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1. 发明专利

JP2013177562A Thermal conductive sheet 审中-公开
标题翻译：导热片
公开(公告)号：JP2013177562A
公开(公告)日：2013-09-09
申请号：JP2013012649
申请日：2013-01-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUJIKAWA KENICHI , HATAKEYAMA YOSHIJI , YAMAMOTO SAORI , IZUMITANI SEIJI , YAMAGUCHI MIHO
IPC分类号： C08L63/00 , C08G59/56 , C08G59/62 , C08K3/38 , C08K7/00
CPC分类号： C09K5/14 , B29C43/24 , B29C43/265 , B29C43/30 , B29K2063/00 , B29K2105/16 , B29K2509/04 , B29K2995/0013 , B29K2995/0094 , B29L2007/002 , B29L2031/3406 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermal conductive sheet with good unevenness followability and low temperature adhesive properties on a mount substrate while having excellent thermal conductivity.SOLUTION: A thermal conductive sheet is formed of a thermally conductive composition including plate-like boron nitride particles, an epoxy resin, at least one kind of hardeners and hardening accelerating agents, and a rubber component. The content of the boron nitride particles in the thermal conductive sheet is ≥35 volume%, and the thermal conductivity of the thermal conductive sheet in a direction perpendicular to the thickness direction is ≥4 W/m K, and the storage shear modulus of a rubber-including sheet formed from a rubber-including composition made by eliminating the boron nitride particles from a thermal conductive composition is 5.5×10-7.0×10Pa at a certain temperature in a temperature range of 50-80°C when the rubber-including sheet is temperature-raised at a frequency of 1 Hz and at a temperature-raising speed of 2°C/min.
摘要翻译：要解决的问题：提供在安装基板上具有良好的不均匀性随动性和低温粘合性能的导热片，同时具有优异的导热性。导热片由导热组合物形成，该导热组合物包括板状氮化硼颗粒环氧树脂，至少一种硬化剂和硬化促进剂，以及橡胶组分。导热片中的氮化硼颗粒的含量为≥35体积％，导热片的与厚度方向垂直的方向的导热率为≥4W/ m·K，存储剪切模量为在含有橡胶的组合物中，在含有橡胶的组合物中，在含有橡胶的组合物中，在50〜80℃的温度范围内的一定温度下，由导热性组合物除去氮化硼粒子而形成的含橡胶的片材为5.5×10-7.0×10Pa 片材以1Hz的频率升温，升温速度为2℃/ min。

2. 发明专利

JP2013176981A Method of producing thermal conductive sheet 审中-公开
标题翻译：生产导热片的方法
公开(公告)号：JP2013176981A
公开(公告)日：2013-09-09
申请号：JP2013012654
申请日：2013-01-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HATAKEYAMA YOSHIJI , YAMAMOTO SAORI , YAMAGUCHI MIHO , IZUMITANI SEIJI , FUJIKAWA KENICHI
IPC分类号： B29C69/02 , B29C51/08 , C08J5/18 , C08K3/38 , C08L101/00 , C09K5/08
CPC分类号： C09K5/14 , B29C43/24 , B29C43/265 , B29C43/30 , B29K2063/00 , B29K2105/16 , B29K2509/04 , B29K2995/0013 , B29K2995/0094 , B29L2007/002 , B29L2031/3406 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of producing a thermal conductive sheet capable of sufficiently reducing porosity and producing with excellent production efficiency the thermal conductive sheet having excellent thermal conductivity in a plane direction and flexibility, while effectively preventing crushing of plate-like boron nitride particles.SOLUTION: A method of producing a thermal conductive sheet 100 includes: preparing a material component 27 containing plate-like boron nitride particles 23 and a polymer matrix 24; forming a long sheet 20 from the material component 27 by means of a calender 1; and pressing the long sheet 20.
摘要翻译：要解决的问题：提供一种制造能够充分降低孔隙率并且以优异的生产效率制造的导热片的方法，该导热片在平面方向上具有优异的导热性和柔性，同时有效地防止板状硼的破碎氮化物颗粒。解决方案：制造导热片100的方法包括：制备含有板状氮化硼颗粒23和聚合物基质24的材料组分27; 通过砑光机1从材料部件27形成长片材20; 并按压长片20。

