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1. 发明专利

JP2015013946A 接着剤組成物及び接着シート有权
标题翻译：胶粘组合物和粘合片
公开(公告)号：JP2015013946A
公开(公告)日：2015-01-22
申请号：JP2013141553
申请日：2013-07-05
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： NAKAYAMA JUNICHI , YUTO RIE , TERADA YOSHIO
IPC分类号： C09J133/00 , C09J7/00 , C09J11/02 , C09J161/10 , C09J163/00
摘要：【課題】認性と接着力とを両立した接着剤組成物及び接着シートを提供する。【解決手段】本発明に係る接着剤組成物は、アクリル系ポリマーと、フェノール樹脂と、エポキシ樹脂と、着色剤とを含有し、アクリル系ポリマー100重量部に対して着色剤を10重量部以下を含有する。本発明に係る接着剤組成物は、アクリル系ポリマー100重量部に対して、上記レゾール型フェノール樹脂を5〜20重量部含有することが好ましい。また、本発明に係る接着剤組成物は、アクリル系ポリマー100重量部に対して、上記エポキシ樹脂を5〜20重量部含有することが好ましい。【選択図】なし
摘要翻译：要解决的问题：提供能够实现可见性和粘合强度的粘合剂组合物和粘合片。解决方案：粘合剂组合物包括丙烯酸类聚合物，酚醛树脂，环氧树脂和着色剂。粘合剂组合物包括10重量份的着色剂或更低，基于100重量份的丙烯酸聚合物。粘合剂组合物优选包含5-20重量份的甲阶型酚醛树脂基于100重量份的丙烯酸聚合物粘合剂组合物优选包含5-20重量份的环氧树脂基于100重量份的丙烯酸聚合物

2. 发明专利

JP2010073790A Thermally conductive member, microprocessor and electronic device 有权
标题翻译：导热构件，微处理器和电子设备
公开(公告)号：JP2010073790A
公开(公告)日：2010-04-02
申请号：JP2008237900
申请日：2008-09-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , WANO TAKASHI , NAKAYAMA JUNICHI , NAITO TOMOYA , OKADA MIYOSHI
IPC分类号： H05K7/20 , C08F2/44 , C08K3/00 , C08L101/00 , H01L23/36 , H01L23/373
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive member which is excellent in both heat conductivity and adhesion, and to provide a microprocessor and an electronic device. SOLUTION: In the microprocessor 1 comprising a heat spreader 5, a heat sink 7 disposed facing the heat spreader 5 and a second heat conductive member 6 interposed between the heat spreader 5 and the heat sink 7, the second heat conductive member 6 includes an inorganic-polymer composite material for which a hydrophilic inorganic compound with a maximum length of 1 to 1,000 nm is unevenly distributed on the surface of polymer particles whose median diameter of volume reference is 0.05 to 100 μm. In the inorganic-polymer composite material forming the second heat conductive member 6, the hydrophilic inorganic compound is unevenly distributed on the surface of the polymer particles. Thus, in the microprocessor 1 with the second heat conductive member 6, heat is efficiently discharged by efficiently discharging heat conducted to the heat spreader 5 to the heat sink 7 by the second heat conductive member 6. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供导热性和粘附性优异的导热构件，并提供微处理器和电子设备。解决方案：在包括散热器5的微处理器1中，散热器7设置为面对散热器5，第二导热构件6插在散热器5和散热器7之间，第二导热构件6 包括无机聚合物复合材料，其中最大长度为1至1000nm的亲水性无机化合物不均匀地分布在聚合物颗粒的体积参考的中值直径为0.05至100μm的表面上。在形成第二导热构件6的无机 - 聚合物复合材料中，亲水性无机化合物不均匀地分布在聚合物颗粒的表面上。因此，在具有第二导热构件6的微处理器1中，通过有效地将通过第二导热构件6传导到散热器5的热量散发到散热器7，从而有效地排出热量。（C）2010 ，JPO＆INPIT

