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1. 发明专利

JP2014211929A 回路付きサスペンション基板および回路付きサスペンション基板集合体シートならびにこれらの製造方法有权
标题翻译：具有电路的悬挂基板，具有电路的悬架基板组件板及其制造方法
公开(公告)号：JP2014211929A
公开(公告)日：2014-11-13
申请号：JP2013088031
申请日：2013-04-19
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： SUGIMOTO YU , SAKAKURA TAKATOSHI
IPC分类号： G11B5/60 , G11B21/21 , H05K1/02 , H05K1/05
CPC分类号： G11B5/484 , G11B5/4846 , G11B5/84 , Y10T29/49071 , Y10T156/10
摘要：【課題】接続端子が汚染または損傷する可能性が低減された回路付きサスペンション基板および回路付きサスペンション基板集合体シートならびにこれらの製造方法を提供する。【解決手段】絶縁層41の一面および他面上にそれぞれ第1および第2の積層構造L1,L2が形成される。第1の積層構造L1、絶縁層41および第2の積層構造L2により積層体L0が形成される。第1の積層構造L1には熱アシスト用配線パターンH1,H2が含まれ、第2の積層構造L2には支持基板10と接続端子25,26とが含まれる。接続端子25,26の表面は、絶縁層41の他面側において露出する。接続端子25,26を含む積層体L0の第1の部分P1の厚みは、接続端子25,26の両側の部分を含む積層体L0の第2および第3の部分P2,P3の厚みよりも小さい。【選択図】図2
摘要翻译：要解决的问题：提供一种具有电路的悬架基板，具有电路及其制造方法的悬置基板组装片，具有降低的连接端子的污染或损坏的可能性。解决方案：第一和第二层压结构L1，L2是分别形成在隔离层41的一个表面和另一个表面上。第一层压结构L1，隔离层41和第二层压结构L2一体地形成层压体L0。第一层叠结构L1包括用于热辅助H1，H2的布线图案。第二层叠结构L2包括支撑基板10和连接端子25,26。连接端子25,26的表面暴露在隔离层41的另一个表面的一侧。层压体的第一部分P1的厚度包括连接端子25,26的L0小于包括连接端子25,26两端的层压体L0的第二或第三部分P2，P3的厚度。

2. 发明专利

JP2012104189A Suspension substrate with circuit and method for manufacturing the same 有权
标题翻译：具有电路的悬挂基板及其制造方法
公开(公告)号：JP2012104189A
公开(公告)日：2012-05-31
申请号：JP2010251655
申请日：2010-11-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUGIMOTO YU
IPC分类号： G11B5/60
CPC分类号： H05K1/11 , G11B5/486 , H05K1/0268 , H05K1/056 , H05K3/4007 , H05K2201/0341 , H05K2203/0323
摘要： PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit which can execute inspections of conduction of a conductor pattern and operation of a magnetic head with excellent reliability by improving adhesiveness between a metal plating layer and a support terminal, and to provide a method for manufacturing the same.SOLUTION: A method for manufacturing a suspension substrate with a circuit includes: preparing a metal support substrate 2; forming a base insulating layer 3 on which a base opening 11 is formed; forming a conductor pattern 4 including a head-side terminal 6, an external-side terminal 7 to be filled in the base opening 11 of the base insulating layer 3, and a wire 8, on the base insulating layer 3; forming a support terminal 13 which is electrically insulated from the surrounding metal support substrate 2 and is electrically connected to the external-side terminal 7, on the metal support substrate 2; forming a conductive layer 14 having thickness of 10 nm or more and 200 nm or less below the support terminal 13; and forming a metal plating layer 15 below the conductive layer 14.