3. 发明专利

JP2013179277A Thermoconductive sheet 审中-公开
标题翻译：热电偶片
公开(公告)号：JP2013179277A
公开(公告)日：2013-09-09
申请号：JP2013012653
申请日：2013-01-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HATAKEYAMA YOSHIHARU , YAMAMOTO SAORI , IZUMITANI SEIJI , YAMAGUCHI YOSHIO , FUJIKAWA KENICHI
IPC分类号： H01L23/373 , C08J5/18 , C08K3/38 , C08L21/00 , C08L63/00 , H05K7/20
CPC分类号： C09K5/14 , B29C43/24 , B29C43/265 , B29C43/30 , B29K2063/00 , B29K2105/16 , B29K2509/04 , B29K2995/0013 , B29K2995/0094 , B29L2007/002 , B29L2031/3406 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermoconductive sheet which is excellent in thermal conductivity and irregularity followability in the surface direction.SOLUTION: In a thermoconductive sheet, thermal conductivity in the surface direction PD is 4 W/m K or more, and it has rupture strain in the surface direction which becomes 125% or more in a temperature area at 40°C or higher.
摘要翻译：要解决的问题：提供导热性和表面方向不均匀性优异的导热片。解决方案：在导热片中，表面方向PD的导热率为4W / m K以上，具有在40℃以上的温度区域，表面方向的断裂应变为125％以上。

4. 发明专利

JP2013177564A Heat-conductive sheet, particle aggregate powder for forming heat-conductive sheet and method for producing them 审中-公开
标题翻译：导热片，颗粒聚集粉，用于形成导热片及其制造方法
公开(公告)号：JP2013177564A
公开(公告)日：2013-09-09
申请号：JP2013012652
申请日：2013-01-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HATAKEYAMA YOSHIJI , YAMAMOTO SAORI , YAMAGUCHI MIHO , IZUMITANI SEIJI , FUJIKAWA KENICHI
IPC分类号： C08L101/00 , C08G59/18 , C08J5/18 , C08K3/38 , C09K5/08
CPC分类号： C09K5/14 , B29C43/24 , B29C43/265 , B29C43/30 , B29K2063/00 , B29K2105/16 , B29K2509/04 , B29K2995/0013 , B29K2995/0094 , B29L2007/002 , B29L2031/3406 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive sheet excellent in initial adhesion, a method for producing the heat-conductive sheet, a particle aggregate powder for forming the heat-conductive sheet suitable for the production method, and a method for producing the particle aggregate powder.SOLUTION: A heat-conductive sheet 10 comprises plate-like boron nitride particles 1 and a resin component 4a, wherein the content of the boron nitride particles 1 is ≥60 mass%, the thermal conductivity in a plane direction is ≥4 W/m K, and the tack strength exhibited within a temperature range of ≥40°C is ≥350 g per 2 cm-diameter.
摘要翻译：要解决的问题：提供初始粘合性优异的导热片，制造导热片的方法，用于形成适于制造方法的导热片的颗粒聚集粉末，以及用于制造导热片的方法颗粒聚集体粉末。溶液：导热片10包括板状氮化硼颗粒1和树脂组分4a，其中氮化硼颗粒1的含量≥60质量％，平面方向的导热率≥ 4W / m K，在≥40℃的温度范围内显示的粘着强度为≥350g/ 2cm直径。

5. 发明专利

JP2014088506A Thermally conductive adhesive sheet and method for producing the same 有权
标题翻译：导热粘合片及其制造方法
公开(公告)号：JP2014088506A
公开(公告)日：2014-05-15
申请号：JP2012239442
申请日：2012-10-30
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , FUJIKAWA KENICHI , YAMAGUCHI YOSHIO , TOJO MIDORI
IPC分类号： C09J7/00 , C09J4/02 , C09J11/04 , C09J133/00 , C09J133/14
CPC分类号： C09J4/00
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive sheet with excellent thermal conductivity and a method for producing the same.SOLUTION: This thermally conductive adhesive sheet is provided with an acrylic adhesive layer 4. The acrylic adhesive layer 4 contains three or more kinds of thermally conductive particles which have different average particle diameters, and the porosity when the three or more kinds of thermally conductive particles are mixed is 72% or less. The content ratio of the three or more kinds of thermally conductive particles relative to the acrylic adhesive layer 4 is from 55% by volume to 75% by volume (inclusive).
摘要翻译：要解决的问题：提供具有优异导热性的导热粘合片及其制造方法。解决方案：该导热粘合片设置有丙烯酸粘合剂层4.丙烯酸粘合剂层4包含三种或更多种具有不同平均粒径的导热性粒子，和三种以上的导热性粒子混合时的孔隙率为72％以下。三种以上导热性粒子相对于丙烯酸系粘合剂层4的含有率为55体积％〜75体积％（以下）。

