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1. 发明专利

JP2012197496A Composite member 审中-公开
标题翻译：复合材料
公开(公告)号：JP2012197496A
公开(公告)日：2012-10-18
申请号：JP2011063209
申请日：2011-03-22
申请人： Sumitomo Electric Ind Ltd , Allied Material Corp , 住友電気工業株式会社 , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , NISHIKAWA TAICHIRO , IKEDA TOSHIYA , KOYAMA SHIGEKI
IPC分类号： C22C29/06 , B22F7/04 , C22C1/10 , H01L23/373
CPC分类号： C22C29/065 , B22F2999/00 , C04B41/009 , C04B41/515 , C04B41/88 , C04B2111/00844 , C22C2001/1073 , C22C2204/00 , C25D7/12 , H01L23/15 , H01L23/34 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , Y10T428/24612 , Y10T428/2495 , Y10T428/263 , B22F3/02 , B22F3/10 , B22F3/26 , C25D7/00 , C23C18/00 , H01L2924/00 , C04B35/565 , C04B38/00 , C04B41/4523
摘要： PROBLEM TO BE SOLVED: To provide a composite member which can efficiently radiate heat to an installation object, a heat radiation member using the composite member, and a semiconductor device using the heat radiation member.SOLUTION: The composite member 1a has: a substrate 2 formed of a composite material that combines magnesium or a magnesium alloy and SiC; and metal coating layers 3, 4 formed on the surface of the substrate 2. One side thereof is packaged with a semiconductor element or the like, the other side is fixed to the installation object such as a cooling apparatus or the like, and it is utilized as the heat radiation member of a semiconductor element. In the composite member 1a, at least once side in the cooling side face and element side face has a warped shape. The composite member 1a is fixed to the installation object so that a warp in the cooling side is crushed. By this pressing force, the composite member 1a can be adhered to the installation object. Thus, the composite member 1a can efficiently radiate the heat of a semiconductor element or the like to the installation object, and can be suitably utilized for the radiation member of a semiconductor device.
摘要翻译：要解决的问题：提供一种可以有效地向安装对象辐射热量的复合构件，使用该复合构件的散热构件和使用该散热构件的半导体装置。解决方案：复合构件1a具有：由复合材料形成的基底2，该复合材料结合镁或镁合金与SiC; 以及形成在基板2的表面上的金属被覆层3,4，其一面与半导体元件等一体地封装，另一方固定在诸如冷却装置等的安装对象上，用作半导体元件的散热构件。在复合构件1a中，冷却侧面和元件侧面中的至少一侧为翘曲形状。复合构件1a固定在安装对象上，使得冷却侧的翘曲被压碎。通过该按压力，可以将复合构件1a粘接到安装对象。因此，复合构件1a可以有效地将半导体元件等的热量照射到安装对象上，并且可以适用于半导体器件的辐射构件。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2008311632A Heat dissipating member and its manufacturing method 有权
标题翻译：散热器及其制造方法
公开(公告)号：JP2008311632A
公开(公告)日：2008-12-25
申请号：JP2008121518
申请日：2008-05-07
申请人： Allied Material Corp , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , KUSAKARI MISATO , TAKAGI YOSHIYUKI , NISHIKAWA TAICHIRO , NAKAI YOSHIHIRO , IKEDA TOSHIYA
IPC分类号： H01L23/373 , B22D19/00 , B22D19/14
摘要： PROBLEM TO BE SOLVED: To provide a method, for highly productively manufacturing a heat dissipating member, capable of manufacturing the heat dissipating member in which a metal layer is provided on one surface of a composite member, and the heat dissipating member. SOLUTION: A joining layer composed of a low-melting point metal having a lower liquidus temperature than a metal constituting a metal plate is formed on the metal plate. This metal plate is disposed in a mold; and a mixed molten metal in which a molten metal matrix is mixed with ceramic particles is poured in the mold. The mixed molten metal is solidified to form the composite member, and the mixed molten metal melts the joining layer to join the composite member and the metal plate to form a metal layer, thereby providing the heat dissipating member having the metal layer on one surface of the composite member. Utilization of the metal plate on which the joining layer is formed can reduce the temperature of the mold and improve the productivity of the heat dissipation member. