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1. 发明授权

US5151689A Display device with matrix-arranged pixels having reduced number of vertical signal lines 失效
标题翻译：具有矩阵排列像素的显示装置具有减少数量的垂直信号线
公开(公告)号：US5151689A
公开(公告)日：1992-09-29
申请号：US341789
申请日：1989-04-21
申请人： Nobuaki Kabuto , Mayumi Igarashi , Fumio Inoue , Kunio Ando
发明人： Nobuaki Kabuto , Mayumi Igarashi , Fumio Inoue , Kunio Ando
IPC分类号： G02F1/133 , G02F1/1343 , G02F1/1345 , G02F1/136 , G02F1/1362 , G02F1/1368 , G09F9/30 , G09G3/36 , H04N3/12
CPC分类号： G02F1/136286 , G02F1/1345 , G09G3/3648 , G09G3/3677 , G09G3/3688 , H04N3/127 , H04N3/1575 , H04N5/335 , G09G2300/0426 , G09G2310/0205 , G09G2310/0224 , G09G2310/0283 , G09G2310/0297 , G09G2310/066
摘要： In a display panel including a plurality of signals lines along a column direction and a plurality of scanning lines along a row direction for applying a display signal to display elements forming pixels arranged in a matrix form of rows and columns on a substrate, a switching arrangement for connecting at least two display elements to a signal line in each row is line-sequentially scanned by the scanning lines so that the display signal is time-serially applied through the same signal line to each of the at least two display elements connected to that signal line. Thereby, total number of the signal lines can be reduced to a value equal to or smaller than the number of display elements in the row direction.
摘要翻译：在包括沿着列方向的多条信号线和沿着行方向的多条扫描线的显示面板中，用于向显示信号施加显示信号以在基板上形成以行和列的矩阵形式布置的像素的显示元件，切换装置用于将至少两个显示元件连接到每一行中的信号线被扫描线逐行扫描，使得显示信号通过相同的信号线被时间序列地施加到连接到该信号线的至少两个显示元件中的每一个信号线。从而，可以将信号线的总数减少到等于或小于行方向上的显示元件的数量的值。

2. 发明授权

US5396257A Mutiscreen display apparatus 失效
标题翻译：多画面显示装置
公开(公告)号：US5396257A
公开(公告)日：1995-03-07
申请号：US889117
申请日：1992-05-26
申请人： Ryuuichi Someya , Fumio Inoue , Nobuaki Kabuto , Fumio Haruna , Takeshi Maruyama
发明人： Ryuuichi Someya , Fumio Inoue , Nobuaki Kabuto , Fumio Haruna , Takeshi Maruyama
IPC分类号： G06F3/153 , G09G5/395 , H04N5/57 , H04N9/12 , G09G1/00
CPC分类号： G09G5/395 , G06F3/153 , H04N5/57 , H04N9/12 , G09G2300/026 , G09G2320/0233 , G09G2320/0626
摘要： The present invention relates to a multiscreen display apparatus in which one large screen is formed by combining screens of a plurality of display units. The multiscreen display apparatus includes data converters respectively provided in the display units, the data converters receiving video signal data represented in a digital form and correcting the video signal data according to correction data obtained on the basis of display characteristics of the display units to make luminance or color shading of a plurality of divisional regions of the screen of each display unit uniform, and a control unit for controlling data correction operations of the plurality of data converters as a whole.
摘要翻译：本发明涉及一种多画面显示装置，其中通过组合多个显示单元的屏幕形成一个大屏幕。多画面显示装置包括分别设置在显示单元中的数据转换器，数据转换器接收以数字形式表示的视频信号数据，并根据基于显示单元的显示特性获得的校正数据校正视频信号数据，以使亮度或每个显示单元的屏幕的多个分割区域的色彩均匀，以及用于整体控制多个数据转换器的数据校正操作的控制单元。

