专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012138625A Cleaning member, conveyance member with cleaning function, and cleaning method of substrate processing apparatus 审中-公开
标题翻译：清洁会员，具有清洁功能的输送构件和基板处理装置的清洁方法
公开(公告)号：JP2012138625A
公开(公告)日：2012-07-19
申请号：JP2012083791
申请日：2012-04-02
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUGAO YUKI , TERADA YOSHIO , UENDA DAISUKE , NAMIKAWA AKIRA , YOSHIDA YOSHITOKU , MAENO YOHEI
IPC分类号： H01L21/304 , H01L21/677
CPC分类号： H01L21/67046 , B08B1/00 , B08B7/0028 , C23C16/4407
摘要： PROBLEM TO BE SOLVED: To provide a cleaning member which can remove fine foreign matters, preferably foreign matters of submicron level, conveniently, reliably and sufficiently without causing the pollution at a cleaned part, and to provide a conveyance member with a cleaning function having the cleaning member, and a cleaning method of a substrate processing apparatus using the conveyance member with a cleaning function.SOLUTION: The cleaning member has a cleaning layer provided with a plurality of protrusions of columnar structure on the surface. The protrusion of columnar structure has an aspect ratio of 5 or higher, and the density of the protrusions of columnar structure on the surface of the cleaning layer is 1.0×10pieces/cmor higher.
摘要翻译：解决方案：提供一种可以方便，可靠且充分地除去微细异物，优选亚微米级异物而不会在清洁部分造成污染的清洁部件，并提供具有清洁的输送部件具有清洁部件的功能以及使用具有清洁功能的传送部件的基板处理装置的清洁方法。解决方案：清洁构件具有在表面上设置有多个柱状结构的突起的清洁层。柱状结构的突起的纵横比为5以上，清洗层表面的柱状结构的突起的密度为1.0×10 8 2 或更高版本。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2006264296A Multilayer sheet, its manufacturing method, and adhesive sheet using the multilayer sheet 有权
标题翻译：多层板，其制造方法和使用多层板的粘合片
公开(公告)号：JP2006264296A
公开(公告)日：2006-10-05
申请号：JP2005233266
申请日：2005-08-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YOSHIDA YOSHITOKU , AKAZAWA MITSUHARU , KONYA TOMOHIRO , YANO KOHEI
IPC分类号： B32B27/40 , C09J7/02 , C09J201/00
CPC分类号： H01L21/6836 , B32B27/40 , C08G18/6208 , C08L33/06 , C08L2666/04 , C09J7/29 , C09J175/04 , C09J2201/162 , C09J2203/326 , C09J2433/006 , C09J2475/006 , H01L2221/68327 , Y10T428/31504 , Y10T428/31565 , Y10T428/31573
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet used for processing products such as semiconductor wafers or the like, which prevents contamination or damage of the semiconductor wafers or the like during processing, and which reduces warpage of the products caused by residual stress of the adhesive sheet, and to provide a laminated sheet used for the adhesive sheet. SOLUTION: The multilayer sheet comprises a composite film containing urethane polymer and vinyl polymer as active ingredients, and a first film composed of material different from the composite film. The urethane polymer is composed by using polyolefine diol and polyisocyanate. The adhesive sheet is obtained by providing an adhesive agent layer on at least one face of the multilayer sheet. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供用于加工诸如半导体晶片等的产品的粘合片，其防止在加工期间的半导体晶片等的污染或损坏，并且减少由残余物引起的产品的翘曲并且提供用于粘合片的层压片。解决方案：多层片材包含含有聚氨酯聚合物和乙烯基聚合物作为活性成分的复合膜和由与复合膜不同的材料构成的第一膜。聚氨酯聚合物由聚烯烃二醇和多异氰酸酯组成。通过在多层片材的至少一个面上设置粘合剂层来获得粘合片。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006232930A Pressure-sensitive adhesive sheet, its manufacturing method and processing method of product 有权
标题翻译：压敏粘合片及其制造方法及其加工方法
公开(公告)号：JP2006232930A
公开(公告)日：2006-09-07
申请号：JP2005047505
申请日：2005-02-23
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： AKAZAWA MITSUHARU , YOSHIDA YOSHITOKU , KONYA TOMOHIRO , YANO KOHEI
IPC分类号： C09J7/02 , B32B27/30
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet used for processing a product such as a semiconductor wafer and reducing warping of the product caused by residual stress of the adhesive sheet without staining or breaking the semiconductor wafer etc. during processing.
