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1. 发明授权

US06754950B2 Electronic component and method of production thereof 有权
标题翻译：电子部件及其制造方法
公开(公告)号：US06754950B2
公开(公告)日：2004-06-29
申请号：US09772859
申请日：2001-01-31
申请人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
发明人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
IPC分类号： H05K330
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
摘要翻译：一种用于制造电子装置的电子装置和制造方法，该电子装置包括：具有主表面的表面声波装置3具有换能器部分4和电连接到换能器部分的布线图案5; 印刷电路板1，其布线图案2至少形成在其一个主表面上; 多个导电凸块6，其电连接两个相互相对的布线图案，并在表面声波装置3和印刷电路板1之间形成空间部分10; 树脂部11通过加热/熔化和硬化与装置的其他主表面紧密接触并涂覆装置3并与印刷电路板1一起密封装置3，其中通过采用高度触变性和粘性热固性树脂与常规树脂相比，可以提供具有简单结构的电子器件，并且可以简化用于制造电子器件的制造工艺。

2. 发明授权

US06262513B1 Electronic component and method of production thereof 失效
标题翻译：电子部件及其制造方法
公开(公告)号：US06262513B1
公开(公告)日：2001-07-17
申请号：US08973858
申请日：1997-12-30
申请人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
发明人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
IPC分类号： H01L4108
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
摘要翻译：一种用于制造电子装置的电子装置和制造方法，该电子装置包括：具有主表面的表面声波装置3具有换能器部分4和电连接到换能器部分的布线图案5; 印刷电路板1，其布线图案2至少形成在其一个主表面上; 多个导电凸块6，其电连接两个相互相对的布线图案，并在表面声波装置3和印刷电路板1之间形成空间部分10; 树脂部11通过加热/熔化和硬化与装置的其他主表面紧密接触并涂覆装置3并与印刷电路板1一起密封装置3，其中通过采用高度触变性和粘性热固性树脂与常规树脂相比，可以提供具有简单结构的电子器件，并且可以简化用于制造电子器件的制造工艺。

3. 发明授权

US06628043B2 Electronic component and method of production thereof 失效
公开(公告)号：US06628043B2
公开(公告)日：2003-09-30
申请号：US09774047
申请日：2001-01-31
申请人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
发明人： Osamu Furukawa , Hitoshi Chiyoma , Kazuhisa Yabukawa , Kenichi Donuma
IPC分类号： H01L4108
CPC分类号： H03H9/1085 , H01L21/56 , H01L21/561 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L23/49805 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/09701 , H01L2924/12033 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H03B5/326 , H03H3/08 , H03H9/02622 , H03H9/02779 , H03H9/02913 , H03H9/059 , H03H9/1078 , H03H9/6433 , H03H9/6436 , H03H9/6469 , H03H9/6473 , Y10T29/42 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/48 , H01L2224/05599
摘要： An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.

4. 发明申请

US20100224784A1 RADIATION DETECTOR AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：辐射检测器及其制造方法
公开(公告)号：US20100224784A1
公开(公告)日：2010-09-09
申请号：US12782209
申请日：2010-05-18
申请人： Katsuhisa Homma , Hitoshi Chiyoma , Shinetsu Fujieda , Keiko Sakai , Masakuni Ikagawa , Akiko Suzuki
发明人： Katsuhisa Homma , Hitoshi Chiyoma , Shinetsu Fujieda , Keiko Sakai , Masakuni Ikagawa , Akiko Suzuki
IPC分类号： G01T1/20 , H01L21/56
CPC分类号： G01T1/20
摘要： According to one embodiment, a radiation detector includes, a substrate, a scintillator layer, a moistureproof body, and an adhesion layer. The substrate comprises a photoelectric conversion element. The scintillator layer is formed on the substrate and converts radiation into fluorescence. The moistureproof body comprises a flange portion in a periphery thereof, the moistureproof body being deep enough to contain at least the scintillator layer. The adhesion layer causes the substrate and the flange portion of the moistureproof body to adhere to each other in a sealed manner.
摘要翻译：根据一个实施例，辐射检测器包括基板，闪烁体层，防潮体和粘合层。基板包括光电转换元件。闪烁体层形成在衬底上并将辐射转化为荧光。防潮体包括在其周边的凸缘部分，防潮体足够深以至少容纳闪烁体层。粘合层使得基材和防潮体的凸缘部分以密封的方式相互粘合。