3. 发明授权

US4333105A Beam-indexing color television receiver 失效
标题翻译：光束索引彩色电视接收机
公开(公告)号：US4333105A
公开(公告)日：1982-06-01
申请号：US179895
申请日：1980-08-20
申请人： Masaro Kaku , Kunio Ando , Toyota Honda , Fumio Inoue
发明人： Masaro Kaku , Kunio Ando , Toyota Honda , Fumio Inoue
IPC分类号： H04N9/24
CPC分类号： H04N9/24
摘要： A beam-indexing color television receiver having a phosphor screen including one index stripe for every predetermined integral number of phosphor stripe sets each including a red, a green and a blue phosphor stripe. The minimum bias current is supplied to the picture tube only upon detection of a chrominance signal within a predetermined hue range around a specific chrominance signal corresponding to the phosphor stripe which is in the middle between adjacent index stripes on the phosphor screen, thus attaining a superior color saturation and contrast.
摘要翻译：一种具有荧光屏的光束分度彩色电视接收机，每个包含红色，绿色和蓝色荧光体条的每个预定的整数个荧光条纹集合包括一个折射条。仅当在与荧光屏上的相邻索引条之间的中间的荧光条相对应的特定色度信号周围的预定色调范围内检测到色度信号时，才将最小偏置电流提供给显像管，从而获得优异的色彩饱和度和对比度。

4. 发明授权

US4507585A Beam-indexing color picture tube arrangement 失效
标题翻译：光束分度彩色显像管布置
公开(公告)号：US4507585A
公开(公告)日：1985-03-26
申请号：US418672
申请日：1982-09-16
申请人： Fumio Inoue , Hiroshi Jitsukata , Kunio Ando
发明人： Fumio Inoue , Hiroshi Jitsukata , Kunio Ando
IPC分类号： H01J29/34 , H04N9/24 , H01J29/89 , H01J29/18
CPC分类号： H04N9/24 , H01J29/34 , H01J2231/121
摘要： A frontal light extraction type beam-indexing color picture tube arrangement comprises a phosphor screen which is formed on the inner surface of the tube panel and includes an array of color phosphor stripes each of which has an appropriate afterglow time and an array of index phosphor stripes each of which has a short afterglow time and emits a light index signal representative of the scanning position of an electron beam in the forward direction of the tube panel. A photoelectric converter for receiving the light index signal is provided in front of the tube panel.
摘要翻译：前方光提取型光束分度彩色显像管装置包括形成在管板的内表面上的荧光屏，并且包括彩色荧光条阵列，每个彩色荧光条具有适当的余辉时间和一系列指示荧光条其中每个具有短的余辉时间，并且发射表示电子束在管板前进方向的扫描位置的光指数信号。用于接收光指数信号的光电转换器设置在管板的前面。

5. 发明授权

US09075043B2 Sample analyzer, sample information processing apparatus, and sample analysis method 有权
标题翻译：样品分析仪，样品信息处理设备和样品分析方法
公开(公告)号：US09075043B2
公开(公告)日：2015-07-07
申请号：US14035541
申请日：2013-09-24
申请人： Toru Mizumoto , Fumio Inoue
发明人： Toru Mizumoto , Fumio Inoue
IPC分类号： G01N33/493 , G01N35/00 , G01N33/50
CPC分类号： G01N33/50 , G01N33/493 , G01N35/00603 , G01N35/00613 , G06F19/00 , G16H10/40
摘要： A sample analyzer includes: a first measurement part which performs measurement on a sample for a first measurement item; a second measurement part which performs a measurement on the sample for a second measurement item; an output section; and a controller configured to control the output section to output, when a time difference between a measurement on a sample performed by the first measurement part and a measurement on the sample performed by the second measurement part exceeds a predetermined time period, information based on an excess of the time difference.
摘要翻译：样品分析器包括：对第一测量项目的样品进行测量的第一测量部件; 对第二测量项目的样本进行测量的第二测量部件; 输出部分; 以及控制器，其被配置为当所述第一测量部件执行的样本的测量与由所述第二测量部件执行的样本的测量之间的时间差超过预定时间段时，控制所述输出部分输出信息，所述信息基于超时的时差。

6. 发明申请

US20080010819A1 CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：连接板和多层接线板，用于半导体封装的基板和使用连接板的半导体封装及其制造方法
公开(公告)号：US20080010819A1
公开(公告)日：2008-01-17
申请号：US11775294
申请日：2007-07-10
申请人： Hidehiro NAKAMURA , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
发明人： Hidehiro NAKAMURA , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
IPC分类号： H05K3/30
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/0097 , H05K3/06 , H05K3/244 , H05K3/4038 , H05K3/4623 , H05K3/4632 , H05K3/4647 , H05K2201/0141 , H05K2201/0195 , H05K2201/0355 , H05K2201/0361 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0384 , H05K2203/0733 , H05K2203/1536 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
摘要翻译：本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体，连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

