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1. 发明专利

JP2005046969A Tool for vacuum suction 有权
标题翻译：真空吸尘器工具
公开(公告)号：JP2005046969A
公开(公告)日：2005-02-24
申请号：JP2003283053
申请日：2003-07-30
申请人： Nihon Ceratec Co Ltd , Taiheiyo Cement Corp , 太平洋セメント株式会社 , 株式会社日本セラテック
发明人： MORI MASAHIRO , SASAKI SHUNICHI , ISHINO TOMOHIRO , OGURA TOMOYUKI , SATO SHINYA , UMEKI AKIKO , SHIOGAI TATSUYA
IPC分类号： B23Q3/08 , H01L21/304 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To sufficiently wash the inside of a placement member by preventing a cleaning solvent from leaking out from a boundary portion between the placement member and a support member in washing. SOLUTION: This tool for vacuum suction comprises the placement member 1 formed of a porous body for placing a sucked matter F thereon, the support member 2 having a recessed part 2a for storing the placement member 1 formed on one principal plane side thereof and supporting the placement member in the state of storing the placement member in the recessed part 2a, and an adhering layer 3 for joining the placement member 1 to the support member 2 which is interposed between a lower surface opposed to an upper surface in contact with the sucked matter F on the placement member 1 and the bottom surface of the recessed part 2a in the support member 2. The tool also comprises an annular sealing layer 4 obtained by fusing and solidifying a glass powder containing at least an organic adhesive agent on the bottom surface of the recessed part 2a in the support member 2 so as to surround a boundary area between the placement member and the adhesive layer 3 along the peripheral wall surface of the recessed part 2a. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过在洗涤中防止清洁溶剂从放置构件和支撑构件之间的边界部分泄漏而充分地清洗放置构件的内部。解决方案：该真空抽吸用工具包括：由多孔体形成的放置构件1，用于在其上放置吸附物F，支撑构件2具有用于容纳形成在其一个主平面侧上的放置构件1的凹部2a 并且在将放置构件保存在凹部2a的状态下支撑放置构件，以及用于将配置构件1接合到支撑构件2的粘合层3，支撑构件2插入在与上表面相对的下表面之间，载置构件1上的吸附物F和支撑构件2的凹部2a的底面。该工具还包括环状密封层4，其通过将至少含有有机粘合剂的玻璃粉末熔融固化在支撑构件2中的凹部2a的底面，以围绕放置构件和粘合剂层3之间的边界区域沿着周边壁面凹部2a。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005125446A Vacuum suction tool 有权
标题翻译：真空吸尘器
公开(公告)号：JP2005125446A
公开(公告)日：2005-05-19
申请号：JP2003362997
申请日：2003-10-23
申请人： Nihon Ceratec Co Ltd , Taiheiyo Cement Corp , 太平洋セメント株式会社 , 株式会社日本セラテック
发明人： OGURA TOMOYUKI , SATO SHINYA , UMEKI AKIKO , SHIOGAI TATSUYA , MORI MASAHIRO , SASAKI SHUNICHI , ISHINO TOMOHIRO
IPC分类号： B23Q3/08 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a vacuum suction tool sufficiently endurable against long-term use, while maintaining superior suction performance, by eliminating clogging of a placing member by cleaning processing, by sufficiently cleaning the inside of the placing member. SOLUTION: This vacuum suction tool has the placing member 1 composed of a porous body, a support member 2, and an adhesive layer 3 for joining the placing member 1 to the support member 2. The vacuum suction tool is characterized by arranging an annular sealing layer 4 provided by being melted and solidified after arranging annular plate glass or a material applied with glass powder including at least an organic adhesive in a surface of the annular plate glass, so as to surround a boundary area between the placing member 1 and the adhesive layer 3 along a peripheral wall surface of a recessed part on a bottom surface of the recessed part in the support member 2. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过充分清洁放置构件的内部，通过清洁处理消除放置构件的堵塞，提供足够耐久耐用的真空吸附工具，同时保持优异的吸入性能。解决方案：该真空抽吸工具具有由多孔体，支撑构件2和用于将放置构件1接合到支撑构件2的粘合剂层3构成的放置构件1.真空吸附工具的特征在于布置环状密封层4，其通过在将环形平板玻璃或施加有至少包含有机粘合剂的玻璃粉末的材料布置在环形板玻璃的表面中之后熔融固化，以围绕放置构件1 以及粘合剂层3沿着支撑构件2的凹部的底面上的凹部的周壁表面。（C）2005，JPO＆NCIPI

