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1. 发明授权

US4902726A Photosensitive resin composition solution 失效
标题翻译：感光树脂组合物溶液
公开(公告)号：US4902726A
公开(公告)日：1990-02-20
申请号：US192785
申请日：1988-05-11
申请人： Nobuyuki Hayashi , Katsushige Tsukada , Tadashi Fujii , Katsunori Tsuchiya
发明人： Nobuyuki Hayashi , Katsushige Tsukada , Tadashi Fujii , Katsunori Tsuchiya
IPC分类号： G03F7/16 , G03C1/74 , G03F7/004 , G03F7/027 , G03F7/038 , H05K3/28
CPC分类号： H05K3/287 , G03F7/0048 , G03F7/027
摘要： There is disclosed a photosensitive resin composition solution for formation of a printed wiring board permanent mask to be coated on a substrate to be coated according to the curtain flow coating method or the roll coating method, which comprises (A) an oligomer having at least one epoxy group and at least one polymerizable vinyl group in the side chain, (B) a photopolymerization initiator, (C) an epoxy resin curing agent, (D) a filler and (E) a solvent, characterized in that (1) the solvent (E) contains 10 to 20% by weight of at least one low boiling point solvent selected from the group consisting of methanol, ethanol, methyl ethyl ketone, acetone and ethyl acetate based on the total amount of the solvent, and (2) the composition solution has a viscosity at 25.degree. C. of 100 mPas or more and 200 mPas or less.
摘要翻译：公开了一种感光性树脂组合物溶液，其用于根据帘式流涂法或辊涂法形成待涂布基板上的印刷线路板永久性掩模，其包含（A）至少具有一种环氧基和侧链中的至少一个可聚合乙烯基，（B）光聚合引发剂，（C）环氧树脂固化剂，（D）填料和（E）溶剂，其特征在于（1）溶剂（E）含有10至20重量％的至少一种选自甲醇，乙醇，甲基乙基酮，丙酮和乙酸乙酯的低沸点溶剂，基于溶剂的总量，和（2）组合物溶液在25℃下的粘度为100mPa·s以上且200mPa·s以下。

2. 发明授权

US4499163A Soldering mask formed from a photosensitive resin composition and a photosensitive element 失效
标题翻译：由感光性树脂组合物和光敏元件形成的焊接掩模
公开(公告)号：US4499163A
公开(公告)日：1985-02-12
申请号：US512660
申请日：1983-07-11
申请人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi , Shigeru Koibuchi , Asao Isobe
发明人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi , Shigeru Koibuchi , Asao Isobe
IPC分类号： G03F7/004 , C08F2/50 , C08F299/06 , C08G18/67 , G03F7/027 , G03C5/00 , G03C1/78
CPC分类号： G03F7/027 , C08F2/50 , C08F299/065 , C08G18/672
摘要： A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
摘要翻译：一种感光性树脂组合物，其含有（a）20〜75重量份通过使三甲基六亚甲基二异氰酸酯和/或异佛尔酮二异氰酸酯二元醇与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的氨基甲酸酯二丙烯酸酯或二甲基丙烯酸酯化合物，（b）20〜75 重量的玻璃化转变温度为约40〜150℃的线性高分子化合物，和（c）由于光化性光而产生自由基的敏化剂和/或敏化剂体系，耐热性优异，耐热冲击和耐溶剂性，并且适于形成焊接掩模。此外，通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性，耐热冲击性和耐溶剂性优异的保护涂膜，特别适用于焊接掩模。