摘要翻译：要解决的问题：为了提供具有电路的悬架基板，该电路可以通过提高金属电镀层和支撑端子之间的粘合性来执行导体图案的导通检查和具有优异可靠性的磁头的操作，以及提供其制造方法。解决方案：一种制造具有电路的悬挂基板的方法包括：制备金属支撑基板2; 形成基底绝缘层3，其上形成有基部开口11; 形成包括头侧端子6，填充在基底绝缘层3的基部开口11中的外侧端子7和基底绝缘层3上的导线8的导体图案4; 形成与周围金属支撑基板2电绝缘并在金属支撑基板2上电连接到外侧端子7的支撑端子13; 在支撑端子13的下方形成厚度为10nm以上且200nm以下的导电层14; 并在导电层14的下方形成金属镀层15.版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2013012725A Wiring circuit board and method for manufacturing the same 有权
标题翻译：接线电路板及其制造方法
公开(公告)号：JP2013012725A
公开(公告)日：2013-01-17
申请号：JP2012119267
申请日：2012-05-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ISHIGAKI SAORI , ISHII ATSUSHI , FUJIMURA HIROTO , SUGIMOTO YU
IPC分类号： H05K3/34 , G11B5/60 , G11B21/10 , G11B21/21 , H01L23/12 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board which is capable of sufficiently improving connection reliability between an electronic element and a terminal, and to provide a method for manufacturing the wiring circuit board, which is capable of easily and inexpensively manufacturing the aforementioned wiring circuit board.SOLUTION: A suspension board 3 with a circuit includes a base insulating layer 28 and a conductor layer 19 which is provided with: power supply wiring 25B covered with the base insulating layer 28; and a piezoelectric side terminal 40 which is continuous with the power supply wiring 25B and is electrically connected to a piezoelectric element 5. A first base opening 37 for exposing the piezoelectric side terminal 40 is formed in the base insulating layer 28. The piezoelectric side terminal 40 is formed in a pattern which is uneven in the thickness direction.
摘要翻译：解决的问题：提供一种能够充分提高电子元件与端子之间的连接可靠性的布线电路基板，提供能够容易且廉价地制造的布线电路基板的制造方法上述布线电路板。解决方案：具有电路的悬挂板3包括基底绝缘层28和导体层19，导体层19设置有覆盖有基底绝缘层28的电源布线25B; 以及与电源配线25B连续并与压电元件5电连接的压电侧端子40.在基极绝缘层28上形成用于露出压电侧端子40的第一基座开口37.压电侧端子 40形成为在厚度方向上不均匀的图案。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2011180295A Method of determining cutting information, method of manufacturing strip-shaped polarizing sheet using same, method of manufacturing optical display unit, strip-shaped polarizing sheet and polarizing sheet rolled web 有权
标题翻译：确定切割信息的方法，使用该方法制造带状极化极化片的方法，制造光学显示单元的方法，条带形偏振片和偏光片卷纸
公开(公告)号：JP2011180295A
公开(公告)日：2011-09-15
申请号：JP2010043250
申请日：2010-02-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ISAKI AKINORI , SUGIMOTO YU , UMEMOTO SEIJI
IPC分类号： G02B5/30
CPC分类号： B26D5/02 , B32B38/0004 , B32B41/00 , B32B2041/04 , B32B2457/20 , G02B5/3033 , Y10T156/1077
摘要： PROBLEM TO BE SOLVED: To provide a method of determining cutting information improving the yield with simpler processes, to provide a method of manufacturing strip-shaped polarizing sheets using the same, a method of manufacturing an optical display unit, a strip-shaped polarizing sheet, and a polarizing sheet rolled web. SOLUTION: Cutting positions of a polarizing sheet rolled web MP in the width direction A2 thereof when the polarizing sheet rolled web MP is cut along the longitudinal direction A1 thereof are determined on the basis of the number of defects counted at a plurality of points in the width direction A2 of the polarizing sheet rolled web MP. With this, the cutting positions can be determined such that areas having a large number of defects are not included in the cutting width, resulting in higher yields. In addition, the cutting positions can be determined using simple processes such as counting the number of defects at the plurality of points in the width direction A2. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过更简单的处理确定切割信息提高产量的方法，以提供使用其制造带状偏振片的方法，制造光学显示单元的方法，和偏光片卷材。＆lt; P＆gt;解决方案：当沿着其纵向方向A1切割偏光片卷材MP时，其宽度方向A2上的偏光片卷纸幅材的切割位置是根据多个在偏光片卷筒纸MP的宽度方向A2上的点。由此，可以确定切割位置，使得具有大量缺陷的区域不包括在切割宽度中，导致更高的收率。此外，可以使用简单的处理来确定切割位置，例如对宽度方向A2上的多个点处的缺陷数进行计数。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2010009027A Adhesive polarization plate, image display, and method for manufacturing them 有权
