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    • 1. 发明授权
    • Polishing endpoint detection method
    • 抛光端点检测方法
    • US5639388A
    • 1997-06-17
    • US588241
    • 1996-01-18
    • Norio KimuraFumihiko SakataTamami Takahashi
    • Norio KimuraFumihiko SakataTamami Takahashi
    • B24B37/013B24B37/07B24B49/16H01L21/66
    • B24B37/013B24B49/16
    • An endpoint detection in a polishing process of a polishing object which has a first layer and a second layer, formed under the first layer, is performed by holding the polishing object on a top ring and pressing a surface of the first layer of the polishing object onto a polishing cloth mounted on a rotating turntable so as to remove the first layer, oscillating the top ring in contact with the turntable, periodically measuring a torque on the rotating turntable when the top ring is positioned at a specific radial location defined by a radius from a rotational center of the turntable, and determining the endpoint based on a change in the torque generated when the first layer is removed and the second layer comes into contact with the polishing cloth.
    • 通过将抛光对象保持在顶环上并按压抛光对象的第一层的表面来进行在第一层下方形成有第一层和第二层的抛光对象的抛光工序中的端点检测 到安装在旋转转台上的抛光布上,以便去除第一层,使顶环与转台相接触,使顶环周期性地测量旋转转台上的转矩,当顶环位于由半径限定的特定径向位置时 并且基于当去除第一层并且第二层与抛光布接触时产生的扭矩的变化来确定端点。
    • 3. 发明申请
    • POLISHING APPARATUS
    • 抛光装置
    • US20110165825A1
    • 2011-07-07
    • US12673294
    • 2008-07-23
    • Norio KimuraKenya ItoTamami TakahashiMasaya Seki
    • Norio KimuraKenya ItoTamami TakahashiMasaya Seki
    • B24B9/00
    • B24B9/065
    • A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).
    • 根据本发明的研磨装置是通过使研磨工具(41)与所述基板(W)滑动接触来研磨基板(W)的周边(斜面部,切口部,边缘切断部)的研磨装置 衬底周边。 抛光装置包括:基板保持架(20),其构造成保持基板(W); 以及抛光头(42),其被配置为使用所述抛光工具(41)抛光由所述基板保持器(20)保持的所述基板(W)的周边。 抛光头(42)包括用于将抛光工具(41)压靠在基板(W)的周边上的压垫(50)和构造成使压垫(50)往复运动的直线电动机(90)。