6. 发明专利

JP2013177565A Method of manufacturing heat conductive sheet 审中-公开
标题翻译：制造导热片的方法
公开(公告)号：JP2013177565A
公开(公告)日：2013-09-09
申请号：JP2013012655
申请日：2013-01-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HATAKEYAMA YOSHIJI , YAMAMOTO SAORI , YAMAGUCHI MIHO , IZUMITANI SEIJI , FUJIKAWA KENICHI
IPC分类号： C08J5/18 , C08K7/00 , C08L101/00
CPC分类号： C09K5/14 , B29C43/24 , B29C43/265 , B29C43/30 , B29K2063/00 , B29K2105/16 , B29K2509/04 , B29K2995/0013 , B29K2995/0094 , B29L2007/002 , B29L2031/3406 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat conductive sheet which can manufacture a heat conductive sheet which can lower a void ratio sufficiently and is excellent in heat conductivity and flexibility in a plane direction while effectively preventing crush of plate-like boron nitride particles with excellent manufacturing efficiency.SOLUTION: A method of manufacturing a heat conductive sheet forms the heat conductive sheet by preparing a raw material component 9 containing plate-like boron nitride particles and polymer matrix and rolling the raw material component 9 by a calender. The heat conductive sheet is formed by rolling the raw material component 9 by a first roll 6 and second roll 7 to form a first long sheet 2, laminating a plurality of first long sheets 2 in a thickness direction TD, and rolling the sheets by the first roll 6 and the second roll 7, and pressing them.
摘要翻译：要解决的问题：提供一种制造导热片的方法，该导热片可以制造能够充分降低空隙率并且在平面方向上的导热性和柔性优异的导热片，同时有效地防止板状硼的挤压制造导热片的方法通过制备含有板状氮化硼颗粒和聚合物基体的原料组分9并通过压延机轧制原料组分9来形成导热片。导热片通过利用第一辊6和第二辊7轧制原料成分9而形成第一长片2，在厚度方向TD上层压多个第一长片2，第一辊6和第二辊7，并按压它们。

7. 发明专利

JP2013176980A Thermal conductive sheet 有权
标题翻译：导热片
公开(公告)号：JP2013176980A
公开(公告)日：2013-09-09
申请号：JP2013012650
申请日：2013-01-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YAMAMOTO SAORI , HATAKEYAMA YOSHIJI , IZUMITANI SEIJI , YAMAGUCHI MIHO , FUJIKAWA KENICHI
IPC分类号： B32B7/02 , B32B27/18 , C09J7/02 , C09J11/06 , C09J133/08 , C09J133/10 , C09J201/00
CPC分类号： C09K5/14 , B29C43/24 , B29C43/265 , B29C43/30 , B29K2063/00 , B29K2105/16 , B29K2509/04 , B29K2995/0013 , B29K2995/0094 , B29L2007/002 , B29L2031/3406 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermal conductive sheet having excellent irregularity following performance relative to a mounting substrate while having excellent thermal conductivity and resistance to peeling.SOLUTION: A thermal conductive sheet 5 includes: a thermal conductive layer 1 which has plate-like boron nitride particles 2 and a rubber composition and in which the thermal conductivity in a direction orthogonal to the thickness direction is 4 W/m.K or more; and a pressure-sensitive adhesive layer 4 laminated on at least one face of the thermal conductive layer.
摘要翻译：要解决的问题：提供相对于安装基板具有优异的不规则性的导热片，同时具有优异的导热性和耐剥离性。导热片5包括：导热层1，其具有板状氮化硼颗粒2和橡胶组合物，其中在与厚度方向正交的方向上的导热率为4W / mK以上; 以及层压在导热层的至少一个面上的压敏粘合剂层4。

