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1. 发明授权

US4978491A Molded resin casing of electronic part incorporating flexible board 失效
公开(公告)号：US4978491A
公开(公告)日：1990-12-18
申请号：US244165
申请日：1988-09-13
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.

2. 发明授权

US5071611A Method of making molded resin casing of electronic part with flat cable 失效
标题翻译：具有扁平电缆的电子部件的模制树脂铸造方法
公开(公告)号：US5071611A
公开(公告)日：1991-12-10
申请号：US447441
申请日：1989-12-07
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.

3. 发明授权

US4935718A Molded resin casing of electronic part incorporating flexible board 失效
标题翻译：带柔性板的电子部件的模制树脂外壳
公开(公告)号：US4935718A
公开(公告)日：1990-06-19
申请号：US234952
申请日：1988-08-22
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.

4. 发明授权

US4928082A Molded resin casing of electronic part with flexible flat cable 失效
标题翻译：带柔性扁平电缆的电子部件模制树脂外壳
公开(公告)号：US4928082A
公开(公告)日：1990-05-22
申请号：US234946
申请日：1988-08-22
申请人： Nobuyuki Yagi , Jiro Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
发明人： Nobuyuki Yagi , Jiro Inagaki , Kozo Morita , Yasutoshi Kaku , Nobuyuki Kikuchi , Shinji Mizuno
IPC分类号： B29C45/14 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/00 , H05K5/00
CPC分类号： B29C45/14639 , H01C10/34 , H01C10/44 , H01C17/02 , H01H11/0056 , H05K5/0095 , B29C2045/14983
摘要： A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.

5. 发明授权

US5111363A Mount for electronic parts 失效
标题翻译：电子配件安装
公开(公告)号：US5111363A
公开(公告)日：1992-05-05
申请号：US365116
申请日：1989-06-12
申请人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
发明人： Nobuyuki Yagi , Jiroh Inagaki , Kozo Morita , Yosutoshi Kaku , Shinji Mizuno , Akiko Yamanaka
IPC分类号： H05K1/09 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/28
CPC分类号： H05K3/284 , H05K1/189 , H05K1/09 , H05K1/118 , H05K2201/0129 , H05K2201/10689 , H05K2201/10924 , H05K2201/10946 , H05K2201/10977 , H05K2201/2009 , H05K2203/1316 , H05K2203/1327 , H05K3/0058 , H05K3/281
摘要： A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.

6. 发明授权

US06388211B1 Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate 失效
标题翻译：在具有开口的基板上成型模制树脂的方法，具有模制树脂的开关基板，在开关基板上形成开关图案的方法以及开关基板
公开(公告)号：US06388211B1
公开(公告)日：2002-05-14
申请号：US09471376
申请日：1999-12-23
申请人： Osamu Nomura , Nobuyuki Yagi , Kozo Morita
发明人： Osamu Nomura , Nobuyuki Yagi , Kozo Morita
IPC分类号： H01H158
CPC分类号： H01H1/40 , B29C45/14344 , B29C45/14639 , H01H1/403 , H01H11/0056 , H01H2019/006 , H05K3/0014 , H05K3/202 , H05K3/22 , Y10T29/49105
摘要： A substrate (10), a first mold (200) and a second mold (250) are prepared, and a plurality of switch patterns (14), (18) are provided by providing openings (pattern-removal portions) (A) in such a manner that a pattern (11), which has been formed on the surface of the substrate (10), is divided into a plurality of patterns to form A switch substrate. Next, the switch substrate (1) is clamped between the first mold (200) and the second mold (250). At such time, the side of the switch substrate (1) provided with the switch patterns (14), (18) is brought into surface contact with an abutting surface (201) of the first mold (200) and, at the same time, a cavity (253) provided in the second mold (250) opposes the other side of the switch substrate. Next, a molten molding resin is charged into the cavity (253) provided in the second mold (250) to thereby fill the cavity (253) and the openings (A) of the substrate with the molding resin. After the molding resin hardens, the first mold (200) and the second mold (250) are separated and the switch substrate (1), which will have the molding resin case 40 attached thereto, is extracted.
摘要翻译：制备基板（10），第一模具（200）和第二模具（250），并且通过提供多个开关图案（图案去除部分）（A）已经形成在基板（10）的表面上的图案（11）被分成多个图案以形成A开关基板的方式。接下来，将开关基板（1）夹在第一模具（200）和第二模具（250）之间。此时，具有开关图案（14），（18）的开关基板（1）的一侧与第一模具（200）的抵接面（201）表面接触，并且同时设置在第二模具（250）中的空腔（253）与开关基板的另一侧相对。接下来，将熔融成型树脂装入设置在第二模具（250）中的空腔（253）中，从而用模塑树脂填充基板的空腔（253）和开口（A）。在模制树脂硬化之后，分离第一模具（200）和第二模具（250），并且将具有附着于其上的模制树脂壳体40的开关基板（1）被提取。