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够高效地制造散热构件的方法，该方法能够制造其中在复合构件的一个表面上设置有金属层的散热构件和散热构件。解决方案：在金属板上形成由具有比构成金属板的金属低的液相线温度的低熔点金属构成的接合层。该金属板设置在模具中; 并将熔融金属基体与陶瓷颗粒混合的混合熔融金属倒入模具中。混合的熔融金属固化形成复合构件，混合熔融金属熔化接合层，以将复合构件和金属板接合以形成金属层，由此在具有金属层的一个表面上提供具有金属层的散热构件复合构件。利用形成有接合层的金属板可以降低模具的温度并提高散热构件的生产率。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2013245374A Composite material, method for producing the same, and semiconductor device 审中-公开
标题翻译：复合材料，其制造方法和半导体器件
公开(公告)号：JP2013245374A
公开(公告)日：2013-12-09
申请号：JP2012119305
申请日：2012-05-25
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , Allied Material Corp , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , NISHIKAWA TAICHIRO , IKEDA TOSHIYA , KOYAMA SHIGEKI , OKAMOTO TADASHI
IPC分类号： C22C29/06 , C22C1/10 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide a composite material capable of constructing a thin, light heat dissipation member, and a method for producing the composite material, and to provide a semiconductor device equipped with the heat dissipation member.SOLUTION: A composite material includes ≥50 vol.% of SiC, with the remainder comprising magnesium or a magnesium alloy and inevitable impurities, and has a plate shape having a thickness of 40 μm and ≤200 μm, and the mass ratio of the fine powder and the coarse powder is 8:2 to 5:5.
摘要翻译：要解决的问题：提供一种能够构成薄型轻质散热构件的复合材料，以及该复合材料的制造方法，提供配备有散热构件的半导体装置。解决方案：复合材料包括≥ 50体积％的SiC，其余为镁或镁合金和不可避免的杂质，并且具有厚度<3mm的板状。 SiC是平均粒径≤40μm的细粉末和平均粒径>40μm，≤200μm的粗粉末的混合粉末，细粉末和粗粉末的质量比为 8：2到5：5。

4. 发明专利

JP2014001439A Composite member, method for manufacturing composite member and semiconductor device 审中-公开
标题翻译：复合构件，制造复合构件和半导体器件的方法
公开(公告)号：JP2014001439A
公开(公告)日：2014-01-09
申请号：JP2012138986
申请日：2012-06-20
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , Allied Material Corp , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , NISHIKAWA TAICHIRO , IKEDA TOSHIYA , KOYAMA SHIGEKI , OKAMOTO TADASHI
IPC分类号： C22C1/10 , B22F1/02 , C22C23/00 , C22C29/06 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide a composite member which has a metal layer usable for a substrate for soldering and can construct a heat dissipation structure excellent in heat dissipation properties, a method for manufacturing a composite member capable of manufacturing the composite member with high productivity and a semiconductor device having the composite member.SOLUTION: The composite member comprises: a substrate composed of a composite material that combines 50 vol.% or more of SiC, magnesium or a magnesium alloy; and a metal layer provided on at least a part of a surface of the substrate. The metal layer is formed in direct contact with at least a metal composition of the substrate and has a thickness of 0.001 mm or more and less than 0.5 mm and a surface roughness Ra of 10 μm or less. A metal layer that is thin and has a smooth surface can be directly and easily formed on the substrate by using a cold spray method. The composite material has a smooth metal layer and can bond a semiconductor element or the like by uniformly disposing a solder, and further can construct a heat dissipation structure excellent in heat dissipation properties because the metal layer is thin.