8. 发明专利

JP2013176979A Thermal conductive sheet 有权
标题翻译：导热片
公开(公告)号：JP2013176979A
公开(公告)日：2013-09-09
申请号：JP2013012648
申请日：2013-01-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HATAKEYAMA YOSHIJI , YAMAMOTO SAORI , IZUMITANI SEIJI , YAMAGUCHI MIHO , FUJIKAWA KENICHI
IPC分类号： B32B7/02 , C08K3/38 , C08L21/00 , C08L63/00
CPC分类号： C09K5/14 , B29C43/24 , B29C43/265 , B29C43/30 , B29K2063/00 , B29K2105/16 , B29K2509/04 , B29K2995/0013 , B29K2995/0094 , B29L2007/002 , B29L2031/3406 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermal conductive sheet having improved thermal conductivity and resistance to peeling, as well as excellent unevenness followability with respect to a mounting substrate.SOLUTION: A thermal conductive sheet 5 includes: a thermal conductive layer 1 which has plate-like boron nitride particles 2 and a rubber composition and, in which the thermal conductivity in a direction orthogonal to the thickness direction is 4 W/m.K or more; and an adhesive layer 4 laminated on at least one side of the thermal conductive layer 1.
摘要翻译：要解决的问题：提供一种具有改善的导热性和耐剥离性的导热片，以及相对于安装基板的优异的不均匀性。导热片5包括：导热层1，其具有板类氮化硼颗粒2和橡胶组合物，其中在与厚度方向正交的方向上的导热率为4W / mK以上; 以及层压在导热层1的至少一侧的粘合层4。

9. 发明公开

EP3115337A4 ALUMINUM NITRIDE POWDER, RESIN COMPOSITION, AND THERMALLY CONDUCTIVE MOLDED OBJECT 审中-公开
标题翻译： ALUMINIUMNITRIDPULVER，HARZZUSAMMENSETZUNG UNDWÄRMELEITFHHIGESGEFORMTES OBJEKT
公开(公告)号：EP3115337A4
公开(公告)日：2017-08-09
申请号：EP14884550
申请日：2014-12-16
申请人： NITTO DENKO CORP , NITTO SHINKO CORP
发明人： HATAKEYAMA YOSHIHARU , FUJIKAWA KENICHI , YAMAGUCHI MIHO , YAMAGISHI YUJI , OOHASHI AKIHIRO
IPC分类号： C01B21/072 , C08K3/28 , C08K9/04 , C08L101/00 , C09K5/14
CPC分类号： C08K9/04 , C01B21/072 , C01B21/0726 , C08K3/28 , C08K2003/282 , C09K5/14
摘要： The present invention provides, as an aluminum nitride powder excellent in the water resistance, an aluminum nitride powder subjected to a surface treatment with a predetermined organic compound. The present invention also provides a resin composition including the aluminum nitride powder and a resin, and a thermal conductive molded article obtained by molding the resin composition.
摘要翻译：作为耐水性优异的氮化铝粉末，本发明提供了用预定有机化合物进行表面处理的氮化铝粉末。本发明还提供包含氮化铝粉末和树脂的树脂组合物以及通过模塑树脂组合物获得的导热模塑制品。

10. 发明公开

EP3138881A4 THERMALLY CONDUCTIVE POLYMER COMPOSITION AND THERMALLY CONDUCTIVE MOLDED OBJECT 有权
标题翻译： WÄRMELEITFÄHIGEPOLYMERZUSAMMENSETZUNG UNDWÄRMELEITFÄHIGERFORMKÖRPER
公开(公告)号：EP3138881A4
公开(公告)日：2017-04-12
申请号：EP14890606
申请日：2014-12-16
申请人： NITTO DENKO CORP , NITTO SHINKO CORP
发明人： FUJIKAWA KENICHI , HATAKEYAMA YOSHIHARU , YAMAGUCHI MIHO , YAMAGISHI YUJI , OOHASHI AKIHIRO
IPC分类号： C08L101/00 , C08J3/20 , C08J5/18 , C08K3/04 , C08K3/22 , C08K3/28 , C08K3/36 , C08K3/38
CPC分类号： C09K5/14 , C08J3/20 , C08J5/18 , C08J2363/00 , C08K3/04 , C08K3/22 , C08K3/28 , C08K3/36 , C08K3/38 , C08K2003/2227 , C08K2003/282 , C08K2201/001 , C08L63/00

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