5. 发明授权

US07982190B2 Radiation detector and method for producing the same 有权
标题翻译：辐射探测器及其制造方法
公开(公告)号：US07982190B2
公开(公告)日：2011-07-19
申请号：US12782209
申请日：2010-05-18
申请人： Katsuhisa Homma , Hitoshi Chiyoma , Shinetsu Fujieda , Keiko Sakai , Masakuni Ikagawa , Akiko Suzuki
发明人： Katsuhisa Homma , Hitoshi Chiyoma , Shinetsu Fujieda , Keiko Sakai , Masakuni Ikagawa , Akiko Suzuki
IPC分类号： G01T1/20 , H01L21/00
CPC分类号： G01T1/20
摘要： According to one embodiment, a radiation detector includes, a substrate, a scintillator layer, a moistureproof body, and an adhesion layer. The substrate comprises a photoelectric conversion element. The scintillator layer is formed on the substrate and converts radiation into fluorescence. The moistureproof body comprises a flange portion in a periphery thereof, the moistureproof body being deep enough to contain at least the scintillator layer. The adhesion layer causes the substrate and the flange portion of the moistureproof body to adhere to each other in a sealed manner.
摘要翻译：根据一个实施例，辐射检测器包括基板，闪烁体层，防潮体和粘合层。基板包括光电转换元件。闪烁体层形成在衬底上并将辐射转化为荧光。防潮体包括在其周边的凸缘部分，防潮体足够深以至少容纳闪烁体层。粘合层使得基材和防潮体的凸缘部分以密封的方式相互粘合。

6. 发明授权

US06377138B1 Surface acoustic wave device with a layered conductive film and method of producing the same 有权
标题翻译：具有层状导电膜的表面声波器件及其制造方法
公开(公告)号：US06377138B1
公开(公告)日：2002-04-23
申请号：US09269181
申请日：1999-06-04
申请人： Toshiyuki Takagi , Hitoshi Chiyoma , Naoki Akahori , Yasuo Ebata , Minoru Kawase , Masayoshi Koshino , Kaoru Sakinada
发明人： Toshiyuki Takagi , Hitoshi Chiyoma , Naoki Akahori , Yasuo Ebata , Minoru Kawase , Masayoshi Koshino , Kaoru Sakinada
IPC分类号： H03H964
CPC分类号： H03H9/02897 , H01L2224/16225 , H03H3/08 , H03H9/02094 , H03H9/02921 , H03H9/02929 , H03H9/14538 , H03H9/6483 , H03H2250/00
摘要： A surface acoustic wave filter element and a method of producing the same. The element is constructed in a manner such that a conductive film, which constitutes a plurality of electrode fingers, a bus bar connecting the electrode fingers in common, an electrode pad connected to the bus bar, etc., is formed on a piezoelectric substrate. When using the surface acoustic wave filter element with this arrangement in a high-frequency band, the thickness of the conductive film and the line width of electrodes are reduced, so that the mechanical strength is a critical problem. According to the present invention, therefore, the conductive film has a two-layer structure, including a layer containing tantalum and aluminum and a metallic layer of aluminum or an alloy consisting mainly of aluminum formed thereon, for example. The composition ratio between tantalum and aluminum is set so that the tantalum content ranges from 39% to 75% (atomic percentage). Thus, the orientation the layer of aluminum or the alloy consisting mainly of aluminum, formed on the layer containing tantalum and aluminum, is improved to increase the strength of the conductive film.
摘要翻译：声表面波滤波器元件及其制造方法。元件的构造方式使得构成多个电极指的导电膜，共同连接电极指的汇流条，连接到汇流条的电极焊盘等形成在压电基板上。当在高频带中使用具有这种布置的表面声波滤波器元件时，导电膜的厚度和电极的线宽度减小，使得机械强度是关键问题。因此，根据本发明，导电膜例如具有包含钽和铝的层和铝的金属层或主要由铝形成的合金的层的双层结构。钽和铝的组成比设定为钽含量为39％〜75％（原子百分比）。因此，改善了在包含钽和铝的层上形成的主要由铝组成的铝层或铝合金的取向，以增加导电膜的强度。

7. 发明授权

US07755053B2 Radiation detection apparatus 有权
标题翻译：辐射检测装置
公开(公告)号：US07755053B2
公开(公告)日：2010-07-13
申请号：US12272498
申请日：2008-11-17
申请人： Hitoshi Chiyoma
发明人： Hitoshi Chiyoma
IPC分类号： G01T1/20
CPC分类号： G01T1/2018
摘要： A radiation detection apparatus includes a radiation detection panel having a fluorescent film and photoelectric conversion elements, a support board for supporting the radiation detection panel, and a gel member displaced between the radiation detection panel and support board.
摘要翻译：放射线检测装置包括具有荧光膜和光电转换元件的放射线检测板，用于支撑放射线检测面板的支撑板和在放射线检测面板与支撑板之间移位的凝胶构件。

