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    • 2. 发明申请
    • MOUNTING INTERFACE FOR A PHOTOVOLTAIC MODULE
    • 光伏模块的安装接口
    • WO2011073385A2
    • 2011-06-23
    • PCT/EP2010/070066
    • 2010-12-17
    • OERLIKON SOLAR AG, TRÜBBACHSINICCO, IvanHUEGLI, AndreasDILLMANN, Jürgen Josef
    • SINICCO, IvanHUEGLI, AndreasDILLMANN, Jürgen Josef
    • H01L31/042
    • H01L31/0422F24S25/632F24S2025/023H02S20/00H02S20/10H02S20/23Y02B10/12Y02B10/20Y02E10/47Y02E10/50
    • The invention relates to a mounting interface configured for a photovoltaic module (1) comprising a backside (2) having an overall backside surface size (4, 5), the mounting interface comprising at least six mounting elements (3) attachable to the backside (2) of the photovoltaic module (1) for mounting the photovoltaic module (1) on a mounting surface, wherein each mounting element (3) comprises a mounting element surface having an overall mounting element surface size (6, 7) such that the contact area between the photovoltaic module (1) and the mounting element (3), when attached to the photovoltaic module (1), equals the overall mounting element surface size (6, 7), and the overall backside surface size (4, 5) of the photovoltaic module (1) divided by the summarized overall mounting element surface size (6, 7) of all mounting elements (3) is ≥ 40 and ≤ 160, preferably ≥ 50 and ≤ 80, more preferably 52. The invention provides for reducing the size of each mounting element (3) such that the overall amount of material required for the mounting is reduced, resulting in minimized material costs.
    • 本发明涉及一种被配置用于光伏模块(1)的安装接口,该光伏模块(1)包括具有整体后侧表面尺寸(4,5)的背面(2),该安装接口包括至少六个可附接到背面的安装元件(3) 用于将光伏模块(1)安装在安装表面上的光伏模块(1)的两个(2),其中每个安装元件(3)包括具有整体安装元件表面尺寸(6,7)的安装元件表面, 当光伏模块(1)和安装元件(3)之间的区域安装在光电模块(1)上时,等于整个安装元件的表面尺寸(6,7)和整个背面的尺寸(4,5) 光电模块(1)除以所有安装元件(3)的总体安装元件表面尺寸(6,7)的总和= 40和= 160,优选= 50和= 80,更优选为52.本发明提供 减小每个安装元件(3)的尺寸 因为安装所需的材料的总量减少,导致材料成本最小化。
    • 3. 发明公开
    • MOUNTING INTERFACE FOR A PHOTOVOLTAIC MODULE
    • MONTAGESCHNITTSTELLEFÜREIN PV-MODUL
    • EP2513574A2
    • 2012-10-24
    • EP10792937.4
    • 2010-12-17
    • Oerlikon Solar AG, Trübbach
    • SINICCO, IvanHUEGLI, AndreasDILLMANN, Jürgen Josef
    • F24J2/52H01L31/042
    • H01L31/0422F24S25/632F24S2025/023H02S20/00H02S20/10H02S20/23Y02B10/12Y02B10/20Y02E10/47Y02E10/50
    • The invention relates to a mounting interface configured for a photovoltaic module (1) comprising a backside (2) having an overall backside surface size (4, 5), the mounting interface comprising at least six mounting elements (3) attachable to the backside (2) of the photovoltaic module (1) for mounting the photovoltaic module (1) on a mounting surface, wherein each mounting element (3) comprises a mounting element surface having an overall mounting element surface size (6, 7) such that the contact area between the photovoltaic module (1) and the mounting element (3), when attached to the photovoltaic module (1), equals the overall mounting element surface size (6, 7), and the overall backside surface size (4, 5) of the photovoltaic module (1) divided by the summarized overall mounting element surface size (6, 7) of all mounting elements (3) is ≧40 and ≦̸160, preferably ≧50 and ≦̸80, more preferably 52. The invention provides for reducing the size of each mounting element (3) such that the overall amount of material required for the mounting is reduced, resulting in minimized material costs.
