,该互连阵列包括识别受害网和至少两个攻击者网并且横穿攻击网,使得多个攻击者网的部分平行于并邻近受害网 以便最小化耦合电容对受害网络的影响,同时对接线环境进行最小的改变。
    • 2. 发明申请
    • Forming statistical model of independently variable parameters for timing analysis
    • 形成时间分析独立变量参数的统计模型
    • US20070055487A1
    • 2007-03-08
    • US11219205
    • 2005-09-02
    • Peter HabitzMark LasherWilliam Livingstone
    • Peter HabitzMark LasherWilliam Livingstone
    • G06F17/50
    • G06F17/5022
    • Forming of a statistical model for a set of independently variable parameters for analysis of a circuit design is disclosed. In one embodiment, a method includes establishing a timing model including delay and delay changes due to process parameter variations (Pi) that impact timing; selecting an element of the circuit design that dominates circuit delay in the timing model; determining a delay sensitivity of each of a set of derived process parameters (Vj) for the element that are linear combinations of the process parameter variations (Pi); and selecting only those derived process parameters with a high sensitivity for use in the statistical model. The invention simplifies the statistical model and reduces the number of calculations require for timing analysis. A method of performing a timing analysis using the simplified statistical model is also disclosed.
    • 公开了一组用于电路设计分析的独立可变参数的统计模型的形成。 在一个实施例中,一种方法包括建立包括由于影响定时的过程参数变化(Pi)引起的延迟和延迟变化的定时模型; 选择在时序模型中支配电路延迟的电路设计元素; 确定作为所述过程参数变化(Pi)的线性组合的所述元素的一组导出过程参数(Vj)中的每一个的延迟灵敏度; 并仅选择具有高灵敏度的衍生过程参数用于统计模型。 本发明简化了统计模型,并减少了时序分析所需的计算次数。 还公开了使用简化统计模型执行定时分析的方法。
    • 3. 发明申请
    • ELECTROMIGRATION CHECK OF SIGNAL NETS USING NET CAPACITANCE TO EVALUATE THERMAL CHARACTERISTICS
    • 使用网络电容对信号网进行电气检查来评估热特性
    • US20050102117A1
    • 2005-05-12
    • US10605990
    • 2003-11-12
    • Peter Habitz
    • Peter Habitz
    • G06F15/00G06F17/50
    • G06F17/5036
    • A method for performing an electromigration check and detecting EM problems in a device or circuit. The method uses the capacitance and resistance of the conductors of the device or circuit as parameters in determining a power limit that maintains a required temperature environment that ensures the reliability of the device or circuit. The parameters of resistance and capacitance can be determined for the device or circuit through the use of commercially available device data or simulation and analysis tools. The power limit is then used to check each device interconnect to identify the location of potential EM problems. Corrective action is taken to avoid EM problems as they are detected in the device or circuit.
    • 一种用于执行电迁移检查和检测装置或电路中的EM问题的方法。 该方法使用器件或电路的导体的电容和电阻作为确定功率限制的参数,维持所需的温度环境,以确保器件或电路的可靠性。 可以通过使用市售设备数据或仿真和分析工具来确定器件或电路的电阻和电容参数。 然后使用功率限制来检查每个设备互连以识别潜在EM问题的位置。 采取纠正措施以避免在设备或电路中检测到EM问题。
    • 5. 发明申请
    • METHOD OF GENERATING WIRING ROUTES WITH MATCHING DELAY IN THE PRESENCE OF PROCESS VARIATION
    • 在过程变化存在下产生匹配延迟的接线方法
    • US20060248488A1
    • 2006-11-02
    • US10908102
    • 2005-04-27
    • Peter HabitzDavid HathawayJerry HayesAnthony Polson
    • Peter HabitzDavid HathawayJerry HayesAnthony Polson
    • G06F17/50
    • G06F17/5077
    • A method and service of balancing delay in a circuit design begins with nodes that are to be connected together by a wiring design, or by being supplied with an initial wiring design that is to be altered. The wiring design will have many wiring paths, such as a first wiring path, a second wiring path, etc. Two or more of the wiring paths are designed to have matching timing, such that the time needed for a signal to travel along the first wiring path is about the same time needed for a signal to travel along the second wiring path, the third path, etc. The method/service designs one or all of the wiring paths to make the paths traverse wire segments of about the same length and orientation, within each wiring level that the first wiring path and the second wiring path traverse. Also, this process makes the first wiring path and the second wiring path traverse the wire segments in the same order, within each wiring level that the first wiring path and the second wiring path traverse.