3. 发明授权

US4438190A Photosensitive resin composition containing unsaturated monomers and unsaturated phosphates 失效
标题翻译：含有不饱和单体和不饱和磷酸盐的感光树脂组合物
公开(公告)号：US4438190A
公开(公告)日：1984-03-20
申请号：US351765
申请日：1982-02-24
申请人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
发明人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
IPC分类号： G03F7/025 , B23K35/22 , C08F2/50 , C08F291/00 , C08G18/67 , C08L75/16 , C09D4/00 , G03F7/027 , G03F7/085 , H05K3/28 , G03C1/68
CPC分类号： C08L75/16 , B23K35/224 , C08F291/00 , C08G18/672 , C09D4/00 , G03F7/027 , G03F7/085 , H05K3/287 , H05K2203/0783 , Y10S430/106 , Y10S430/111 , Y10S430/117 , Y10S430/118 , Y10S430/12 , Y10S430/121 , Y10S430/122 , Y10S430/123
摘要： A photosensitive resin composition comprising (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and salts thereof, (b) a phosphate compound having photopolymeric unsaturated bonds, (c), if necessary, an organic thermoplastic polymer, (d) a photopolymerizable unsaturated compound having at least one terminal ethylene group and (e) a sensitizer and/or a sensitizer system, and a photosensitive element comprising a layer of said photosensitive resin composition and a support film therefor, are provided. The photosensitive resin composition can form a protective coating film with excellent adhesiveness to the substrate surface, and such a protective coating film or, photosensitive element obtained therefrom can be advantageously used as a resist for soldering mask, etc.
摘要翻译：一种光敏树脂组合物，其包含（a）至少一种选自苯并三唑，苯并咪唑，苯并噻唑，其衍生物及其盐的化合物，（b）具有光聚合不饱和键的磷酸酯化合物，（c）如有必要，有机热塑性聚合物，（d）具有至少一个末端亚乙基的光聚合性不饱和化合物和（e）敏化剂和/或敏化剂体系，以及包含所述感光性树脂组合物层及其支持膜的感光元件。感光性树脂组合物可以形成对基材表面具有优异粘附性的保护涂膜，并且这种保护涂膜或由其获得的感光元件可有利地用作焊接掩模等的抗蚀剂。

4. 发明授权

US4035189A Image forming curable resin compositions 失效
标题翻译：成像固化型树脂组合物
公开(公告)号：US4035189A
公开(公告)日：1977-07-12
申请号：US594870
申请日：1975-07-10
申请人： Nobuyuki Hayashi , Asao Isobe , Katsushige Tsukada , Ken Ogawa , Masahiro Abo
发明人： Nobuyuki Hayashi , Asao Isobe , Katsushige Tsukada , Ken Ogawa , Masahiro Abo
IPC分类号： G03F7/031 , G03F7/38 , G03C1/68 , C08F8/18
CPC分类号： G03F7/031 , G03F7/38 , Y10S430/115 , Y10S430/12
摘要： A resist image, which is excellent in adhesiveness and high in physicochemical strengths, can be obtained by using as a resist material a resin composition having such properties that when it is exposed to actinic rays, a latent image (cure-precursor) is formed therein, and when it is subjected to subsequent heating, only the latent image portion is selectively cured.An example of the above-mentioned resin composition is a latently curable epoxy resin composition composed essentially of (A) an epoxy resin prepolymer and (B) a compound having in the molecule at least two groups represented by the formulas (I) and/or (II), ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are individually a hydrogen atom, an alkyl group or aryl group.Another example of the resin composition is a curable resin composition composed mainly of photopolymerization sensitizers and N-methylolacrylamide derivatives represented by the formula, ##STR2## wherein R is a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms; and R' is a hydrogen atom or a methyl group.
摘要翻译：可以通过使用具有这样的性质的树脂组合物作为抗蚀剂材料来获得粘合性和物理化学强度优异的抗蚀剂图像，当其暴露于光化射线时，在其中形成潜像（固化前体）并且当其进行随后的加热时，仅选择性地固化潜像部分。

5. 发明授权

US4025348A Photosensitive resin compositions 失效
标题翻译：感光树脂组合物
公开(公告)号：US4025348A
公开(公告)日：1977-05-24
申请号：US574452
申请日：1975-05-05
申请人： Katsushige Tsukada , Asao Isobe , Toshiaki Ishimaru , Nobuyuki Hayashi , Masahiro Abo
发明人： Katsushige Tsukada , Asao Isobe , Toshiaki Ishimaru , Nobuyuki Hayashi , Masahiro Abo
IPC分类号： C08F2/50 , G03F7/032 , G03F7/038 , G03C1/68
CPC分类号： G03F7/038 , G03F7/032 , Y10S430/106 , Y10S430/115 , Y10S430/117
摘要： A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.
摘要翻译：基本上由（A）具有至少两个末端亚乙基的光聚合性不饱和化合物组成的光敏树脂组合物，（B）在其侧链中具有一个或两个选自以下的官能团的反应性线性高分子量化合物：四氢糠基和N-烷氧基甲基氨基甲酰基，（C）能够在用活性射线照射时引发上述不饱和化合物的聚合的敏化剂，（D）具有至少两个环氧基的化合物，和（E）潜在或潜在性固化剂用于环氧树脂。感光性树脂组合物可以得到耐溶剂性，耐化学性，耐热性和机械强度优异的保护膜，因此可以用于印刷电路板的制造和金属的精密加工。