7. 发明授权

US07187072B2 Fabrication process of semiconductor package and semiconductor package 失效
标题翻译：半导体封装和半导体封装的制造工艺
公开(公告)号：US07187072B2
公开(公告)日：2007-03-06
申请号：US10705706
申请日：2003-11-10
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L21/00
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
摘要翻译：提供了半导体封装基板，可以满足向半导体集成度高的趋势。将镍层电镀在电镀铜箔上以形成布线图案。将LSI芯片安装在铜箔上，通过引线接合连接LSI芯片和布线图案的端子，然后用半导体密封环氧树脂密封。只有铜箔用碱蚀刻剂溶解掉才能暴露镍。对于具有低铜溶力的镍剥离器，去除镍层以露出布线图案。涂覆阻焊剂，并且以使连接端子部分露出的方式形成图案。将焊球放置在布线图案的露出部分，然后熔合。布线图案通过焊球与外部印刷电路板连接。

8. 发明授权

US07043860B2 Symbol illuminator of game machine 失效
标题翻译：游戏机的符号照明器
公开(公告)号：US07043860B2
公开(公告)日：2006-05-16
申请号：US10436106
申请日：2003-05-13
申请人： Fumio Inoue
发明人： Fumio Inoue
IPC分类号： A63F5/04
CPC分类号： G09F13/16
摘要： A symbol illuminator of game machines includes a wheel member having symbols at an outer circumferential surface thereof; a casing for the wheel member attached a printed circuit board having a plurality of illuminants; and a reflective frame member having enclosure walls expanding outwardly to a forward direction from a central part thereof, having a plurality of windows into which the illuminants are set, the illuminants being arranged so as to project inside a center part of the reflective frame member; and a projection part, having a reflective face, reflecting the light emitted by the illuminants toward at least the symbol from the inner side of the wheel member so that it can irradiate a reflex of a reflective frame member equally without spots to the symbol of wheel member and can reduce the number of the parts.
摘要翻译：游戏机的符号照明器包括在其外周面具有符号的车轮构件; 用于车轮构件的壳体，其附接有具有多个发光体的印刷电路板; 以及反射框架构件，其具有从其中心部朝向前方向向外扩展的外壳壁，具有设置有所述发光体的多个窗口，所述发光体被布置成在所述反射框架构件的中心部分内突出; 以及具有反射面的突出部，其将由所述发光体发射的光朝向所述轮构件的内侧的至少符号反射，使得其可以将反射框架构件的反射相等地照射到轮的符号上会员可以减少零件数量。

9. 发明授权

US06540227B2 Symbol displaying unit used for a game machine 失效
公开(公告)号：US06540227B2
公开(公告)日：2003-04-01
申请号：US09866618
申请日：2001-05-30
申请人： Fumio Inoue
发明人： Fumio Inoue
IPC分类号： A63B7100
CPC分类号： G07F17/3213 , Y10T29/53022 , Y10T29/53178 , Y10T74/19684
摘要： A case of a stepping motor is divided by a partition. One of divided portions of the case contains a rotor and a stator of the stepping motor. A small-sized drive gear is fixed to a drive shaft integrally rotated with the rotor. The drive gear is meshed with a larger gear of a transmission gear. This transmission gear includes a smaller gear integrally rotated with the larger gear. The smaller gear is meshed with a large-sized output gear fixed to an output shaft of the stepping motor. Two pairs of the reduction gear mechanisms transmit a rotation of the drive shaft to the output shaft in a reduced state.

10. 发明授权

US08809696B2 Method for surface treatment of copper and copper 有权
标题翻译：铜和铜的表面处理方法
公开(公告)号：US08809696B2
公开(公告)日：2014-08-19
申请号：US13060095
申请日：2009-06-17
申请人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
发明人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
IPC分类号： H05K1/00
CPC分类号： C23F1/18 , C23F1/02 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H05K3/384 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , Y10T29/49982 , Y10T428/12438 , Y10T428/12771 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014
摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
摘要翻译：本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸铜表面和用该方法处理的铜。表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

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