标题翻译：胶粘极化板，图像显示及其制造方法
公开(公告)号：JP2010009027A
公开(公告)日：2010-01-14
申请号：JP2009122796
申请日：2009-05-21
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUZUKI NOBORU , YAMAMOTO MASASHI , TAKEDA KENTARO , NAKAMURA TSUNEZO , SUGIMOTO YU
IPC分类号： G02B5/30 , G02F1/1335
CPC分类号： G02B5/3033 , B29D11/00644 , B32B37/14 , C09J135/04 , G02B1/04 , G02F1/133528 , G02F2201/50 , G02F2202/28 , Y10T156/10 , Y10T156/1062 , Y10T428/10
摘要： PROBLEM TO BE SOLVED: To provide an adhesive polarization plate which includes a transparent protection film only on one surface of a polarizer and includes an adhesive layer on the other surface thereof, the adhesive polarization plate satisfying durability even under severe environment at a low temperature and a high temperature. SOLUTION: The adhesive polarization plate includes the transparent protection film (E) provided on only one surface of the polarizer (P) through an adhesive layer (G) and includes the adhesive layer (B) provided on the other surface of the polarizer (P) through a protection layer (H) having a modulus of elasticity in tension of ≥100 MPa. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种仅在偏振片的一个表面上包括透明保护膜的粘合偏振板，并且在其另一个表面上包括粘合剂层，即使在苛刻的环境下也能够满足耐久性的粘合性偏振片低温和高温。粘合型偏光板包括通过粘合剂层（G）仅在偏振片（P）的一个表面上设置的透明保护膜（E），并且包括设置在偏振片（P）的另一个表面上的粘合剂层偏振片（P）通过拉伸弹性模量≥100MPa的保护层（H）。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2017118037A 配線回路基板审中-公开
公开(公告)号：JP2017118037A
公开(公告)日：2017-06-29
申请号：JP2015254339
申请日：2015-12-25
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： SUGIMOTO YU , TANABE HIROYUKI
IPC分类号： H05K3/46 , G11B5/60 , G11B21/21
CPC分类号： H05K1/0296 , G11B5/486 , H05K1/056 , H05K3/108 , H05K2201/0191
摘要：【課題】形成不良が抑制された導体パターンを高い自由度で備える配線回路基板を提供すること。【解決手段】回路付サスペンション基板1は、中間絶縁層5と、中間絶縁層5の上に設けられる第2導体パターン7とを備える。中間絶縁層5は、傾斜面と、平坦面とを有し、傾斜面18と酸化金属層19とのなす角度の補角yが、0度超過、20度以下である。【選択図】図6

7. 发明专利

JP2010281849A Method for manufacturing liquid crystal display element 有权
标题翻译：制造液晶显示元件的方法
公开(公告)号：JP2010281849A
公开(公告)日：2010-12-16
申请号：JP2009066688
申请日：2009-03-18
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUGIMOTO YU , UMEMOTO SEIJI , NAKAZONO TAKUYA
IPC分类号： G02F1/13 , G02F1/1335
CPC分类号： B32B43/003 , B32B37/025 , B32B37/12 , B32B37/182 , B32B38/0004 , B32B41/00 , B32B2307/42 , B32B2310/0843 , B32B2457/202 , G02F1/1303 , G02F1/1333 , Y10T156/1052 , Y10T156/1056 , Y10T156/1057 , Y10T156/1062 , Y10T156/1064 , Y10T156/1082 , Y10T156/1084 , Y10T156/1085
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal display element, which simultaneously achieves an object of cutting an optical film without causing degradation in the appearance and an object of preventing the film from being broken in a continuous bonding process. SOLUTION: The method for manufacturing the liquid crystal display element includes: cutting a long sheet material F1, which includes a laminate of an optical film F11 containing a polarizer, a pressure-sensitive adhesive layer F14, and a carrier film F12 temporarily bonded to the pressure-sensitive adhesive layer, at prescribed intervals while maintaining the continuity of the carrier film F12; and peeling off the carrier film F12 by a tensile force to expose the pressure-sensitive adhesive layer and continuously bonding the resulting optical film pieces to liquid crystal panels through the pressure-sensitive adhesive layer, while feeding the resulting optical film pieces. The cutting is performed to such a depth as to substantially reach the carrier film F12, and the carrier film is cut to a depth less than half of the thickness of the carrier film F12 at least both end portions in the width direction of the carrier film F12. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种制造液晶显示元件的方法，其同时实现了在不引起外观劣化的情况下切割光学膜的目的，并且在连续接合中防止膜破坏的目的处理。解决方案：液晶显示元件的制造方法包括：将包含偏振片的光学膜F11，压敏粘合剂层F14和载体膜F12的叠层体的短片材F1临时切割以规定的间隔粘合到压敏粘合剂层，同时保持载体膜F12的连续性; 并通过拉力剥离载体膜F12，使粘合剂层露出，并将所得到的光学膜片送出，将所得到的光学膜片通过压敏粘合剂层连续地粘合到液晶面板。执行切割到基本上到达载体膜F12的深度，并且载体膜在载体膜的宽度方向上的至少两个端部被切割成小于载体膜F12的厚度的一半的深度 F12。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2013232261A Wiring circuit board and manufacturing method of the same 有权
标题翻译：接线电路板及其制造方法
公开(公告)号：JP2013232261A
公开(公告)日：2013-11-14
申请号：JP2012103931
申请日：2012-04-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUGIMOTO YU , SHIRAFUJI YOHEI
IPC分类号： G11B5/60 , G11B21/21 , H05K1/02 , H05K1/05
CPC分类号： H05K1/0296 , H05K1/0278 , H05K1/056 , H05K1/111 , H05K13/00 , H05K2201/09063 , Y02P70/611 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of improving connection reliability and a manufacturing method of the same.SOLUTION: Read-out wiring patterns R1, R2 and write-in wiring patterns W1, W2 are formed on an insulator layer 41 formed on a support board 10. Connection terminals 21-24 are respectively formed on part of a plurality of read-out wiring patterns R1, R2 and write-in wiring patterns W1, W2 on the insulator layer 41. The connection terminals 21-24 are electrically connectable to an external circuit. An opening 10h is formed on the supporting board 10 so as to partially or entirely surround an overlapping area each overlapping the connection terminals 21-24 and having a same planar shape as the connection terminals 21-24. Part of the insulator layer 41 is exposed within the opening 10h.
摘要翻译：要解决的问题：提供一种能够提高连接可靠性的布线电路板及其制造方法。解决方案：读出布线图案R1，R2和写入布线图案W1，W2形成在绝缘体层41上形成在支撑板10上。连接端子21-24分别形成在绝缘体层41上的多个读出布线图案R1，R2和写入布线图案W1，W2的一部分上。连接端子21-24 可电连接到外部电路。在支撑板10上形成一个开口10h，以便部分地或全部地围绕着与连接端子21-24重叠的重叠区域，并且具有与连接端子21-24相同的平面形状。绝缘体层41的一部分在开口部10h内露出。

9. 发明专利

JP2011249369A Wiring circuit substrate and method of manufacturing the same 有权
标题翻译：接线电路及其制造方法
公开(公告)号：JP2011249369A
公开(公告)日：2011-12-08
申请号：JP2010117819
申请日：2010-05-21
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAMEI KATSUTOSHI , SUGIMOTO YU , KITAMURA KIMIHIDE
IPC分类号： H05K1/02 , G11B21/21 , G11B33/12
CPC分类号： H05K1/118 , H05K1/147 , H05K2201/0338 , Y10T29/49162
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit substrate capable of uniformly performing a pre-flux processing on a first inside terminal and a second inside terminal, and stably mounting a preamplifier, and a method of manufacturing the wiring circuit substrate.SOLUTION: A wiring circuit substrate 1 comprises a base insulation layer 12, and a first conductor pattern 13 and a second conductor pattern 14 formed on the base insulation layer 12. In the wiring circuit substrate 1, the first conductor pattern 13 equipped with a first wiring 21 connecting a suspension side terminal 20 provided with a metal plating layer 22 and a first preamplifier side terminal 19 soldered to the preamplifier 7, and the second conductor pattern 14 equipped with a second wiring 18 connecting a soldered substrate side terminal 17 and a second preamplifier side terminal 16 soldered to the preamplifier 7 are formed. After the metal plating layer 22 is formed on the second wiring 18, the first preamplifier side terminal 19 and the second preamplifier side terminal 16 are subjected to a pre-flux processing.