摘要翻译：要解决的问题：提供一种具有可用于焊接用基板的金属层的复合部件，能够构成散热特性优异的散热结构，能够以高生产率制造复合部件的复合部件的制造方法以及具有复合构件的半导体器件。解决方案：复合构件包括：由复合材料构成的基底，其结合了50体积％以上的SiC，镁或镁合金; 以及设置在所述基板的表面的至少一部分上的金属层。金属层与至少基材的金属组合物直接接触形成，其厚度为0.001mm以上且小于0.5mm，表面粗糙度Ra为10μm以下。可以通过使用冷喷涂法直接且容易地在基板上形成薄且具有光滑表面的金属层。复合材料具有平滑的金属层，并且可以通过均匀地设置焊料来接合半导体元件等，并且还可以构造由于金属层薄而导致散热特性优异的散热结构。

5. 发明专利

JP2011080145A Composite member 有权
标题翻译：复合材料
公开(公告)号：JP2011080145A
公开(公告)日：2011-04-21
申请号：JP2010202871
申请日：2010-09-10
申请人： Allied Material Corp , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , NAKAI YOSHIHIRO , NISHIKAWA TAICHIRO , TAKAGI YOSHIYUKI , IKEDA TOSHIYA
IPC分类号： C22C29/06 , B22D19/00 , B22F3/10 , B22F3/22 , B22F3/26 , C04B35/565 , C04B35/571 , C04B35/573 , C04B38/00 , C04B41/80 , C04B41/88 , C22C1/05 , C22C1/10 , H01L23/36 , H01L23/373 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a composite member which is suitable for a heat radiating member of a semiconductor element, to provide a method for producing the same, to provide the heat radiating member, and to provide a semiconductor device. SOLUTION: The composite member is obtained by compounding magnesium or a magnesium alloy with nonmetal inorganic material such as SiC, comprises the SiC by >70 vol.%, and has a thermal expansion coefficient of 4 to 8 ppm/K and a thermal conductivity of ≥180 W/m.K. Since the composite member has excellent consistency with the thermal expansion coefficient of a semiconductor element, and further, has excellent heat radiating properties, it is suitably utilizable for the heat radiating member of a semiconductor element. In the nonmetal inorganic material, by utilizing a compact such as a sintered compact having a network part coupling the nonmetal inorganic material each other, the content of the nonmetal inorganic material in the composite member can be easily increased, and further, by the presence of the network part in the composite member, excellent heat properties can be exhibited. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种适用于半导体元件的散热构件的复合构件，提供其制造方法，以提供散热构件，并提供半导体器件。解决方案：复合构件通过将镁或镁合金与诸如SiC的非金属无机材料混合而获得，包括> 70体积％的SiC，并且具有4至8ppm / K的热膨胀系数和导热系数≥180W / mK 由于复合构件与半导体元件的热膨胀系数具有优异的一致性，并且还具有优异的散热性能，因此适用于半导体元件的散热构件。在非金属无机材料中，通过利用诸如具有将非金属无机材料连接的网络部分的烧结体的压块，可以容易地增加复合构件中非金属无机材料的含量，此外，通过存在复合构件中的网络部件，可以显示出优异的热性能。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011073055A Method of producing composite member 有权
标题翻译：生产复合材料的方法
公开(公告)号：JP2011073055A
公开(公告)日：2011-04-14
申请号：JP2009230339
申请日：2009-10-02
申请人： Allied Material Corp , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , NAKAI YOSHIHIRO , NISHIKAWA TAICHIRO , TAKAGI YOSHIYUKI , IKEDA TOSHIYA
IPC分类号： B22D19/00 , B22D19/14 , B22D21/04 , B22D27/04
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of producing a composite member by which a large sized high grade composite member is produced, the composite member suitable for a heat radiation member of a semiconductor element, the heat radiation member formed from the composite member and a semiconductor device possessing the heat radiation member. SOLUTION: In the production of the composite member obtained by compounding magnesium (Mg) or a magnesium alloy with a non-metallic inorganic material, aggregate of the non-metallic inorganic material is housed in a casting mold 10 and molten Mg or Mg alloy flows into the casting mold 10 to be infiltrated into the aggregate to form an infiltration plate. For example, the molten Mg is supplied to the aggregate from the upper side toward the lower side in the vertical direction with dead weight. After that, the molten Mg is solidified by cooling from the opposite side to the supply side of the molten Mg in the infiltration plate in one side direction. Because the unsolidified Mg in the upper side in the vertical direction is successively supplied to the lower side in the vertical direction by the dead weight in the solidification from the lower side part in the vertical direction by cooling in the one side direction, it is prevented that defects occurs intensively in the center part even in the large sized composite member and the high grade composite member is obtained. