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1. 发明公开

US20240167739A1 HEAT EXCHANGER FOR CRYOGENIC COOLING APPARATUS 审中-公开
公开(公告)号：US20240167739A1
公开(公告)日：2024-05-23
申请号：US18282636
申请日：2022-02-23
申请人： Oxford Instruments Nanotechnology Tools Limited
发明人： Anthony Matthews
IPC分类号： F25B40/02 , F25B9/12
CPC分类号： F25B40/02 , F25B9/12
摘要： A heat exchanger for a cryogenic cooling apparatus is provided. The heat exchanger has a first conduit, a second conduit and a chamber, wherein the chamber is arranged to receive a fluid from the first conduit, and wherein second conduit is thermally coupled to the outside of the chamber. The chamber has a first region and a second region, the first region separated from the second region by a plate extending through the chamber, the plate comprising one or more apertures for allowing a flow of the fluid from the first region to the second region.

2. 发明授权

US11333404B2 Cryogenic cooling system 有权
公开(公告)号：US11333404B2
公开(公告)日：2022-05-17
申请号：US16441560
申请日：2019-06-14
申请人： Oxford Instruments Nanotechnology Tools Limited
发明人： Anthony Matthews , Mark Patton
IPC分类号： F25B9/02 , F25B9/10 , F25B9/14 , F25D19/00 , F25B49/02 , G05D23/00 , F28F13/00
摘要： A cryogenic cooling system is provided comprising: a mechanical refrigerator, a heat pipe and a heat switch assembly. The mechanical refrigerator has a first cooled stage and a second cooled stage. The heat pipe has a first part coupled thermally to the second cooled stage and a second part coupled thermally to a target assembly. The heat pipe is adapted to contain a condensable gaseous coolant when in use. The heat switch assembly comprises one or more gas gap heat switches, a first end coupled thermally to the second cooled stage and a second end coupled thermally to the target assembly. The cryogenic cooling system is adapted to be operated in a heat pipe cooling mode in which the temperature of the second cooled stage is lower than the first cooled stage and wherein the temperature of the target assembly causes the coolant within the second part of the heat pipe to be gaseous and the temperature of the second cooled stage causes the coolant in the first part of the heat pipe to condense. The target assembly is cooled by the movement of the condensed liquid coolant from the first part of the heat pipe to the second part of the heat pipe during the heat pipe cooling mode. The cryogenic cooling system is further adapted to be operated in a gas gap cooling mode in which the temperature of the second cooled stage causes freezing of the coolant. The heat switch assembly is adapted to provide cooling from the second cooled stage to the target assembly during the gas gap cooling mode via the one or more gas gap heat switches.

3. 发明申请

US20230090979A1 CRYOGENIC COOLING SYSTEM AND AN INSERT THEREFOR 有权
公开(公告)号：US20230090979A1
公开(公告)日：2023-03-23
申请号：US17798850
申请日：2021-02-16
申请人： Oxford Instruments Nanotechnology Tools Limited
发明人： Anthony Matthews , Timothy Poole , Chris Wilkinson
IPC分类号： F17C3/08 , F25B9/10 , F25B9/12 , F25B9/14 , F25D19/00 , F17C13/00
摘要： A cryogenic cooling system is provided comprising a primary insert (118) and a demountable secondary insert (128). The primary insert (118) comprises a plurality of primary plates (111, 112), each primary plate having a primary contact surface, and one or more primary connecting members (117) arranged so as to connect the plurality of primary plates (111, 112). The demountable secondary insert (128) comprises a plurality of secondary plates (121, 122), each secondary plate having a secondary contact surface, and one or more secondary connecting members (127) arranged so as to connect the plurality of secondary plates (121, 122) such that the secondary insert (128) is self-supporting. One or more adjustment members are configured such that, when the secondary insert (128) is mounted to the primary insert (118), the adjustment members cause the primary and secondary contact surfaces of the respective primary (111, 112) and secondary plates (121, 122) to be brought into conductive thermal contact.

