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    • 6. 发明授权
    • Thermosetting resin composition comprising dicyanamide and polyvalent
imide
    • 包含二氰胺和多价酰亚胺的热固性树脂组合物
    • US4482703A
    • 1984-11-13
    • US435766
    • 1982-10-20
    • Akio TakahashiTakeshi ShimazakiMotoyo WajimaHirosada Morishita
    • Akio TakahashiTakeshi ShimazakiMotoyo WajimaHirosada Morishita
    • C08G73/00C08G73/06C08G73/12C09D179/08C08G73/10
    • C08G73/12
    • A thermosetting resin composition comprises (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds. A thermosetting prepolymer can be obtained by subjecting the composition to a preliminary reaction with heating to the B stage and this prepolymer can give a cured product having excellent heat resistance of class C and flexibility. An exemplary composition containing 60 parts by wt. of 4,4'-dicyanomidodiphenylmethane and 40 parts by wt. of N,N'-4,4'-diphenylmethane bismaleimide dissolved in methyl Cellosolve is reacted at 70.degree. to 110.degree. C. for about 40 minutes to obtain a prepolymer soluble in methyl ethyl ketone. This prepolymer when admixed with 2-ethyl-4-methyl-imidazole and after removal of the methyl cellusolve will form an insoluble and infusible cured product upon heating at temperatures on the order of 170.degree. to 200.degree. C. for about 80 minutes. The resin composition when admixed with a solvent, is useful for impregnation and when used as a powder, it is useful as a molding resin.
    • 热固性树脂组合物包含(A)至少一种二氰酰胺化合物和(B)至少一种具有一个或多个不饱和键的多价酰亚胺,并且如果需要(C)至少一种环氧化合物的可聚合化合物,酚类化合物和三烯丙基异氰脲酸酯化合物 。 通过将加热至B阶段的组合物进行预反应,可以获得热固性预聚物,该预聚物可以得到具有优异的C级耐热性和柔软性的固化产物。 含有60重量份的示例性组合物 的4,4'-二氰基二苯基甲烷和40重量份。 溶解在甲基溶纤剂中的N,N'- 4,4'-二苯基甲烷双马来酰亚胺在70〜110℃下反应约40分钟,得到可溶于甲基乙基酮的预聚物。 当与2-乙基-4-甲基 - 咪唑混合并且除去甲基溶液后,该预聚物将在约170℃至200℃的温度下加热约80分钟时形成不溶性和不可渗透的固化产物。 当与溶剂混合时,树脂组合物可用于浸渍,并且当用作粉末时,其可用作模制树脂。