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：为了提供一种生产大型高档复合构件的复合构件的制造方法，适用于半导体元件的散热构件的复合构件，由复合构件和具有该散热构件的半导体装置。解决方案：在通过将镁（Mg）或镁合金与非金属无机材料混合而获得的复合构件的制造中，将非金属无机材料的骨料容纳在铸模10中并熔融的Mg或 Mg合金流入铸模10中以渗透到聚集体中以形成渗透板。例如，熔融的Mg从上侧向下侧向上下方向供给到骨料。之后，熔融的Mg通过从渗透板的一侧方向上的熔融Mg的供给侧的相反侧冷却而固化。因为通过沿一个侧面的冷却，垂直方向的上侧的未固化的Mg从垂直方向的下侧部分的固化物在垂直方向上的下侧依次供给到下侧，所以防止了即使在大尺寸的复合构件中也能够在中心部分发生缺陷，得到高等级的复合构件。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010106362A Composite member and process for producing the same 有权
标题翻译：复合构件及其制造方法
公开(公告)号：JP2010106362A
公开(公告)日：2010-05-13
申请号：JP2009230338
申请日：2009-10-02
申请人： Allied Material Corp , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , NISHIKAWA TAICHIRO , TAKAGI YOSHIYUKI , KUSAKARI MISATO , NAKAI YOSHIHIRO , IKEDA TOSHIYA
IPC分类号： C22C1/10 , B22D19/00 , B22F7/04 , C22C23/00 , C22C23/02 , C22C23/04 , C22C23/06 , H01L23/373
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a composite member suitably utilizable as a heat-dissipating member and easy to be electroplated, to provide a process for producing the same, to provide a heat-dissipating member, and to provide a semiconductor device. SOLUTION: The composite member comprises: a substrate composed of a composite material obtained by compounding magnesium (Mg) or Mg alloy with SiC; and a metal coating layer coating one side of the substrate. The substrate contains ≥50 vol.% of SiC. The composite member is produced by making the substrate by infiltrating molten Mg or molten Mg alloy into an SiC aggregate stored into a molding, further, providing a non-filled region in which SiC is not filled between the die and the SiC aggregate, and forming the metal coating layer by a metal made to exist in the non-filled region. The metal coating layer is formed by providing a gap, e.g., by arranging a spacer between the die and the SiC aggregate, and making molten Mg or molten Mg alloy to flow into the gap. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供适合用作散热构件并且易于电镀的复合构件，以提供其制造方法，以提供散热构件，并且提供半导体装置。＆lt; P＆gt;解决方案：复合构件包括：由通过将镁（Mg）或Mg合金与SiC混合而获得的复合材料构成的基板; 以及涂覆基板一侧的金属涂层。该基体含有≥50体积％的SiC。通过将熔融的Mg或熔融的Mg合金浸入到储存在模制品中的SiC集合体中来制造复合材料制品，此外，提供在模具和SiC集合体之间未填充SiC的未填充区域，并且形成金属被覆层由金属制成以存在于未填充区域中。通过在模具和SiC集合体之间设置间隔物，并且使熔融的Mg或熔融的Mg合金流入间隙，通过提供间隙来形成金属涂层。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2010090436A Magnesium-based composite material and production method of the same 有权
标题翻译：基于镁的复合材料及其生产方法
公开(公告)号：JP2010090436A
公开(公告)日：2010-04-22
申请号：JP2008261522
申请日：2008-10-08
申请人： Allied Material Corp , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , TAKAGI YOSHIYUKI , KUSAKARI MISATO , NISHIKAWA TAICHIRO , IKEDA TOSHIYA
IPC分类号： C22C1/10 , B22D18/02 , B22D19/00 , B22D29/00 , C22C47/04 , C22C47/08 , C22C49/14 , C22C101/14
摘要： PROBLEM TO BE SOLVED: To provide a magnesium-based composite material having a small porosity and thermal property suitable for a heat-dissipating member, and a production method of the same. SOLUTION: The magnesium-based composite material is formed by dispersing SiC in a base material composed of magnesium or magnesium alloy, and the porosity in the composite material is less than 3%. The composite material can be produced by the production method including an oxidation treatment process in which the raw material SiC is heated to form an oxide film on the surface, and an impregnation process in which the coated SiC having the oxide film formed thereon is placed in a molding die, and molten magnesium or molten magnesium alloy at a temperature of 675-1,000°C is impregnated into the coated SiC aggregate. In the oxidation treatment, the oxide film is formed such that the heating temperature is 700°C or above and a mass ratio of the oxide film to the raw material SiC will meet 0.4-1.5%. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有适于散热构件的孔隙率和热性能小的镁基复合材料及其制造方法。解决方案：镁基复合材料通过将SiC分散在由镁或镁合金构成的基材中而形成，复合材料的孔隙率小于3％。该复合材料可以通过包括氧化处理工艺的制造方法制造，其中将原料SiC加热以在表面上形成氧化膜，并且将其上形成有氧化物膜的涂覆的SiC放置在其中的浸渍工艺成型模具和熔融的镁或熔融镁合金在675-1000℃的温度下浸渍到涂覆的SiC集合体中。在氧化处理中，氧化膜形成为加热温度为700℃以上，氧化膜与原料SiC的质量比为0.4〜1.5％。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2014062329A Magnesium-base composite material 有权
