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    • 1. 发明授权
    • Ultrashort pulse laser deposition of thin films
    • 超短脉冲激光沉积薄膜
    • US06372103B1
    • 2002-04-16
    • US09568617
    • 2000-05-10
    • Michael D. PerryPaul S. BanksBrent C. Stuart
    • Michael D. PerryPaul S. BanksBrent C. Stuart
    • C23C1434
    • C23C14/28B23K26/0624C23C14/0605
    • Short pulse PLD is a viable technique of producing high quality films with properties very close to that of crystalline diamond. The plasma generated using femtosecond lasers is composed of single atom ions with no clusters producing films with high Sp3/Sp2 ratios. Using a high average power femtosecond laser system, the present invention dramatically increases deposition rates to up to 25 &mgr;m/hr (which exceeds many CVD processes) while growing particulate-free films. In the present invention, deposition rates is a function of laser wavelength, laser fluence, laser spot size, and target/substrate separation. The relevant laser parameters are shown to ensure particulate-free growth, and characterizations of the films grown are made using several diagnostic techniques including electron energy loss spectroscopy (EELS) and Raman spectroscopy.
    • 短脉冲PLD是生产具有非常接近结晶金刚石的性能的高质量薄膜的可行技术。 使用飞秒激光器产生的等离子体由单个原子离子组成,没有产生具有高Sp3 / Sp2比率的膜的簇。 使用高平均功率的飞秒激光系统,当生长无颗粒的膜时,本发明显着地将沉积速率提高到高达25mum / hr(其超过许多CVD工艺)。 在本发明中,沉积速率是激光波长,激光能量密度,激光光斑尺寸和靶/衬底分离的函数。 显示相关的激光参数以确保无颗粒生长,并且使用包括电子能量损失光谱(EELS)和拉曼光谱学的几种诊断技术来制备生长的膜的表征。
    • 3. 发明授权
    • Laser machining of explosives
    • 激光加工炸药
    • US6150630A
    • 2000-11-21
    • US62078
    • 1998-04-17
    • Michael D. PerryBrent C. StuartPaul S. BanksBooth R. MyersJoseph A. Sefcik
    • Michael D. PerryBrent C. StuartPaul S. BanksBooth R. MyersJoseph A. Sefcik
    • B23K26/00B23K26/06B23K26/12B23K26/18B23K26/36B23K26/38B23K26/40C06B21/00F42B33/00H01S3/00
    • C06B21/0033B23K26/0624B23K26/12B23K26/127B23K26/18B23K26/382B23K26/402F42B33/008B23K2203/05G02F2001/392H01S3/0057
    • The invention consists of a method for machining (cutting, drilling, sculpting) of explosives (e.g., TNT, TATB, PETN, RDX, etc.). By using pulses of a duration in the range of 5 femtoseconds to 50 picoseconds, extremely precise and rapid machining can be achieved with essentially no heat or shock affected zone. In this method, material is removed by a nonthermal mechanism. A combination of multiphoton and collisional ionization creates a critical density plasma in a time scale much shorter than electron kinetic energy is transferred to the lattice. The resulting plasma is far from thermal equilibrium. The material is in essence converted from its initial solid-state directly into a fully ionized plasma on a time scale too short for thermal equilibrium to be established with the lattice. As a result, there is negligible heat conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond a few microns from the laser machined surface. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces. There is no detonation or deflagration of the explosive in the process and the material which is removed is rendered inert.