6. 发明授权

US3989610A Photosensitive epoxy-acrylate resin compositions 失效
标题翻译：光敏环氧丙烯酸酯树脂组合物
公开(公告)号：US3989610A
公开(公告)日：1976-11-02
申请号：US441795
申请日：1974-02-12
申请人： Katsushige Tsukada , Asao Isobe , Nobuyuki Hayashi , Masahiro Abo , Ken Ogawa
发明人： Katsushige Tsukada , Asao Isobe , Nobuyuki Hayashi , Masahiro Abo , Ken Ogawa
IPC分类号： C08F2/46 , C08F2/50 , C08F283/10 , C08G59/42 , C08L63/00 , G03F7/032 , G03F7/038 , C08F8/00 , C08L63/02 , C08L63/10 , G03C1/70
CPC分类号： G03F7/038 , C08F2/46 , C08F283/10 , C08G59/4292 , C08L63/00 , G03F7/032
摘要： A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.
摘要翻译：由（A）具有至少两个末端亚乙基的光聚合性不饱和化合物或（B）能够在照射活性射线时能够引发上述不饱和化合物的聚合的敏化剂的组合物或包含作为必需成分的感光性树脂组合物，（C）含有至少两个环氧基的化合物，和（D）选自双氰胺，p，p'-二氨基二苯基化合物，具有至少两个羧基的多元羧酸，多元羧酸酐及其混合物多元羧酸和多羧酸酐。上述感光性树脂组合物可以得到耐溶剂性，耐化学性，耐热性和机械强度优异的保护膜，因此可用于印刷电路板的制造，金属的精密加工以及粘合剂，涂料的材料，塑料浮雕等。

7. 发明授权

US4272607A Photosensitive resin composition 失效
标题翻译：感光树脂组合物
公开(公告)号：US4272607A
公开(公告)日：1981-06-09
申请号：US782378
申请日：1977-03-29
申请人： Katsushige Tsukada , Nobuyuki Hayashi , Hideo Yamada , Toshiaki Ishimaru , Hajime Kakumaru
发明人： Katsushige Tsukada , Nobuyuki Hayashi , Hideo Yamada , Toshiaki Ishimaru , Hajime Kakumaru
IPC分类号： C08F2/00 , C08F2/44 , C08F2/48 , C08F20/00 , C08F20/10 , G03F7/033 , H05K3/28 , G03C1/68
CPC分类号： G03F7/033 , Y10S430/106
摘要： A photosensitive resin composition comprising (a) a linear polymer or copolymer having tetrahydrofurfuryl groups at side chains, (b) one or more photopolymerizable unsaturated compounds having at least two terminal ethylene groups, and (c) one or more sensitizers which initiate polymerization of said unsaturated compounds by irradiation of active light, has excellent storage stability and photosensitivity. The composition can produce permanent protective films having excellent resistance to solvents, heat resistance and the like and can be used as a solder resist and the like.
摘要翻译：一种光敏树脂组合物，其包含（a）在侧链具有四氢糠基的直链聚合物或共聚物，（b）一种或多种具有至少两个末端亚乙基的可光聚合的不饱和化合物，和（c）一种或多种引发所述不饱和化合物通过活性光照射，具有优异的储存稳定性和光敏性。该组合物可以制造具有优异的耐溶剂性，耐热性等的永久保护膜，并且可以用作阻焊剂等。

8. 发明授权

US4544625A Photosensitive resin composition and photosensitive element 失效
标题翻译：感光树脂组合物和感光元件
公开(公告)号：US4544625A
公开(公告)日：1985-10-01
申请号：US576717
申请日：1984-02-03
申请人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
发明人： Toshiaki Ishimaru , Katsushige Tsukada , Nobuyuki Hayashi
IPC分类号： C08F299/00 , B23K35/22 , C08F2/50 , C08F290/00 , C08F299/06 , C08G18/67 , C23F1/00 , G03F7/027 , G03F7/038 , H05K3/28 , G03C1/68
CPC分类号： G03F7/027 , B23K35/224 , C08F299/065 , C08G18/672 , H05K3/287 , H05K2203/0783 , Y10S430/162
摘要： A photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate with an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total weight of components (a) and (b) is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
摘要翻译：一种感光性树脂组合物，其包含（a）20〜75重量份通过三甲基六亚甲基二异氰酸酯与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的聚氨酯二丙烯酸酯或二甲基丙烯酸酯化合物，（b）20〜75重量份的线性聚合物玻璃化转变温度为约40〜150℃的化合物，（c）由于光化反应而产生自由基的敏化剂和/或敏化剂体系，（d）含有磷酸基团的丙烯酸或甲基丙烯酸酯相对于成分（a）和（b）的总重量，分子中的0.01〜5重量％的耐热性，耐热冲击性和耐溶剂性优异，适合于形成焊接掩模。此外，通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性，耐热冲击性和耐溶剂性优异的保护涂膜，特别适用于焊接掩模。

