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    • 6. 发明专利
    • Composite member, method for manufacturing composite member and semiconductor device
    • 复合构件,制造复合构件和半导体器件的方法
    • JP2014001439A
    • 2014-01-09
    • JP2012138986
    • 2012-06-20
    • Sumitomo Electric Ind Ltd住友電気工業株式会社Allied Material Corp株式会社アライドマテリアル
    • IWAYAMA ISAONISHIKAWA TAICHIROIKEDA TOSHIYAKOYAMA SHIGEKIOKAMOTO TADASHI
    • C22C1/10B22F1/02C22C23/00C22C29/06H01L23/373
    • PROBLEM TO BE SOLVED: To provide a composite member which has a metal layer usable for a substrate for soldering and can construct a heat dissipation structure excellent in heat dissipation properties, a method for manufacturing a composite member capable of manufacturing the composite member with high productivity and a semiconductor device having the composite member.SOLUTION: The composite member comprises: a substrate composed of a composite material that combines 50 vol.% or more of SiC, magnesium or a magnesium alloy; and a metal layer provided on at least a part of a surface of the substrate. The metal layer is formed in direct contact with at least a metal composition of the substrate and has a thickness of 0.001 mm or more and less than 0.5 mm and a surface roughness Ra of 10 μm or less. A metal layer that is thin and has a smooth surface can be directly and easily formed on the substrate by using a cold spray method. The composite material has a smooth metal layer and can bond a semiconductor element or the like by uniformly disposing a solder, and further can construct a heat dissipation structure excellent in heat dissipation properties because the metal layer is thin.
    • 要解决的问题:提供一种具有可用于焊接用基板的金属层的复合部件,能够构成散热特性优异的散热结构,能够以高生产率制造复合部件的复合部件的制造方法 以及具有复合构件的半导体器件。解决方案:复合构件包括:由复合材料构成的基底,其结合了50体积%以上的SiC,镁或镁合金; 以及设置在所述基板的表面的至少一部分上的金属层。 金属层与至少基材的金属组合物直接接触形成,其厚度为0.001mm以上且小于0.5mm,表面粗糙度Ra为10μm以下。 可以通过使用冷喷涂法直接且容易地在基板上形成薄且具有光滑表面的金属层。 复合材料具有平滑的金属层,并且可以通过均匀地设置焊料来接合半导体元件等,并且还可以构造由于金属层薄而导致散热特性优异的散热结构。