3. 发明专利

JP2009259956A Permanent magnet and process for producing permanent magnet 有权
标题翻译：永久磁铁和生产永磁体的方法
公开(公告)号：JP2009259956A
公开(公告)日：2009-11-05
申请号：JP2008105760
申请日：2008-04-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： OZEKI IZUMI , KUME KATSUYA , NAKAYAMA JUNICHI , FUKUDA YUKI , HOSHINO TOSHINOBU , HORIO TOMOKAZU
IPC分类号： H01F41/02 , H01F1/08
CPC分类号： H01F41/0266 , B22F1/0074 , B22F2998/10 , C22C38/002 , C22C38/005 , H01F1/0552 , H01F1/0557 , H01F1/0572 , H01F1/0577 , B22F9/04 , B22F1/0059 , B22F3/087 , B22F3/10
摘要： PROBLEM TO BE SOLVED: To provide a permanent magnet whose magnetic performance can be improved by setting the crystal grain size of a sintered compact to not more than 3 μm by suppressing the grain growth of a magnet particle in sintering, and to provide a process for producing the permanent magnet.
SOLUTION: A raw magnet material comprising 27-30 wt.% of Nd, 60-70 wt.% of Fe, and 1-2 wt.% of B is dry-pulverized with a jet mill into a fine powder having a grain size of 3 μm or below. Then, the ground fine powder is mixed with an anticorrosive oil containing, dissolved therein, an organic compound containing a high-melting metallic element or a precursor of high-melting ceramic to generate a slurry 42. After the generated slurry 42 is subjected to wet molding, a permanent magnet 1 is manufactured by deoiling and sintering.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供通过抑制烧结中的磁体颗粒的晶粒生长，通过将烧结体的晶粒尺寸设定为不大于3μm来提高其磁性能的永磁体，并且提供一种永磁体的制造方法。解决方案：将包含27-30重量％的Nd，60-70重量％的Fe和1-2重量％的B的原料磁体材料用喷射磨机干粉碎成具有 3μm以下的粒径。然后将研磨的细粉末与含有溶解在其中的含有高熔点金属元素的有机化合物或高熔点陶瓷前体的防锈油混合以产生浆料42.在产生的浆料42经受湿润之后通过脱模和烧结制造永磁体1。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009079127A Conductive pressure-sensitive adhesive tape 有权
标题翻译：导电压敏胶带
公开(公告)号：JP2009079127A
公开(公告)日：2009-04-16
申请号：JP2007249449
申请日：2007-09-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , KISHIOKA HIROAKI
IPC分类号： C09J7/02 , C09J9/02 , C09J11/04 , C09J133/00 , C09J201/00 , H01B1/00 , H01B1/22 , H05F3/02 , H05K9/00
CPC分类号： C09J133/06 , C08K3/017 , C08K3/08 , C08K7/00 , C08K2201/016 , C09J7/28 , C09J7/385 , C09J2201/606 , C09J2205/102 , C09J2433/00 , H01B1/22 , Y10T428/25 , Y10T428/28
摘要： PROBLEM TO BE SOLVED: To provide a conductive pressure-sensitive adhesive tape excellent in tackiness and conductivity even when the pressure-sensitive adhesive layer is made thin, and having excellent step-absorbing property and causing no lift from the adherend even when the tape is stuck to a step. SOLUTION: The conductive pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer having a thickness of 10 to 30 μm, the layer comprises a pressure-sensitive adhesive that contains a spherical and/or spike-like conductive filler having an aspect ratio of 1.0 to 1.5 by 14 to 45 parts by weight with respect to 100 parts by weight of the whole solid content of the pressure-sensitive adhesive excluding the conductive filler, with the conductive filler occupying 90 wt.% or more in the whole filler in the pressure-sensitive adhesive. Particle sizes d 50 and d 85 of the filler and the pressure-sensitive adhesive layer thickness satisfy a relationship of d 85 >(adhesive layer thickness)>d 50 . COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使当压敏粘合剂层变薄时也提供粘合性和导电性优异的导电性粘合带，并且具有优异的分级吸收性，并且即使当粘合剂层磁带被卡住了一步。导电性粘合带具有厚度为10〜30μm的压敏粘合剂层，该层包含含有球形和/或尖状导电填料的压敏粘合剂，其具有相对于除了导电性填料以外的粘合剂的整体固体成分100重量份，导电性填料占整个90重量％以上，纵横比为1.0〜1.5重量份为14〜45重量份填料在压敏粘合剂中。填料的颗粒尺寸d 50 和 85 ，并且压敏粘合剂层厚度满足d 85 >（粘合剂层厚度）> d 50 。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2014088506A Thermally conductive adhesive sheet and method for producing the same 有权
标题翻译：导热粘合片及其制造方法
公开(公告)号：JP2014088506A
公开(公告)日：2014-05-15
申请号：JP2012239442
申请日：2012-10-30
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , FUJIKAWA KENICHI , YAMAGUCHI YOSHIO , TOJO MIDORI
IPC分类号： C09J7/00 , C09J4/02 , C09J11/04 , C09J133/00 , C09J133/14
CPC分类号： C09J4/00
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive sheet with excellent thermal conductivity and a method for producing the same.SOLUTION: This thermally conductive adhesive sheet is provided with an acrylic adhesive layer 4. The acrylic adhesive layer 4 contains three or more kinds of thermally conductive particles which have different average particle diameters, and the porosity when the three or more kinds of thermally conductive particles are mixed is 72% or less. The content ratio of the three or more kinds of thermally conductive particles relative to the acrylic adhesive layer 4 is from 55% by volume to 75% by volume (inclusive).
摘要翻译：要解决的问题：提供具有优异导热性的导热粘合片及其制造方法。解决方案：该导热粘合片设置有丙烯酸粘合剂层4.丙烯酸粘合剂层4包含三种或更多种具有不同平均粒径的导热性粒子，和三种以上的导热性粒子混合时的孔隙率为72％以下。三种以上导热性粒子相对于丙烯酸系粘合剂层4的含有率为55体积％〜75体积％（以下）。