4. 发明授权

US11125475B2 Cryogenic cooling system 有权
公开(公告)号：US11125475B2
公开(公告)日：2021-09-21
申请号：US16828780
申请日：2020-03-24
申请人： OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED
发明人： Anthony Matthews
IPC分类号： F25B9/12 , F25B9/02 , F25B49/00 , F25B25/00 , F25B9/14 , F28D21/00 , F25B9/10
摘要： A cryogenic cooling system is provided comprising a first stage 6, a second stage 7, and a third stage 8, wherein the second stage 7 is arranged between the first stage 6 and the third stage 8. A first dilution unit 12 is provided comprising a first still 11 and a first mixing chamber 13, wherein the first still 11 is thermally coupled to the first stage 6 and the first mixing chamber 13 is thermally coupled to the third stage 8. A second dilution unit 32 is further provided comprising a second still 31 and a second mixing chamber 33, wherein the second still 31 is thermally coupled to the first stage 6 and the second mixing chamber 33 is thermally coupled to the second stage 7.

5. 发明申请

US20200370792A1 CRYOGENIC COOLING SYSTEM 审中-公开
公开(公告)号：US20200370792A1
公开(公告)日：2020-11-26
申请号：US16828780
申请日：2020-03-24
申请人： OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED
发明人： Anthony Matthews
IPC分类号： F25B9/12 , F25B9/02 , F25B49/00
摘要： A cryogenic cooling system is provided comprising a first stage 6, a second stage 7, and a third stage 8, wherein the second stage 7 is arranged between the first stage 6 and the third stage 8. A first dilution unit 12 is provided comprising a first still 11 and a first mixing chamber 13, wherein the first still 11 is thermally coupled to the first stage 6 and the first mixing chamber 13 is thermally coupled to the third stage 8. A second dilution unit 32 is further provided comprising a second still 31 and a second mixing chamber 33, wherein the second still 31 is thermally coupled to the first stage 6 and the second mixing chamber 33 is thermally coupled to the second stage 7.

6. 发明申请

US20230088083A1 GAS GAP HEAT SWITCH CONFIGURATION 有权
公开(公告)号：US20230088083A1
公开(公告)日：2023-03-23
申请号：US17798862
申请日：2021-02-16
申请人： Oxford Instruments Nanotechnology Tools Limited
发明人： Anthony Matthews
IPC分类号： F25B9/12 , F25B9/10 , F25B9/14 , F25D19/00 , F28D15/02
摘要： A cryogenic cooling system is provided comprising: a cooled plate (2) thermally coupled to a cryogenic refrigerator (9), a heat switch assembly and a target assembly (5). The target assembly (5) comprises a target refrigerator (12) configured to obtain a lower base temperature than the cryogenic refrigerator (9). The heat switch assembly (18) comprises one or more gas gap heat switches, the heat switch assembly (18) having a first end thermally coupled to the cooled plate (2) and a second end thermally coupled to the target assembly (5). A sorption pump (22) is provided for controlling the thermal conductivity across the heat switch assembly (18) in accordance with the temperature of the sorption pump (22) The sorption pump (22) is thermally coupled to the cryogenic refrigerator (9), by a thermal link (46) extending from the cooled plate (2) to the heat switch assembly (18). The sorption pump (22) is arranged at a position along the thermal link (46) between the heat switch assembly 18 and the cooled plate (2).

7. 发明授权

US10852051B2 Method of forming a heat switch 有权
公开(公告)号：US10852051B2
公开(公告)日：2020-12-01
申请号：US16310439
申请日：2017-06-05
申请人： OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED
发明人： Anthony Matthews
IPC分类号： F25D19/00 , F25B21/00 , F28F13/00
摘要： A method for forming a gas gap heat switch is provided comprising the following steps: (a) providing first and second conductors, and first and second connecting members, wherein the connecting members each have a thermal conductivity at least five times smaller than that of the conductors when at a temperature of 100K; (b) fusing the first conductor to the first connecting member and the second conductor to the second connecting member; (c) aligning the conductors such that the first and second conductors extend along a common major axis; (d) bringing proximal ends of the aligned conductors into contact with each other when said conductors are at a first temperature; and (e) joining the first connecting member to the second connecting member so as to form a chamber around at least the proximal ends of the conductors.

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