    • 本发明包括一种用于加工(切割,钻孔,雕刻)爆炸物(例如TNT,TATB,PETN,RDX等)的方法。 通过使用持续时间在5飞秒至50皮秒范围内的脉冲,可以在基本上没有受热或冲击影响的区域实现非常精确和快速的机械加工。 在这种方法中,通过非热机制去除材料。 多光子和碰撞电离的组合在比电子动能转移到晶格更短的时间尺度上产生临界密度等离子体。 所得到的等离子体远离热平衡。 该材料本质上从其初始固态直接转化为完全离子化的等离子体,其时间尺度太短而不能与晶格建立。 结果,除去区域之外的热传导可忽略不计,导致对激光加工表面超过几微米的材料的热应力或冲击可忽略不计。 等离子体的流体动力学膨胀不需要任何辅助技术去除材料并产生极高质量的加工表面。 在该过程中爆炸物没有爆炸或爆燃,被除去的物质变得惰性。
    • 4. 发明授权
    • Aberration-free, all-reflective laser pulse stretcher
    • 无反射,全反射激光脉冲担架
    • US5960016A
    • 1999-09-28
    • US869345
    • 1997-06-05
    • Michael D. PerryPaul S. BanksBrent C. StuartScott N. Fochs
    • Michael D. PerryPaul S. BanksBrent C. StuartScott N. Fochs
    • H01S3/00H01S3/1055
    • H01S3/0057
    • An all-reflective pulse stretcher for laser systems employing chirped-pulse amplification enables on-axis use of the focusing mirror which results in ease of use, significantly decreased sensitivity to alignment and near aberration-free performance. By using a new type of diffraction grating which contains a mirror incorporated into the grating, the stretcher contains only three elements: 1) the grating, 2) a spherical or parabolic focusing mirror, and 3) a flat mirror. Addition of a fourth component, a retro-reflector, enables multiple passes of the same stretcher resulting in stretching ratios beyond the current state of the art in a simple and compact design. The pulse stretcher has been used to stretch pulses from 20 fsec to over 600 psec (a stretching ratio in excess of 30,000).
    • 采用啁啾脉冲放大的激光系统的全反射脉冲展宽器能够实现聚焦镜的轴向使用,从而易于使用,显着降低对准灵敏度和近无像差性能。 通过使用包含结合到光栅中的反射镜的新型衍射光栅,担架仅包含三个元件:1)光栅,2)球面或抛物面聚焦镜,以及3)平面镜。 添加第四组件,后向反射器使得能够在简单且紧凑的设计中多次通过相同的拉伸机,导致拉伸比超过现有技术的拉伸比。 已经使用脉冲拉伸器将脉冲从20fsec拉伸到超过600psec(拉伸比超过30,000)。
    • 6. 发明授权
    • Ultrashort pulse laser machining of metals and alloys
    • 超短脉冲激光加工金属和合金
    • US06621040B1
    • 2003-09-16
    • US08859020
    • 1997-05-20
    • Michael D. PerryBrent C. Stuart
    • Michael D. PerryBrent C. Stuart
    • B23K2636
    • B23K26/0665A61B18/20A61B18/26A61B2018/00636A61C1/0046B23K26/032B23K26/0624B23K26/0643B23K26/0648B23K26/18B23K26/40B23K2103/05B23K2103/10B23K2103/30B23K2103/50C06B21/0033
    • The invention consists of a method for high precision machining (cutting, drilling, sculpting) of metals and alloys. By using pulses of a duration in the range of 10 femtoseconds to 100 picoseconds, extremely precise machining can be achieved with essentially no heat or shock affected zone. Because the pulses are so short, there is negligible thermal conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond approximately 0.1-1 micron (dependent upon the particular material) from the laser machined surface. Due to the short duration, the high intensity (>1012 W/cm2) associated with the interaction converts the material directly from the solid-state into an ionized plasma. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces with negligible redeposition either within the kerf or on the surface. Since there is negligible heating beyond the depth of material removed, the composition of the remaining material is unaffected by the laser machining process. This enables high precision machining of alloys and even pure metals with no change in grain structure.
    • 本发明包括金属和合金的高精度加工(切割,钻孔,雕刻)的方法。 通过使用持续时间在10飞秒至100皮秒范围内的脉冲,可以在基本上没有受热或冲击影响的区域实现非常精确的加工。 由于脉冲非常短,所以除去区域之外的热传导可忽略不计,导致材料的热应力可忽略不计或超过激光加工表面的大约0.1-1微米(取决于具体材料)的冲击。 由于持续时间短,与相互作用相关的高强度(> 1012W / cm2)将材料直接从固态转变为电离等离子体。 等离子体的流体动力学膨胀消除了任何辅助技术去除材料和产生极高质量的加工表面的需要,在切口或表面上可忽略不计的再沉积。 由于除了去除材料的深度之外的加热可以忽略不计,剩余材料的组成不受激光加工过程的影响。 这使得能够在不改变晶粒结构的情况下对合金甚至纯金属进行高精度加工。