7. 发明授权

US07728710B2 Electronic parts board and method of producing the same 失效
标题翻译：电子零件板及其制造方法
公开(公告)号：US07728710B2
公开(公告)日：2010-06-01
申请号：US10541459
申请日：2004-02-05
申请人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagome , Naoki Fukuda , Kozo Morita , Daisuke Makino
发明人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagome , Naoki Fukuda , Kozo Morita , Daisuke Makino
IPC分类号： H01C10/32
CPC分类号： B29C45/1418 , B29C45/14467 , B29C45/14639 , B29L2031/3406 , H01C10/32 , H01C10/48 , H05K1/0393 , H05K1/167 , H05K3/0014 , H05K3/0058 , Y10T29/49082 , Y10T428/24917
摘要： An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.
摘要翻译：电子部件基板（1-1）具有安装在绝缘基体（10）上的绝缘基体（10）和柔性电路基板（20）。柔性电路板（20）是其上设置有端子图案（29）的合成树脂膜和表面与滑块滑动接触的导体图案（25）。绝缘基座（10）是合成树脂模制件。柔性电路板（20）被嵌入成型到绝缘基座（10）。电子部件基板（1-1）通过制备柔性电路板（20）和具有空腔（C1）的第一和第二模具部件（41,45）制成，其形状对应于电子部件的外部形状基板（1-1）。然后，柔性电路板（20）容纳在第一和第二模具构件（41,45）之间的空腔（C1）中，并且空腔（C1）填充有熔融模制树脂。在模制树脂固化之后，移除第一和第二模具构件（41,45）。

8. 发明申请

US20060040094A1 Electronic parts board and method of producing the same 失效
标题翻译：电子零件板及其制造方法
公开(公告)号：US20060040094A1
公开(公告)日：2006-02-23
申请号：US10541459
申请日：2004-02-05
申请人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagawa , Naoki Fukuda , Kozo Morita , Daisuke Makino
发明人： Shinji Mizuno , Koji Mitsui , Katsutoshi Yanoshita , Shinichi Suzuki , Takashi Shinoki , Kazutaka Nakagawa , Naoki Fukuda , Kozo Morita , Daisuke Makino
IPC分类号： B29C70/88 , B32B3/00 , B29C45/14 , H01G13/00
CPC分类号： B29C45/1418 , B29C45/14467 , B29C45/14639 , B29L2031/3406 , H01C10/32 , H01C10/48 , H05K1/0393 , H05K1/167 , H05K3/0014 , H05K3/0058 , Y10T29/49082 , Y10T428/24917
摘要： An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a slider. The insulating base 10 is a synthetic resin molded piece. The flexible circuit board 20 is insert-molded to the insulating base 10. The electronic component substrate 1-1 is produced by preparing the flexible circuit board 20 and first and second mold members 41 and 45 having a cavity C1 with a shape that corresponds to the external shape of the electronic component substrate 1-1. Then, the flexible circuit board 20 is accommodated in the cavity C1 between the first and second mold members 41 and 45, and a molten molding resin is filled into the cavity C1. After the filled molding resin has been solidified, the first and second mold members 41 and 45 are removed.
摘要翻译：电子元件基板1-1包括绝缘基座10和安装在绝缘基座10上的柔性电路板20.柔性电路板20是其上设置有端子图案29的合成树脂膜和表面滑动的导体图案25 与滑块联系。绝缘基座10是合成树脂模制件。柔性电路板20被插入模制到绝缘基座10.电子部件基板1通过制备柔性电路板20和具有空腔C 1的第一和第二模具构件41和45来制造，该腔体具有对应于然后，将柔性电路板20容纳在第一和第二模具构件41和45之间的空腔C 1中，并将熔融的模制树脂填充到空腔C 1中在填充模塑树脂已经固化之后，第一和第二模具构件41和45被去除。