SOLUTION: The pressure-sensitive adhesive sheet has an intermediate layer and an adhesive layer in this order on one side of a substrate having a tensile modulus at 25°C of ≥600 MPa. The intermediate layer is an acrylic polymer layer having a tensile modulus at 25°C of 1-100 MPa.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供用于加工半导体晶片的产品的压敏粘合片，并且减少由粘合片的残余应力引起的产品翘曲，而不会使半导体晶片等发生染色或破裂处理。解决方案：压敏粘合片在25℃的拉伸模量≥600MPa的基材的一面上依次具有中间层和粘合剂层。中间层是在25℃下的拉伸弹性模量为1-100MPa的丙烯酸类聚合物层。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004339406A Optical film, its manufacturing method and image display device 审中-公开
标题翻译：光学薄膜，其制造方法和图像显示装置
公开(公告)号：JP2004339406A
公开(公告)日：2004-12-02
申请号：JP2003138953
申请日：2003-05-16
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MAENO YOHEI , YOSHIDA YOSHITOKU , HATA MASAHIRO , SHIMODAIRA KIICHI
IPC分类号： G02B5/30 , C08J5/18 , C08L57/00 , C08L75/04 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To provide an optical film having reduced oriented birefringence. SOLUTION: The optical film comprises a composite film comprising a urethane polymer and a vinyl polymer and has an oriented birefringence: nx-ny of less than 5×10 -5 , where nx is a refractive index in the direction of the X-axis, that is, the direction having the maximum in-plane refractive index of the composite film, and ny is the refractive index in the direction of the Y-axis, that is, the direction rectangularly crossing the X-axis. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有降低的取向双折射率的光学膜。光学膜包括含有聚氨酯聚合物和乙烯基聚合物的复合膜，并且具有小于5×10 -5 的取向双折射nx-ny，其中nx是折射率指向X轴方向，即具有复合膜的最大面内折射率的方向，ny是Y轴方向的折射率，即矩形方向的方向 X轴。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2009120663A Composite film 有权
标题翻译：复合膜
公开(公告)号：JP2009120663A
公开(公告)日：2009-06-04
申请号：JP2007294250
申请日：2007-11-13
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IMOTO EIICHI , NAGASAKI KUNIO , YOSHIDA YOSHITOKU , SUZUKI SHUSUKE
IPC分类号： C08J5/18 , C08G18/00 , C08L33/06 , C08L75/00
CPC分类号： C08G18/672 , C08F283/006 , C08F290/067 , C08G18/4854 , C08G18/757 , C08G2170/40 , C08L33/08 , C08L75/04 , C08F220/06 , C08F220/18 , C08F220/36 , C08G18/48 , C08L2666/20
摘要： PROBLEM TO BE SOLVED: To provide a composite film having flexibility and water tightness. SOLUTION: The composite film includes an acrylic polymer and a urethane polymer. The acrylic polymer is obtained by using at least an acrylic acid-based monomer and a monofunctional (meth)acrylic monomer providing a homopolymer having a ≥0°C glass transition temperature (Tg), and has a ≥1 wt.% and ≤30 wt.% content of acrylic acid in the acrylic component. The urethane polymer is obtained by using a urethane component obtained by reacting a diol and a diisocyanate, and has an NCO/OH ratio (in equivalent) of 1.1 to 2.0. The composite film contains an N,N-dimethylformamide(DMF)-soluble component. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有柔软性和防水性的复合膜。解决方案：复合膜包括丙烯酸聚合物和聚氨酯聚合物。通过使用至少一种丙烯酸类单体和提供≥0℃玻璃化转变温度（Tg）的均聚物的单官能（甲基）丙烯酸单体，并且具有≥1重量％和≤30 丙烯酸组分中丙烯酸含量的重量百分比。氨基甲酸酯聚合物通过使用由二醇和二异氰酸酯反应得到的氨基甲酸酯组分，其NCO / OH比（当量）为1.1〜2.0。复合膜含有N，N-二甲基甲酰胺（DMF） - 可溶成分。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009074011A Method of manufacturing adhesive tape 有权
标题翻译：制造胶粘带的方法
公开(公告)号：JP2009074011A
公开(公告)日：2009-04-09
申请号：JP2007246885
申请日：2007-09-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , KAWAZOE SHOZO , YOSHIDA YOSHITOKU
IPC分类号： C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an adhesive tape having necessary adhesive force to an adherend, enabling a foreign submicron of a submicron level to be removed without contamination in a cleaning portion, showing excellent heat resistance, exhibiting sufficient adhesive force and cohesive force even at a high temperature, and capable of being easily peeled from the adherend without leaving paste in the cleaning portion when the tape is peeled from the adherend after use. SOLUTION: In the method of manufacturing the adhesive tape having an aggregation layer of glancing pillar structures mounted on a surface of a support, each glancing pillar structure protruding at an angle of elevation of less than 90 degrees from the surface and having an aspect ratio of not less than 1, wherein the glancing pillar structure is formed by a glancing angle vapor deposition method. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种制造对被粘物具有必要的粘合力的粘合带的方法，使得能够除去在清洁部分中没有污染的亚微米级的外来亚微米，显示出优异的耐热性，表现出足够的粘合力和内聚力，并且当带子从使用后的被粘物体剥离时，能够容易地从被粘物上剥离而不会留下清洁部分中的糊料。解决方案：在制造具有安装在支撑体表面上的扫视柱结构聚集层的粘合带的方法中，每个扫视柱结构以与表面小于90度的仰角倾斜并且具有长宽比不小于1，其中扫掠柱结构通过幻影气相沉积法形成。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008201883A Adhesive member having ridge-like fine structure 审中-公开
标题翻译：具有类似RIDGE的结构的粘合构件
公开(公告)号：JP2008201883A
公开(公告)日：2008-09-04
申请号：JP2007039107
申请日：2007-02-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MAENO YOHEI , YOSHIDA YOSHITOKU , SUGAO HISAKI
IPC分类号： C09J7/02
CPC分类号： C09J7/30 , C09J7/22
摘要： PROBLEM TO BE SOLVED: To provide an adhesive member indicating excellent adhesion characteristic, and its manufacturing method.