摘要翻译：要解决的问题：提供一种能够对第一内部端子和第二内部端子均匀地进行预通量处理并且稳定地安装前置放大器的布线电路基板以及制造布线电路基板的方法。解决方案：布线电路基板1包括基底绝缘层12和形成在基底绝缘层12上的第一导体图案13和第二导体图案14.在布线电路基板1中，配备有第一导体图案13 连接具有金属镀层22的悬置侧端子20和焊接到前置放大器7的第一前置放大器侧端子19的第一布线21和配备有第二布线18的第二布线18，第二布线18将焊接的基板侧端子17 并且形成焊接到前置放大器7的第二前置放大器侧端子16。在第二布线18上形成金属镀层22之后，对第一前置放大器侧端子19和第二前置放大器侧端子16进行预通量处理。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011006648A Roll of optical sheet member, and continuous manufacturing method of liquid crystal display device 审中-公开
标题翻译：光学片材卷轴和液晶显示装置的连续制造方法
公开(公告)号：JP2011006648A
公开(公告)日：2011-01-13
申请号：JP2009154230
申请日：2009-06-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YANO KOHEI , TAKEDA KENTARO , SUGIMOTO YU
IPC分类号： C09J7/02 , B32B27/00 , B32B27/30 , G02F1/1335
CPC分类号： C09J133/06 , C08F2220/1825 , C08G18/6216 , C08G18/8022 , C09J7/22 , C09J7/38 , C09J2203/318 , C09J2433/00 , G02F1/133528 , G02F2202/28 , C08F220/06
摘要： PROBLEM TO BE SOLVED: To provide a roll of an optical sheet member in which when shipping the roll, or storing the roll, the roll wrinkle, orange peel, hit mark or the like is hard to generate, the floating from a carrier film of a half-cutting part can be inhibited, and the problem of paste adhesion of a cutting surface is hard to generate, and to provide a method of manufacturing a liquid crystal display device using the same.SOLUTION: The roll of an optical sheet member in which the optical sheet member is made to rolled out, half-cut by a fixed interval, and thereafter laminated on a liquid crystal cell, is characterized in that the optical sheet member includes a carrier film of mold releasability on at least one side of an optical film through an adhesive layer, the adhesive layer consists of an acrylic-based pressure-sensitive adhesive in which the gel fraction is 70-90% and the holding power (H) at 23°C measured by the following evaluating method is 350 μm or less, and the carrier film of mold releasability consists of a polymer film in which the thickness is 20-40 μm and the peeling force is 0.04-0.2 N/50 mm.
摘要翻译：要解决的问题：为了提供一卷光学片构件，其中当运送辊或存放辊时，难以产生卷皱，橙皮，打标等，从载体膜漂浮可以抑制半切割部分，并且难以产生切割表面的浆料粘附的问题，并提供使用其的液晶显示装置的制造方法。解决方案：将光学片材的卷将光学片构件拉出，半切割固定间隔，然后层压在液晶单元上，其特征在于，光学片构件包括在至少一个侧面上的脱模性的载体膜通过粘合剂层的光学膜，粘合剂层由凝胶分数为70〜90％的丙烯酸类压敏粘合剂构成，通过以下评价方法测定的23℃下的保持力（H）为350μm 或更少，脱模性的膜由膜厚20-40μm，剥离力为0.04-0.2N / 50mm的聚合物膜构成。

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