6. 发明专利

JP2013224434A Conductive adhesive tape 有权
标题翻译：导电胶带
公开(公告)号：JP2013224434A
公开(公告)日：2013-10-31
申请号：JP2013119826
申请日：2013-06-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , KISHIOKA HIROAKI
IPC分类号： C09J7/02 , C09J11/04 , C09J133/00 , H01B1/00 , H01B1/22 , H01B5/16
摘要： PROBLEM TO BE SOLVED: To provide a conductive adhesive tape excellent in tackiness and conductivity even when an adhesive layer is made thin, and having excellent step-absorbing property and causing no lift from an adherend even when the tape is stuck to a step.SOLUTION: A conductive adhesive tape has an adhesive layer, and has a thickness of 15 to 160 μm, the layer comprises an adhesive that contains a spherical and/or spike-like conductive filler having an aspect ratio of 1.0 to 1.5 by 14 to 45 pts.wt. with respect to 100 pts.wt. of the whole solid content of the pressure-sensitive adhesive excluding the conductive filler, with the conductive filler occupying 90 wt.% or more in the whole filler in the pressure-sensitive adhesive. Particle sizes dand dof the conductive filler and the pressure-sensitive adhesive layer thickness satisfy a relationship of d>(adhesive layer thickness)>d.
摘要翻译：要解决的问题：即使当粘合剂层变薄时也提供粘合性和导电性优异的导电性粘合带，并且即使当胶带粘附到台阶上时也具有优异的分级吸收性能并且不会从被粘附物上升。：导电性胶带具有粘合剂层，其厚度为15〜160μm，该层包含粘合剂，该粘合剂含有纵横比为1.0〜1.5×14〜45个点的球形和/或尖状导电性填料 .wt。相对于100 pts.wt 的压敏粘合剂除了导电填料之外的整个固体含量，导电填料在压敏粘合剂中的整个填料中占90重量％以上。导电填料和压敏粘合剂层的粒径d和d>（粘合剂层厚度）> d的关系。

7. 发明专利

JP2013189633A Thermoconductive adhesive sheet 审中-公开
标题翻译：热固性粘合片
公开(公告)号：JP2013189633A
公开(公告)日：2013-09-26
申请号：JP2013026233
申请日：2013-02-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TOJO MIDORI , TERADA YOSHIO , FURUTA KENJI , NAKAYAMA JUNICHI
IPC分类号： C09J7/02 , C09J201/00 , H01L23/36
CPC分类号： C09J9/00 , C09J7/10 , C09J2201/622 , C09K5/14
摘要： PROBLEM TO BE SOLVED: To provide a thermoconductive adhesive sheet that is superior in thermal conductivity, and capable of reducing an amount of organic compound gas generated when heated to a high temperature.SOLUTION: A thermoconductive adhesive sheet is characterized in that an amount of organic compound gas generated by heating for 30 minutes at a temperature of 150°C does not exceed 50μg/cm2, and the thermal resistance after being stored for 30 minutes at 25°C does not exceed 10 cmK/W.
摘要翻译：要解决的问题：提供一种导热性优异并且能够减少加热到高温时产生的有机化合物气体的量的导热粘合片。解决方案：导热粘合片的特征在于有机物的量在150℃温度下加热30分钟产生的复合气体不超过50μg/ cm 2，在25℃下保存30分钟后的耐热性不超过10cmK / W。

