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1. 发明申请

US20060232770A1 Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool 有权
公开(公告)号：US20060232770A1
公开(公告)日：2006-10-19
申请号：US11366108
申请日：2006-03-01
申请人： Paul Sullivan , George Kren , Rodney Smedt , Hans Hansen , David Shortt , Daniel Kavaldjiev , Christopher Bevis
发明人： Paul Sullivan , George Kren , Rodney Smedt , Hans Hansen , David Shortt , Daniel Kavaldjiev , Christopher Bevis
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01R31/2656 , G01R31/2831
摘要： A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.

2. 发明授权

US08494802B2 Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer 有权
标题翻译：计算机实现的方法，计算机可读介质和用于确定晶片的一个或多个特性的系统
公开(公告)号：US08494802B2
公开(公告)日：2013-07-23
申请号：US13000013
申请日：2009-06-19
申请人： Haiguang Chen , Daniel Kavaldjiev , Louis Vintro , George Kren
发明人： Haiguang Chen , Daniel Kavaldjiev , Louis Vintro , George Kren
IPC分类号： G06F19/00
CPC分类号： G01N21/9501 , G06T7/001 , G06T2207/30148
摘要： Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.
摘要翻译：提供了计算机实现的方法，计算机可读介质和用于确定晶片的一个或多个特性的系统。

3. 发明申请

US20100208272A1 METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE 有权
标题翻译：用于测量基板的形状或厚度信息的方法和装置
公开(公告)号：US20100208272A1
公开(公告)日：2010-08-19
申请号：US12388487
申请日：2009-02-18
申请人： Shouhong Tang , George Kren , Dieter Mueller , Brian Haas , Daniel Kavaldjiev
发明人： Shouhong Tang , George Kren , Dieter Mueller , Brian Haas , Daniel Kavaldjiev
IPC分类号： G01B11/02
CPC分类号： G01B9/02021 , G01B9/02027 , G01B9/02057 , G01B9/02072 , G01B9/0209 , G01B11/306
摘要： An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.
摘要翻译：干涉仪系统和方法可用于测量衬底厚度或形状。该系统可以包括两个间隔开的参考平面，其具有在两个平行参考表面之间形成光腔。衬底保持器可以被配置为将衬底放置在空腔中，其中第一和第二衬底表面基本上平行于相应的第一和第二参考表面，使得第一或第二衬底表面之间的空间距离相应的一个参考表面或阻尼表面。干涉仪装置可以位于空腔的径向相对的两侧并与之光耦合。干涉仪可以分别通过经由干涉仪装置光耦合到腔体的光的干涉来映射衬底表面和参考表面之间的间隔的变化。

4. 发明授权

US08068234B2 Method and apparatus for measuring shape or thickness information of a substrate 有权
标题翻译：用于测量衬底的形状或厚度信息的方法和装置
公开(公告)号：US08068234B2
公开(公告)日：2011-11-29
申请号：US12388487
申请日：2009-02-18
申请人： Shouhong Tang , George Kren , Dieter Mueller , Brian Haas , Daniel Kavaldjiev
发明人： Shouhong Tang , George Kren , Dieter Mueller , Brian Haas , Daniel Kavaldjiev
IPC分类号： G01B11/02
CPC分类号： G01B9/02021 , G01B9/02027 , G01B9/02057 , G01B9/02072 , G01B9/0209 , G01B11/306
摘要： An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.
摘要翻译：干涉仪系统和方法可用于测量衬底厚度或形状。该系统可以包括两个间隔开的参考平面，其具有在两个平行参考表面之间形成光腔。衬底保持器可以被配置为将衬底放置在空腔中，其中第一和第二衬底表面基本上平行于相应的第一和第二参考表面，使得第一或第二衬底表面之间的空间距离相应的一个参考表面或阻尼表面。干涉仪装置可以位于空腔的径向相对的两侧并与之光耦合。干涉仪可以分别通过经由干涉仪装置光耦合到腔体的光的干涉来映射衬底表面和参考表面之间的间隔的变化。

5. 发明申请

US20110196639A1 COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS FOR DETERMINING ONE OR MORE CHARACTERISTICS OF A WAFER 有权
标题翻译：计算机实现方法，计算机可读介质和用于确定一个或多个特征的系统
公开(公告)号：US20110196639A1
公开(公告)日：2011-08-11
申请号：US13000013
申请日：2009-06-19
申请人： Haiguang Chen , Daniel Kavaldjiev , Louis Vintro , George Kren
发明人： Haiguang Chen , Daniel Kavaldjiev , Louis Vintro , George Kren
IPC分类号： G06F19/00
CPC分类号： G01N21/9501 , G06T7/001 , G06T2207/30148
摘要： Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.
摘要翻译：提供了计算机实现的方法，计算机可读介质和用于确定晶片的一个或多个特性的系统。

6. 发明授权

US07436505B2 Computer-implemented methods and systems for determining a configuration for a light scattering inspection system 有权
标题翻译：用于确定光散射检查系统的配置的计算机实现的方法和系统
公开(公告)号：US07436505B2
公开(公告)日：2008-10-14
申请号：US11278624
申请日：2006-04-04
申请人： Alexander Belyaev , Daniel Kavaldjiev , Amith Murali , Aleksey Petrenko , Mike D. Kirk , David Shortt , Brian L. Haas , Kurt L. Haller
发明人： Alexander Belyaev , Daniel Kavaldjiev , Amith Murali , Aleksey Petrenko , Mike D. Kirk , David Shortt , Brian L. Haas , Kurt L. Haller
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.
摘要翻译：提供了用于确定光散射检查系统的配置的计算机实现的方法和系统。一种计算机实现的方法包括：通过在检查系统的散射半球上的光散射检查系统来确定用于样本获取的数据和样本上的潜在缺陷的信噪比值的三维图。该方法还包括基于三维图确定散射半球的一个或多个部分，其中信噪比值高于散射半球的其它部分。此外，该方法包括基于散射半球的一个或多个部分来确定检查系统的检测子系统的配置。