    • 电路设计中的平衡延迟的方法和服务从通过布线设计连接在一起的节点开始,或通过提供要被改变的初始布线设计。 布线设计将具有许多布线路径,例如第一布线路径,第二布线路径等。两条或多条布线路径被设计成具有匹配的定时,使得信号沿着第一布线路径行进所需的时间 信号沿着第二布线路径,第三路径等移动所需的大致相同的时间。该方法/服务设计一个或所有布线路径,以使路径穿过大约相同长度的线段,并且 在第一布线路径和第二布线路径横越的各布线层内。 此外,该处理使得第一布线路径和第二布线路径在第一布线路径和第二布线路径横越的各布线层内以相同的顺序横穿线段。
    • 6. 发明申请
    • PRIORTIZING OF NETS FOR COUPLED NOISE ANALYSIS
    • 联网噪声分析网络优化
    • US20060248485A1
    • 2006-11-02
    • US10908101
    • 2005-04-27
    • Eric ForemanPeter HabitzGregory Schaeffer
    • Eric ForemanPeter HabitzGregory Schaeffer
    • G06F17/50
    • G06F17/5031
    • A system and method of performing microelectronic chip timing analysis, wherein the method comprises identifying failing timing paths in a chip; prioritizing the failing timing paths in the chip according to a size of random noise events occurring in each timing path; attributing a slack credit statistic for all but highest order random noise events occurring in each timing path; and calculating a worst case timing path scenario based on the prioritized failing timing paths and the slack credit statistic. Preferably, the random noise events comprise non-clock events. Moreover, the random noise events may comprise victim/aggressor net groups belonging to different regularity groups. Preferably, the size of random noise events comprises coupled noise delta delays due to the random noise events occurring in the chip.
    • 一种执行微电子芯片定时分析的系统和方法,其中所述方法包括识别芯片中的故障定时路径; 根据每个定时路径中发生的随机噪声事件的大小对芯片中的故障定时路径进行优先级排序; 归因于每个定时路径中发生的所有但最高阶随机噪声事件的松弛信用统计; 以及基于优先顺序的故障定时路径和松弛信用统计量来计算最坏情况的定时路径情景。 优选地,随机噪声事件包括非时钟事件。 此外,随机噪声事件可以包括属于不同规则组的受害者/侵略者网络组。 优选地,由于芯片中发生的随机噪声事件,随机噪声事件的大小包括耦合的噪声增量延迟。
    • 8. 发明申请
    • METHOD AND APPARATUS FOR MANUFACTURING DIAMOND SHAPED CHIPS
    • 用于制造金刚石型材的方法和装置
    • US20080018872A1
    • 2008-01-24
    • US11865728
    • 2007-10-01
    • Robert AllenJohn CohnScott GouldPeter HabitzJuergen KoehlGustavo TellezIvan WemplePaul Zuchowski
    • Robert AllenJohn CohnScott GouldPeter HabitzJuergen KoehlGustavo TellezIvan WemplePaul Zuchowski
    • G03B27/42
    • H01L27/0207
    • In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.
    • 在第一方面中,用于对晶片上的芯片进行成像的本发明的装置包括具有多个倾斜侧面的组合金刚石芯片图像和切口图像。 组合的金刚石芯片图像和切口图像包括金刚石芯片图像,其包括与金刚石芯片图像的至少一个对角线平行的多个芯片图像行,并且包括与金刚石芯片图像相邻的切痕图像。 切口图像包括平行于金刚石切片图像的至少一个对角线的至少一个切痕图像行。 该装置还包括从组合的金刚石片图像和切痕图像延伸到步进器的曝光场的至少周边的阻挡材料。 在第二方面,成像装置包括n侧多边形组合芯片图像和切口图像。 还提供了制造芯片的创造性方法和根据本发明方法制造的晶片。
    • 9. 发明申请
    • METHOD FOR RETICLE SHAPES ANALYSIS AND CORRECTION
    • 用于形式分析和校正的方法
    • US20070061771A1
    • 2007-03-15
    • US11162586
    • 2005-09-15
    • Peter HabitzDavid HathawayJerry HayesAnthony PolsonTad Wilder
    • Peter HabitzDavid HathawayJerry HayesAnthony PolsonTad Wilder
    • G06F17/50
    • G03F1/36
    • A method for reticle design correction and electrical parameter extraction of a multi-cell reticle design. The method including: selecting a subset of cell designs of a multi-cell reticle design, each cell design of the subset of cell designs having a corresponding shape to process, for each cell design of the subset of cell designs determining a respective cell design location of the corresponding shape; determining a common shapes processing rule for all corresponding shapes of each cell design based on the respective cell design locations of each of the corresponding shapes; and performing shapes processing of the corresponding shape only of a single cell design of the subset of cell designs to generate resulting data for the subset of cell designs. Also a computer usable medium including computer readable program code having an algorithm adapted to implement the method for reticle design correction and electrical extraction.
    • 一种多光栅掩模版设计的掩模版设计校正和电参数提取的方法。 该方法包括:选择多小区掩模版设计的小区设计的子集,小区设计子集的每个小区设计具有相应的处理形状,用于确定相应小区设计位置的小区设计子集的每个小区设计 的相应形状; 基于每个相应形状的相应单元设计位置,确定每个单元设计的所有对应形状的共同形状处理规则; 以及仅对单元设计的子集的单个单元设计执行相应形状的形状处理,以生成用于所述单元设计的子集的结果数据。 还有一种包括计算机可读程序代码的计算机可用介质,其具有适于实现掩模版设计校正和电提取的方法的算法。