    • 本发明涉及一种用于光伏模块(1)的安装接口,该光伏模块(1)包括具有整体后侧表面尺寸(4,5)的背面(2),该安装接口包括至少六个可附接到背面的安装元件(3) 2,用于将光伏模块(1)安装在安装表面上的光伏组件(1),其中每个安装元件(3)包括具有整体安装元件表面尺寸(6,7)的安装元件表面, 光伏模块(1)和安装元件(3)之间的安装在光伏模块(1)上的区域等于整个安装元件的表面尺寸(6,7)和整个背面的尺寸(4,5) (1)除以所有安装元件(3)的总体安装元件表面尺寸(6,7)的总和为≥40且< nlE; 160,优选≥50且< nlE; 80,更优选为52.本发明 提供减小每个安装元件(3)的尺寸 使得安装所需的材料的总量减少,导致材料成本最小化。
    • 5. 发明申请
    • PHOTOVOLTAIC MODULE AND FOR FIXING AND SUPPORTING THE SAME
    • 光伏组件,用于固定和支持
    • WO2010058011A2
    • 2010-05-27
    • PCT/EP2009/065664
    • 2009-11-23
    • OERLIKON SOLAR IP AG, TRÜBBACHSINICCO, Ivan
    • SINICCO, Ivan
    • H01L31/042
    • H02S20/00F24S25/632Y02E10/47Y02E10/50
    • The inventions relates to a method for fixing and supporting a photovoltaic module (1 ) on a surface by means of a connecting device, the connecting device comprising two connecting parts, one connecting part being attached to the backside of the photovoltaic module (1 ) and the other connecting part being attached to the surface, wherein one connecting part comprises a supporting point (6), the supporting point (6) comprises a structural member (9) exhibiting a receptacle (10), the other connecting part comprises a pivot (11 ), the receptacle (10) matches against the pivot (11 ), the structural member (9) comprises a fixation means to fixate the pivot (11 ) in the receptacle (10), for fixation of the photovoltaic module (1 ) on the surface the structural member (9) is plugged onto the pivot (11 ), and the pivot (11) is fixated in the receptacle (10) by said fixation means when the structural member (9) is plugged onto the pivot (11), thereby forming a joint of the photovoltaic module (1 ) to the surface.
    • 本发明涉及一种通过连接装置在表面上固定和支撑光伏组件(1)的方法,该连接装置包括两个连接部分,一个连接部分连接到光伏组件(1)的背面,一个连接部分 所述另一连接部分附接到所述表面,其中一个连接部分包括支撑点(6),所述支撑点(6)包括展现出容器(10)的结构构件(9),所述另一连接部分包括枢轴 插座(10)与枢轴(11)相配合,结构件(9)包括用于将枢轴(11)固定在容器(10)中的固定装置,用于将光伏组件(1)固定在 结构构件(9)的表面被塞到枢轴(11)上,并且当结构构件(9)插入到枢轴(11)上时,枢轴(11)通过所述固定装置固定在容器(10)中, ,从而形成光伏模块的接头 (1)到表面。
    • 6. 发明申请
    • METHOD FOR DIVIDING A SEMICONDUCTOR FILM FORMED ON A SUBSTRATE INTO PLURAL REGIONS BY MULTIPLE LASER BEAM IRRADIATION
    • 通过多激光束辐射将基底上形成的半导体膜分成多个区域的方法
    • WO2010048733A1
    • 2010-05-06
    • PCT/CH2009/000336
    • 2009-10-20
    • OERLIKON SOLAR IP AG, TRÜBBACHGÜNSTER, JensSINICCO, Ivan
    • GÜNSTER, JensSINICCO, Ivan
    • H01L27/142B23K26/42B23K26/40
    • B23K26/0608B23K26/364B23K26/40B23K2201/40B23K2203/172B23K2203/50
    • The present invention relates to a method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation using a sequence of at least two laser beam treatments affecting essentially a same area of said film. Except of a final laser beam treatment, the treatments of said sequence of at least two laser beam treatments are used for a conditioning of the treated film area which is to be removed. Said final laser beam treatment is applied to actually remove material in order to form a groove. Further, the invention relates to an arrangement for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation using a sequence of at least two laser beam treatments affecting essentially a same area of said film. Said arrangement comprises a first conditioning laser for the treatments of said sequence of at least two laser beam treatments except of a final laser beam treatment and it comprises a second laser for said final laser beam treatment.
    • 本发明涉及一种通过多个激光束照射将基板上形成的半导体膜分成多个区域的方法,所述方法使用至少两个影响所述膜的相同面积的激光束处理的序列。 除了最终的激光束处理之外,所述至少两个激光束处理序列的处理被用于待去除处理的膜区域的调节。 施加所述最终激光束处理以实际去除材料以形成凹槽。 此外,本发明涉及一种通过多次激光束照射将形成在基板上的半导体膜分割成多个区域的装置,该装置使用至少两个影响所述膜的相同面积的激光束处理的序列。 所述装置包括用于处理除了最终激光束处理之外的至少两个激光束处理的所述序列的第一调节激光器,并且其包括用于所述最终激光束处理的第二激光器。