9. 发明授权

US4108666A Monofunctional monomer-containing photosensitive composition for photoresist 失效
标题翻译：用于光刻胶的单官能含单体光敏组合物
公开(公告)号：US4108666A
公开(公告)日：1978-08-22
申请号：US665883
申请日：1976-03-11
申请人： Nobuyuki Hayashi , Asao Isobe , Katsushige Tsukada , Toshiaki Ishimaru
发明人： Nobuyuki Hayashi , Asao Isobe , Katsushige Tsukada , Toshiaki Ishimaru
IPC分类号： H05K3/00 , B32B27/36 , C08F2/50 , C23C18/16 , C23C18/18 , C23C18/31 , G03F7/027 , H05K3/18 , G03C1/68
CPC分类号： G03F7/027
摘要： A photosensitive composition for a photoresist, which comprises (A) a compound having the following general formula: ##STR1## wherein Z is a cyclic dibasic acid anhydride moiety, R.sup.1 is an alkylene group having 1 to 3 carbon atoms, R.sup.2 is hydrogen or methyl, and R.sup.3 is hydrogen, methyl, ethyl or -CH.sub.2 X in which X is chlorine or bromine, (B) a photopolymerization sensitizer, (C) a polymer being capable of giving a film-forming property, (D) a chain transfer agent and (E) a thermal polymerization inhibitor; and a laminated photosensitive element which has a substantially dry photosensitive layer of the photosensitive composition. The composition and element are capable of giving a minute resist pattern which is excellent as an etching resist or metal plating resist and can be readily removed after etching or metal plating.
摘要翻译：一种光致抗蚀剂用光敏组合物，其包含（A）具有以下通式的化合物：其中Z是环状二元酸酐部分，R 1是具有1至3个碳原子的亚烷基，R 2是氢或甲基，R 3为氢，甲基，乙基或-CH 2 X，其中X为氯或溴，（B）光聚合增感剂，（C）能够提供成膜性的聚合物，（D）链转移剂和（E）热聚合抑制剂; 以及具有基本上干燥的光敏组合物感光层的层压感光元件。组合物和元素能够提供作为抗蚀剂或金属电镀抗蚀剂优异的微小抗蚀剂图案，并且可以在蚀刻或金属电镀之后容易地除去。

10. 发明授权

US4101364A Method of an apparatus for producing film-laminated base plates 失效
标题翻译：薄膜层叠基板的制造方法
公开(公告)号：US4101364A
公开(公告)日：1978-07-18
申请号：US709400
申请日：1976-07-28
申请人： Katsushige Tsukada , Nobuyuki Hayashi , Hideo Yamada , Toshiaki Ishimaru , Asao Isobe , Tadazi Sato
发明人： Katsushige Tsukada , Nobuyuki Hayashi , Hideo Yamada , Toshiaki Ishimaru , Asao Isobe , Tadazi Sato
IPC分类号： H05K3/06 , B29C63/00 , B29C63/02 , B29L9/00 , G03C7/30 , G03F7/004 , G03F7/16 , H05K3/00 , B29C17/00
CPC分类号： B32B37/10 , B29C63/0047 , B29C63/0091 , G03F7/161 , B32B2309/68 , H05K3/0079
摘要： It is herein proposed to laminate a film onto a convex-concaved solid surface in a vacuum to accomplish tight contact between the film and the solid surface. The apparatus includes an air tight housing in which lamination press rolls are arranged, wherein feeding-in and feeding-out of materials such as a base plate and a film for lamination are effected through air tight roll assemblies incorporated in the wall structure of the air tight housing.
摘要翻译：这里提出在真空中将薄膜层压到凸凹固体表面上，以实现薄膜和固体表面之间的紧密接触。该装置包括一个气密的外壳，其中布置有层叠压力辊，其中馈送和馈送诸如基板和用于层压的薄膜的材料通过结合在空气的壁结构中的气密辊组件来实现紧密的住房。

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