8. 发明专利

JP2012140625A Adhesive heat-conducting member and method for producing the same 审中-公开
标题翻译：粘合导热构件及其制造方法
公开(公告)号：JP2012140625A
公开(公告)日：2012-07-26
申请号：JP2012010808
申请日：2012-01-23
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , WANO TAKASHI , NAKAYAMA JUNICHI , NAITO TOMOYA , OKADA MIYOSHI
IPC分类号： C09J7/00 , C08F2/44 , C08F20/00 , C08J5/18 , C09J9/00 , C09J11/04 , C09J133/00 , C09J133/08 , C09J133/10 , C09J201/00 , H01L23/36 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide an adhesive heat-conducting member excellent in both of thermal conductivity and adhesiveness, and to provide a method for producing the member.SOLUTION: The adhesive heat-conducting member comprises an inorganic-polymer composite material where a hydrophilic inorganic compound having a maximum length or a primary particle average diameter of 1 to 1,000 nm is unevenly distributed on the surfaces of the polymer particles having a median diameter of 0.05 to 100 μm on a volume basis. The adhesive heat-conducting member is obtained by the production method of an adhesive heat-conducting member, the method including steps of: dispersing a hydrophilic inorganic compound in water to prepare an aqueous dispersion of the inorganic compound; compounding the aqueous dispersion with an ethylenically unsaturated monomer and emulsifying the ethylenically unsaturated monomer to prepare a monomer emulsion; compounding a surfactant into at least one of water, the aqueous dispersion, the ethylenically unsaturated monomer and the monomer emulsion; and polymerizing the ethylenically unsaturated monomer in the monomer emulsion.
摘要翻译：要解决的问题：提供导热性和粘合性两者都优异的粘合剂导热构件，并提供制造该构件的方法。粘合导热构件包括无机 - 聚合物复合材料，其中具有1至1,000nm的最大长度或初级颗粒平均直径的亲水性无机化合物不均匀地分布在具有中值粒径为0.05〜100μm。通过粘合导热构件的制造方法获得粘合导热构件，该方法包括以下步骤：将亲水性无机化合物分散在水中以制备无机化合物的水分散体; 将水性分散体与烯键式不饱和单体混合并乳化烯属不饱和单体以制备单体乳液; 将表面活性剂混合到水，水分散体，烯键式不饱和单体和单体乳液中的至少一种中; 并在单体乳液中聚合烯属不饱和单体。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2011241329A Heat-conductive self-adhesive sheet 审中-公开
标题翻译：导热自粘片
公开(公告)号：JP2011241329A
公开(公告)日：2011-12-01
申请号：JP2010115604
申请日：2010-05-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , TSUKAKOSHI TATSUYA , TERADA YOSHIO , SHOJI AKIRA , FURUTA KENJI , TOJO MIDORI
IPC分类号： C09J7/00 , C09J11/00 , C09J133/00
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive self-adhesive sheet which can easily adhere a heat-generating member to a heat-releasing member and is excellent in heat conductivity.SOLUTION: The heat-conductive self-adhesive sheet having an adhesive layer prepared by forming a heat-conductive adhesive composition containing a heat-conductive substance and an acrylic polymer component into a sheet-like shape is characterized in that the complex modulus of elasticity of the self-adhesive layer at 100°C is 1.0×10to 1.0×10Pa.

10. 发明专利

JP2011162706A Method for producing thermally conductive self-adhesive sheet 审中-公开
标题翻译：用于生产导热自粘片的方法
公开(公告)号：JP2011162706A
公开(公告)日：2011-08-25
申请号：JP2010028850
申请日：2010-02-12
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FURUTA KENJI , NAKAYAMA JUNICHI , TERADA YOSHIO , WANO TAKASHI
IPC分类号： C09J7/02 , C09J11/04 , C09J133/00
CPC分类号： C08K3/38 , C08K5/05 , C08K5/29 , C09J133/08
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a thermally conductive self-adhesive sheet formable of a thermally conductive self-adhesive layer excellent in thermal conductivity while having a relatively low modulus of elasticity.
SOLUTION: The production method of the thermally conductive self-adhesive sheet performs a composition preparation step of preparing a thermally conductive self-adhesive composition including a thermally conductive particle and an acrylic polymer component; and a self-adhesive layer-forming step of forming a sheet-like thermally conductive self-adhesive layer from the thermally conductive self-adhesive composition, thereby producing a self-adhesive sheet having the thermally conductive self-adhesive layer. In the composition preparation step, an ≤8C cyclic organic compound or a ≤3C organic compound having a hydroxy group, a ketone group, an aldehyde group, a carboxy group or a nitrile group is compounded as a constituting component of the thermally conductive self-adhesive composition.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造导热自粘合片的方法，所述导热性自粘合片可形成具有优异导热性的导热自粘层，同时具有相对低的弹性模量。导热性自粘片的制造方法进行组成物准备工序，制备包括导热颗粒和丙烯酸类聚合物组分的导热自粘合组合物; 以及从导热性自粘合剂组合物形成片状导热性自粘合层的自粘层形成工序，由此制造具有导热性自粘合层的自粘合片。在组合物制备步骤中，将具有羟基，酮基，醛基，羧基或腈基的≤8C环状有机化合物或≤3C有机化合物作为导热性自由基的组成成分，粘合剂组成。版权所有（C）2011，JPO＆INPIT

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