SOLUTION: The adhesive member is the adhesive member including a base material and a pillar-like projection part formed on a surface of the base material, and the pillar-like projection part has a ridge-like fine structure on the side surface. The manufacturing method for the adhesive member includes the step (1) for filling the resin in a porous film hole on the base material, the step (2) for forming the pillar-like projection part on the base material by curing the resin, the step (3) for removing the porous film from the base material, and the step (4) for performing plasma etching treatment on the pillar-like projection part.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种表现出优异的粘合特性的粘合剂及其制造方法。解决方案：粘合构件是包括形成在基材的表面上的基材和柱状突起部的粘合构件，并且柱状突起部在侧面具有脊状的微细结构。粘合剂的制造方法包括将树脂填充到基材上的多孔膜孔中的工序（1），通过固化树脂在基材上形成柱状突起部的工序（2），用于从基材除去多孔膜的步骤（3）和用于对柱状突起部进行等离子体蚀刻处理的步骤（4）。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008115272A Thermally strippable double-faced pressure-sensitive adhesive sheet and method of working workpiece 审中-公开
标题翻译：耐热双折敏压敏粘合片及其工作方法
公开(公告)号：JP2008115272A
公开(公告)日：2008-05-22
申请号：JP2006299737
申请日：2006-11-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KIUCHI KAZUYUKI , YOSHIDA YOSHITOKU
IPC分类号： C09J7/02 , C09J201/00 , H01L21/304
CPC分类号： H01L21/6836 , C09J5/06 , C09J7/26 , C09J7/29 , C09J2201/128 , C09J2205/302 , C09J2400/243 , H01L21/6835 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01057 , H01L2924/19041 , Y10T428/249953
摘要： PROBLEM TO BE SOLVED: To provide a thermally strippable double-faced pressure-sensitive adhesive sheet that, in the working of the back side of a workpiece while having its one face stuck to the front side of the workpiece and having its other face stuck to a support as a pedestal, can avoid floating of the support and cracking of the workpiece at working attributed thereto even when the workpiece has a highly uneven surface. SOLUTION: The thermally strippable double-faced pressur-sensitive adhesive sheet is one having a thermally strippable adhesive layer A superimposed on one side face of a base material and a pressure-sensitive adhesive layer B superimposed on the other side face of the base material, and characterized in that the base material is a porous base material. The porous base material is preferably one having density of 0.9 g/cm 3 or below and a tensile elastic modulus of 20 MPa or below. The base material may consist of a laminate of a porous base material and a nonporous base material. As an adhesive for constructing the pressure-sensitive adhesive layer (B), use can be made of, for example, a pressure-sensitive adhesive, an ultraviolet hardening adhesive, a thermally strippable adhesive, a thermoplastic adhesive, a thermosetting adhesive, etc. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种可热剥离的双面压敏粘合片，其在工件的背面的工作中同时将其一个面粘贴在工件的前侧并具有其它的作为基座的支撑面粘贴在支撑体上，即使当工件具有高度不均匀的表面时，也可以避免工件在工作时的浮动和工作异常。热剥离双面压敏粘合片是具有叠层在基材的一个侧面上的热剥离性粘合剂层A和叠层在基材的另一个侧面上的粘合剂层B 基材，其特征在于，所述基材为多孔基材。多孔基材优选为0.9g / cm 3以上且拉伸弹性模量为20MPa以下的密度。基材可以由多孔基材和无孔基材的层压体组成。作为构成粘合剂层（B）的粘合剂，可以使用例如压敏粘合剂，紫外线固化粘合剂，热剥离性粘合剂，热塑性粘合剂，热固性粘合剂等。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007277282A Pressure-sensitive adhesive sheet for processing semiconductor wafer 审中-公开
标题翻译：用于加工半导体滤波器的压敏粘合片
公开(公告)号：JP2007277282A
公开(公告)日：2007-10-25
申请号：JP2006101418
申请日：2006-04-03