7. 发明申请

US20070229809A1 Computer-Implemented Methods and Systems for Determining a Configuration for a Light Scattering Inspection System 有权
标题翻译：用于确定光散射检查系统的配置的计算机实现的方法和系统
公开(公告)号：US20070229809A1
公开(公告)日：2007-10-04
申请号：US11278624
申请日：2006-04-04
申请人： Alexander Belyaev , Daniel Kavaldjiev , Amith Murali , Aleksey Petrenko , Mike Kirk , David Shortt , Brian Haas , Kurt Haller
发明人： Alexander Belyaev , Daniel Kavaldjiev , Amith Murali , Aleksey Petrenko , Mike Kirk , David Shortt , Brian Haas , Kurt Haller
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： Computer-implemented methods and systems for determining a configuration for a light scattering inspection system are provided. One computer-implemented method includes determining a three-dimensional map of signal-to-noise ratio values for data that would be acquired for a specimen and a potential defect on the specimen by the light scattering inspection system across a scattering hemisphere of the inspection system. The method also includes determining one or more portions of the scattering hemisphere in which the signal-to-noise ratio values are higher than in other portions of the scattering hemisphere based on the three-dimensional map. In addition, the method includes determining a configuration for a detection subsystem of the inspection system based on the one or more portions of the scattering hemisphere.
摘要翻译：提供了用于确定光散射检查系统的配置的计算机实现的方法和系统。一种计算机实现的方法包括：通过在检查系统的散射半球上的光散射检查系统来确定用于样本获取的数据和样本上的潜在缺陷的信噪比值的三维图。该方法还包括基于三维图确定散射半球的一个或多个部分，其中信噪比值高于散射半球的其它部分。此外，该方法包括基于散射半球的一个或多个部分来确定检查系统的检测子系统的配置。

8. 发明申请

US20080018887A1 METHODS AND SYSTEMS FOR DETECTING PINHOLES IN A FILM FORMED ON A WAFER OR FOR MONITORING A THERMAL PROCESS TOOL 有权
标题翻译：用于检测形成在膜上的薄膜或用于监测热过程工具的方法和系统
公开(公告)号：US20080018887A1
公开(公告)日：2008-01-24
申请号：US11751970
申请日：2007-05-22
申请人： David Chen , Andrew Steinbach , Daniel Kavaldjiev , Alexander Belyaev , Juergen Reich
发明人： David Chen , Andrew Steinbach , Daniel Kavaldjiev , Alexander Belyaev , Juergen Reich
IPC分类号： G01N21/00
CPC分类号： G01N21/894 , G01N21/47 , G01N21/55 , G01N21/9501 , G01N21/956 , G01N2021/4735 , G01N2021/8822 , G03F7/7065
摘要： Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.
摘要翻译：提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应来自晶片的光产生输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。输出包括上述第一和第二输出。在生成输出之前，通过热处理工具处理晶片。该方法还包括使用第二输出来监测热处理工具。

9. 发明申请

US20130016346A1 Wafer Inspection 有权
标题翻译：晶圆检验
公开(公告)号：US20130016346A1
公开(公告)日：2013-01-17
申请号：US13544954
申请日：2012-07-09
申请人： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak
发明人： Anatoly Romanovsky , Ivan Maleev , Daniel Kavaldjiev , Yury Yuditsky , Dirk Woll , Stephen Biellak
IPC分类号： G01N21/956
CPC分类号： G01N21/9501 , G01N21/47 , G01N21/8806 , G01N21/8851 , G01N21/956
摘要： Systems configured to inspect a wafer are provided.
摘要翻译：提供了配置用于检查晶片的系统。

10. 发明授权

US07528944B2 Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool 有权
标题翻译：用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统
公开(公告)号：US07528944B2
公开(公告)日：2009-05-05
申请号：US11751970
申请日：2007-05-22
申请人： David Chen , Andrew Steinbach , Daniel Kavaldjiev , Alexander Belyaev , Juergen Reich
发明人： David Chen , Andrew Steinbach , Daniel Kavaldjiev , Alexander Belyaev , Juergen Reich
IPC分类号： G01N21/00
CPC分类号： G01N21/894 , G01N21/47 , G01N21/55 , G01N21/9501 , G01N21/956 , G01N2021/4735 , G01N2021/8822 , G03F7/7065
摘要： Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool are provided. One method for detecting pinholes in a film formed on a wafer includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. This method also includes detecting the pinholes in the film formed on the wafer using the second output. One method for monitoring a thermal process tool includes generating output responsive to light from a wafer using an inspection system. The output includes the first and second output described above. The wafer was processed by the thermal process tool prior to generating the output. The method also includes monitoring the thermal process tool using the second output.
摘要翻译：提供了用于检测在晶片上形成的膜中的针孔或用于监测热处理工具的方法和系统。用于检测形成在晶片上的膜中的针孔的一种方法包括使用检查系统响应于来自晶片的光而产生输出。输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。该方法还包括使用第二输出来检测在晶片上形成的膜中的针孔。用于监测热处理工具的一种方法包括响应来自使用检查系统的晶片的光产生输出。输出包括上述第一和第二输出。在生成输出之前，通过热处理工具处理晶片。该方法还包括使用第二输出来监测热处理工具。

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