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    • 9. 发明授权
    • Photosensitive resin composition and photosensitive element
    • 感光树脂组合物和感光元件
    • US4544625A
    • 1985-10-01
    • US576717
    • 1984-02-03
    • Toshiaki IshimaruKatsushige TsukadaNobuyuki Hayashi
    • Toshiaki IshimaruKatsushige TsukadaNobuyuki Hayashi
    • C08F299/00B23K35/22C08F2/50C08F290/00C08F299/06C08G18/67C23F1/00G03F7/027G03F7/038H05K3/28G03C1/68
    • G03F7/027B23K35/224C08F299/065C08G18/672H05K3/287H05K2203/0783Y10S430/162
    • A photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate with an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total weight of components (a) and (b) is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
    • 一种感光性树脂组合物,其包含(a)20〜75重量份通过三甲基六亚甲基二异氰酸酯与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的聚氨酯二丙烯酸酯或二甲基丙烯酸酯化合物,(b)20〜75重量份的线性聚合物 玻璃化转变温度为约40〜150℃的化合物,(c)由于光化反应而产生自由基的敏化剂和/或敏化剂体系,(d)含有磷酸基团的丙烯酸或甲基丙烯酸酯 相对于成分(a)和(b)的总重量,分子中的0.01〜5重量%的耐热性,耐热冲击性和耐溶剂性优异,适合于形成焊接掩模。 此外,通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性,耐热冲击性和耐溶剂性优异的保护涂膜,特别适用于焊接掩模。