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HASHIMOTO KOICHI , TAKAHASHI TOMOKAZU , YOSHIDA YOSHITOKU
IPC分类号： C09J7/02 , B32B27/00 , B32B27/30 , C09J11/06 , C09J133/06 , C09J163/00 , C09J175/04 , C09J201/02 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for processing a semiconductor wafer, which is a repeelable type pressure-sensitive adhesive sheet of which adhesive force is decreased by the irradiation of a radiation, without reducing the effect of decreasing the adhesive force by the irradiation of the radiation even on preserving for a long time and useful as a holding sheet, etc., of a dicing process. SOLUTION: This pressure-sensitive adhesive sheet for processing the semiconductor wafer is provided by having a radiation-responding pressure-sensitive adhesive layer (layer B) containing a (meth)acrylic acid alkyl ester copolymer as a base polymer and also 0.1 pt.wt. to 300 pts.wt. radiation-polymerizable compound having ≥2 carbon-carbon double bonds in its molecule based on 100 pts.wt. (meth)acrylic acid alkyl ester copolymer on at least one side of a substrate material film (layer A) consisting mainly of the (meth)acrylic acid alkyl ester copolymer, and the viscosity of the radiation-polymerizable compound at 60°C is ≥1 Pa s or its weight-average molecular weight is ≥1,000. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于加工半导体晶片的压敏粘合片，该半导体晶片是通过辐射照射而粘附力降低的可重复型压敏粘合片，而不会降低即使长时间保存，也可以通过照射辐射来降低粘合力，并且可用作切割工艺的保持片等。解决方案：用于处理半导体晶片的压敏粘合片通过具有含有（甲基）丙烯酸烷基酯共聚物作为基础聚合物的辐射响应性压敏粘合剂层（B层）和0.1 pt.wt. 至300磅其分子中具有≥2个碳 - 碳双键的辐射聚合性化合物为100重量份。（甲基）丙烯酸烷基酯共聚物在主要由（甲基）丙烯酸烷基酯共聚物组成的基材材料膜（A层）的至少一面和60℃下的辐射聚合性化合物的粘度为≥ 1Pa s或其重均分子量≥1000。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007070432A Pressure-sensitive adhesive sheet and method of processing product using the pressure-sensitive adhesive sheet 审中-公开
标题翻译：压敏粘合片和使用压敏粘合片加工产品的方法
公开(公告)号：JP2007070432A
公开(公告)日：2007-03-22
申请号：JP2005257674
申请日：2005-09-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YANO KOHEI , AKAZAWA MITSUHARU , YOSHIDA YOSHITOKU , KONYA TOMOHIRO
IPC分类号： C09J7/02 , C09J133/00 , H01L21/304
CPC分类号： C09J7/29 , C09J2201/162 , C09J2203/326 , C09J2433/006
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which is used in processing products such as semiconductor wafers, does not stain nor damage the semiconductor wafers during processing and reduces warping of the products due to the residual stress of a pressure-sensitive adhesive sheet and a laminated sheet used for the pressure-sensitive adhesive sheet.
SOLUTION: The pressure-sensitive adhesive sheet has a substrate, an intermediate layer and a pressure-sensitive adhesive layer in this order. The intermediate layer has a tensile modulus at 23°C of ≥10 MPa and ≤100 MPa and is composed of an acrylic polymer obtained by polymerizing a mixture of 70 pts.wt. -99 pts.wt. of a (meth)acrylate monomer and 1 pt.wt. -30 pts.wt. of an unsaturated carboxylic acid in the total amount of 100 pts.wt. The substrate includes at least one layer having a tensile modulus at 23°C of ≥0.6 GPa.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于加工诸如半导体晶片的产品的压敏粘合片，在加工过程中不会污染或损坏半导体晶片，并且减少由于残留应力引起的产品翘曲压敏粘合片和用于压敏粘合片的层压片。解决方案：压敏粘合片依次具有基材，中间层和压敏粘合剂层。中间层在23℃下的拉伸弹性模量≥10MPa，≤100MPa，由通过聚合70重量份的混合物而得到的丙烯酸类聚合物构成。 -99磅的（甲基）丙烯酸酯单体和1重量份 -30磅的不饱和羧酸，总量为100重量份。衬底包括至少一层在23℃下的拉伸模量≥0.6GPa的层。版权所有（C）2007，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式