标题翻译：镁基复合材料
公开(公告)号：JP2014062329A
公开(公告)日：2014-04-10
申请号：JP2013256016
申请日：2013-12-11
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , Allied Material Corp , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , TAKAGI YOSHIYUKI , KUSAKARI MISATO , NISHIKAWA TAICHIRO , IKEDA TOSHIYA
IPC分类号： C22C29/06 , C01B31/36 , C22C1/10
摘要： PROBLEM TO BE SOLVED: To provide a heat radiation member small in porosity and excellent in heat characteristics such that heat conductivity is high and a thermal expansion coefficient difference from a heat evolving object is small.SOLUTION: The heat radiation member comprises a magnesium-base composite material obtained by dispersing SiC in a base material composed of magnesium or a magnesium alloy where the content of SiC in the magnesium-base composite material is not less than 50% and not greater than 80% by a volume ratio, the porosity in the magnesium-base composite material is less than 3%, the heat conductivity is not less than 180 W/mk, and the heat expansion coefficient is not less than 4×10/K and not greater than 10×10/K.
摘要翻译：要解决的问题：提供一种孔隙率小且热特性优异的散热构件，其导热率高，并且与散热物体的热膨胀系数差异小。散热构件包括镁基通过将SiC分散在由镁或镁合金构成的基材中而获得的复合材料，其中镁基复合材料中的SiC含量以体积比不小于50％且不大于80％，其中孔隙率镁基复合材料小于3％，导热率不低于180W / mk，热膨胀系数不小于4×10 / K，不大于10×10 / K。

10. 发明专利

JP2013245373A Composite member, method for manufacturing the same, and semiconductor device 审中-公开
标题翻译：复合构件，其制造方法和半导体器件
公开(公告)号：JP2013245373A
公开(公告)日：2013-12-09
申请号：JP2012119304
申请日：2012-05-25
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , Allied Material Corp , 株式会社アライドマテリアル
发明人： IWAYAMA ISAO , NISHIKAWA TAICHIRO , IKEDA TOSHIYA , KOYAMA SHIGEKI , OKAMOTO TADASHI
IPC分类号： C22C29/06 , B22D19/00 , B22D19/14 , C04B41/88 , C22C1/10
摘要： PROBLEM TO BE SOLVED: To provide a composite member capable of constructing a heat-dissipation structure having excellent heat dissipation property, and to provide a method for manufacturing the composite member and a semiconductor device.SOLUTION: A composite member 1 includes a body part 10 constituted of a composite material containing ≥50 vol.% of SiC, with the remainder comprising magnesium or a magnesium alloy and inevitable impurities. In the body part 10, a flow passage 20 is formed to discharge a fluid supplied from the outside of the body part 10 to the outside of the body part 10 through the inside of the body part 10. The flow passage 20 is constituted of a tubular material made of, for example, metal or nonmetal, and is integrally provided in the composite material. In the composite member 1, the body part 10 is constituted of the Mg-SiC composite material having excellent heat dissipation property, and further, the body part 10 can be effectively cooled by flowing a fluid through the flow passage 20, and thereby, a cooling effect by the fluid is obtained. Accordingly, the composite member 1 can construct a heat-dissipation structure having excellent heat dissipation property.
摘要翻译：要解决的问题：提供一种能够构成散热性优异的散热结构的复合构件，提供一种复合构件和半导体装置的制造方法。复合构件1包括主体部10 由含有≥50体积％的SiC的复合材料构成，其余为镁或镁合金和不可避免的杂质。在主体部10中形成有流路20，其通过主体部10的内部将从主体部10的外部供给的流体排出到主体部10的外部。流路20由由例如金属或非金属制成的管状材料，并且整体地设置在复合材料中。在复合构件1中，主体部10由具有优异的散热性的Mg-SiC复合材料构成，并且通过使流体流过流路20能够有效地冷却主体部10，由此，获得流体的冷却效果。因此，复合构件1可以构成散热特性优异的散热结构。

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