8. 发明申请

US20100019162A1 RADIATION DETECTOR 失效
标题翻译：辐射探测器
公开(公告)号：US20100019162A1
公开(公告)日：2010-01-28
申请号：US12490462
申请日：2009-06-24
申请人： Shirofumi Yamagishi , Hitoshi Chiyoma
发明人： Shirofumi Yamagishi , Hitoshi Chiyoma
IPC分类号： G01T1/20
CPC分类号： G01T1/2018 , H01L27/14618 , H01L27/14663 , H01L27/14676 , H01L31/115 , H01L2924/0002 , H01L2924/00
摘要： In a radiation detector in which scintillator layers are directly formed on all the light receiving parts of a plurality of photoelectric conversion substrates, space and level difference between the adjacent photoelectric conversion substrates are determined so that the effects of these space and level difference fall within a range corresponding to the effect of one photoelectric conversion element. Specifically, the space between the adjacent photoelectric conversion substrates is equal to or less than 133 μm and the level difference between the adjacent photoelectric conversion substrates is equal to or less than 100 μm. Accordingly, the scintillator layers can be directly formed on all the light receiving parts of the plurality of photoelectric conversion substrates. This prevents degradation in MTF and sensitivity and reduces manufacturing costs.
摘要翻译：在其中闪烁体层直接形成在多个光电转换基板的所有光接收部分上的辐射检测器中，确定相邻光电转换基板之间的空间和电平差，使得这些空间和电平差的影响落在范围对应于一个光电转换元件的影响。具体地说，相邻的光电转换基板之间的间隔等于或小于133μm，并且相邻的光电转换基板之间的电平差等于或小于100μm。因此，闪烁体层可以直接形成在多个光电转换基板的所有光接收部分上。这可以防止MTF和灵敏度下降，并降低制造成本。

9. 发明授权

US09006669B2 Radiation detector 有权
标题翻译：辐射检测器
公开(公告)号：US09006669B2
公开(公告)日：2015-04-14
申请号：US12782074
申请日：2010-05-18
申请人： Hitoshi Chiyoma , Hiroshi Iwata
发明人： Hitoshi Chiyoma , Hiroshi Iwata
IPC分类号： G01T1/208 , G01T1/20 , H05K1/14
CPC分类号： G01T1/2018 , H05K1/147
摘要： According to one embodiment, a radiation detector includes a photodetector including a fluorescent film configured to convert radiation into light, and a photoelectric conversion element configured to convert light into an electrical signal, a circuit board configured to electrically drives the photodetector, and electronically processes an output signal from the photodetector, and a connection board configured to electrically connect the photodetector and circuit board, and including a flexible circuit board, and an IC mounting board connected to the flexible circuit board, less flexible than the flexible circuit board, and including an IC semiconductor element.
摘要翻译：根据一个实施例，辐射检测器包括：光电检测器，其包括被配置为将辐射转换成光的荧光膜;以及被配置为将光转换成电信号的光电转换元件，被配置为电驱动光电检测器的电路板，来自光电检测器的输出信号和被配置为电连接光电检测器和电路板，并且包括柔性电路板的连接板和连接到柔性电路板的IC安装板，其柔性小于柔性电路板，并且包括 IC半导体元件。

10. 发明申请

US20100224785A1 RADIATION DETECTOR 有权
标题翻译：辐射探测器
公开(公告)号：US20100224785A1
公开(公告)日：2010-09-09
申请号：US12782074
申请日：2010-05-18
申请人： Hitoshi Chiyoma , Hiroshi Iwata
发明人： Hitoshi Chiyoma , Hiroshi Iwata
IPC分类号： G01T1/208
CPC分类号： G01T1/2018 , H05K1/147
摘要： According to one embodiment, a radiation detector includes a photodetector including a fluorescent film configured to convert radiation into light, and a photoelectric conversion element configured to convert light into an electrical signal, a circuit board configured to electrically drives the photodetector, and electronically processes an output signal from the photodetector, and a connection board configured to electrically connect the photodetector and circuit board, and including a flexible circuit board, and an IC mounting board connected to the flexible circuit board, less flexible than the flexible circuit board, and including an IC semiconductor element.
摘要翻译：根据一个实施例，辐射检测器包括：光电检测器，其包括被配置为将辐射转换成光的荧光膜;以及被配置为将光转换成电信号的光电转换元件，被配置为电驱动光电检测器的电路板，来自光电检测器的输出信号和被配置为电连接光电检测器和电路板，并且包括柔性电路板的连接板和连接到柔性电路板的IC安装板，其柔性小于柔性电路板，并且包括 IC半导体元件。

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