9. 发明申请

US20090318632A1 INSULATING POLYMER MATERIAL COMPOSITION 审中-公开
标题翻译：绝缘聚合物材料组合物
公开(公告)号：US20090318632A1
公开(公告)日：2009-12-24
申请号：US12375577
申请日：2007-08-02
申请人： Yasuyuki Kurata , Kozo Morita , Takehiro Mizuno
发明人： Yasuyuki Kurata , Kozo Morita , Takehiro Mizuno
IPC分类号： C08G59/00
CPC分类号： H01B3/40 , C08G59/20 , H01B3/20
摘要： An insulating polymer material composition is obtained by adequately adding a curing agent, a curing accelerator or the like to an epoxidized vegetable oil (such as an epoxidizable vegetable oil and fat which is an ester of glycerin and a fatty acid having a double bond portion therein), and heating and three-dimensionally crosslinking the resulting. As the curing agent, the curing accelerator or the like, those used for petroleum-derived polymer materials such as epoxy resins can be used. This polymer material composition is applied to, for example, insulating structures for high-voltage devices including a switching device such as a circuit breaker or disconnector in the casing.
摘要翻译：绝缘聚合物材料组合物通过向环氧化植物油（例如作为甘油的酯的可环氧化植物油脂和其中具有双键部分的脂肪酸）充分添加固化剂，固化促进剂等而获得），并加热并三维交联得到。作为固化剂，可以使用固化促进剂等，用于石油衍生的聚合物材料如环氧树脂的那些。该高分子材料组合物用于例如包括壳体中的断路器或隔离开关等开关装置的高电压装置的绝缘结构。

10. 发明授权

US5479443A Hybrid digital radio-relay system 失效
标题翻译：混合数字无线电中继系统
公开(公告)号：US5479443A
公开(公告)日：1995-12-26
申请号：US133337
申请日：1993-10-08
申请人： Osamu Kagami , Kazuji Watanabe , Kozo Morita
发明人： Osamu Kagami , Kazuji Watanabe , Kozo Morita
IPC分类号： H04B7/155 , H04B7/165 , H04B7/17 , H04J1/10
CPC分类号： H04B7/15528
摘要： A digital radio-relay system has a transmitting terminal station, at least one repeater station a receiving terminal station, a non-regenerative repeater station which does not regenerate a digital signal in order to simplify and reduce cost of the system, while keeping excellent signal quality in transmission. Each repeater station has a plurality of sub-units relating to respective sub-system signals each having a plurality of carriers so that the frequency spectrum of each sub-system signal is allocated on a frequency axis based upon a frequency division multiplex system. A repeater station having a first frequency converter to convert a received radio frequency to IF frequency, bandpass filters for deriving one of the carriers in each sub-system signal, amplifiers to amplify the derived carrier on IF band stage, and a second frequency converter to convert the IF frequency to radio frequency, has a common reference oscillator which generates a reference frequency which is a common divisor of all the local frequencies for all the radio frequencies of all the sub-system signals. Only one of an upper and lower heterodyne signals is taken in all the frequency conversions, so that distortion in each relay section is added in-phase. Leaked noise caused by the bandpass filters is added to original carrier in-phase. All the distortion thus added in the relay sections can be compensated by a transversal equalizer in the receiving terminal station. Therefore, excellent signal quality is obtained although a simple non-regenerative repeater station is used.
摘要翻译：数字无线电中继系统具有发送终端站，至少一个中继站，接收终端站，不再生数字信号的非再生中继站，以便简化和降低系统的成本，同时保持优良的信号传输质量。每个中继站具有与分别具有多个载波的各个子系统信号相关的多个子单元，使得每个子系统信号的频谱基于频分多路复用系统被分配在频率轴上。一种具有第一频率转换器以将接收到的射频转换成IF频率的中继站，用于导出每个子系统信号中的一个载波的带通滤波器，用于在IF频带级上放大导出载波的放大器，以及第二频率转换器将IF频率转换为射频，具有公共参考振荡器，其产生作为所有子系统信号的所有无线电频率的所有本地频率的公约数的参考频率。在所有频率转换中仅采用上外差信号中的一种，因此每个继电器部分的失真同相加法。由带通滤波器引起的泄漏噪声被同时添加到原始载波。所以在继电器部分中增加的所有失真都可以由接收终端中的横向均衡器补偿。因此，虽然使用简单的非再生中继站，但是获得了良好的信号质量。

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