3. 发明专利

JP2006093491A Vacuum suction apparatus 有权
标题翻译：真空吸尘装置
公开(公告)号：JP2006093491A
公开(公告)日：2006-04-06
申请号：JP2004278718
申请日：2004-09-27
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： SATO SHINYA , OGURA TOMOYUKI , UMEKI AKIKO , SHIOGAI TATSUYA
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a vacuum suction apparatus which has a superior durability and can secure a good planarity for a suction surface and can be easily manufactured. SOLUTION: The vacuum suction apparatus 10 comprises a placement 11 formed of a ceramic/glass composite porous material and an annular placement 12 formed of a ceramic/glass composite porous material and arranged around the placement 11, which are for sucking and supporting a semiconductor wafer W; an intermediate glass 13 formed between the placement 11 and the annular placement 12; and a support 14 which contains suction holes 15 communicating with pores of the placement 11 and supports the placement 11 and the annular placement 12. There is essentially no space between the placement 11 and the support 14, between the annular placement 12 and the support 14, between the placement 11 and the intermediate glass 13, and between the annular placement 12 and the intermediate glass 13. Each is joined directly to its mating portion. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有优异的耐久性并且可以确保吸引表面的良好平坦度并且可以容易地制造的真空抽吸装置。解决方案：真空抽吸装置10包括由陶瓷/玻璃复合多孔材料形成的放置11和由陶瓷/玻璃复合多孔材料形成的环形放置件12，并布置在放置位置11周围，用于吸附和支撑半导体晶片W; 中间玻璃13，形成在放置部11与环状配置体12之间; 以及支撑件14，其包含与安置件11的孔连通并且支撑放置件11和环形放置件12的抽吸孔15.在环形放置件12和支承件14之间，放置件11和支撑件14之间基本上没有空间，位于放置11和中间玻璃13之间，以及环形放置件12和中间玻璃13之间。每一个都直接连接到其配合部分。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004031479A Electrostatic chuck 有权
公开(公告)号：JP2004031479A
公开(公告)日：2004-01-29
申请号：JP2002182748
申请日：2002-06-24
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： SHIOGAI TATSUYA , OGURA TOMOYUKI , UMEKI AKIKO
IPC分类号： H01L21/683 , H01L21/68 , H02N13/00
摘要： PROBLEM TO BE SOLVED: To provide an electrostatic chuck having extremely improved high breakdown voltage characteristics by improving the impregnation properties of a hole sealing treatment agent in a structure where an electrode layer formed inside has an opening. SOLUTION: The electrostatic chuck comprises a base 1, a lower insulating layer 2 formed on the upper surface of the base 1 by flame spraying, an electrode layer 3 formed on the lower insulating layer 2, and an upper insulating layer 4 formed on the lower insulating layer 2 by flame spraying so that the electrode layer 3 is covered, where the opening ratio of the electrode layer 3 ranges from 5 to 80%. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2006086389A Jig for vacuum suction 有权
标题翻译：吸入真空吸尘器
公开(公告)号：JP2006086389A
公开(公告)日：2006-03-30
申请号：JP2004270731
申请日：2004-09-17
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： SHIOGAI TATSUYA , OGURA TOMOYUKI , SATO SHINYA , UMEKI AKIKO
IPC分类号： H01L21/683 , B24B37/30 , H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To constitute so that static electricity generated in a semiconductor wafer during processing do not accumulate, and to suppress generation of particles caused by the omission of the particles, by making higher mechanical adhesion strength of a conductive layer formed on a placement surface, in a jig for vacuum suction. SOLUTION: The jig for vacuum suction includes a placement constituted by a porous material on which a material for suction is placed, a support portion, in which a recess for holding placement is formed, and a jointing portion to joint the placement to the support portion. A diamond-like carbon film is formed on the surface of the placement with a thickness of 1 to 5 μm. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了使得在加工期间在半导体晶片中产生的静电不积累，并且通过形成更高的导电层的机械粘合强度来抑制由于省略颗粒而产生的颗粒的产生在放置表面上，用于真空抽吸的夹具。解决方案：用于真空吸附的夹具包括由其上放置有吸引材料的多孔材料构成的放置件，形成有用于保持放置的凹部的支撑部分和用于将放置接合的接合部分支撑部。在该位置的表面上形成厚度为1〜5μm的类金刚石碳膜。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005223037A Electrostatic chuck 审中-公开
标题翻译：静电卡
公开(公告)号：JP2005223037A
公开(公告)日：2005-08-18
申请号：JP2004027592
申请日：2004-02-04
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： OGURA TOMOYUKI , UMEKI AKIKO , SHIOGAI TATSUYA
IPC分类号： H01L21/683 , H01L21/68 , H02N13/00
摘要： PROBLEM TO BE SOLVED: To provide an electrostatic chuck having a ceramic dielectric layer having an excellent attraction force inhibiting generation of particles, and further forming a DLC film on the dielectric layer. SOLUTION: The electrostatic chuck has the ceramic dielectric layer, and attracts a substance to be attracted on the dielectric layer. In the electrostatic chuck, the dielectric layer is coated with the DLC film having a film thickness of 3 to 40 μm. In the chuck, the value of the volume resistivity of the DLC film is kept within a range of 1 to 100 times of the volume resistivity of the dielectric layer. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有阻止颗粒产生的优异吸引力的陶瓷介电层的静电卡盘，并且在电介质层上进一步形成DLC膜。解决方案：静电卡盘具有陶瓷介电层，并吸引被吸引在介电层上的物质。在静电卡盘中，电介质层涂覆有膜厚度为3〜40μm的DLC膜。在卡盘中，DLC膜的体积电阻率的值保持在电介质层的体积电阻率的1〜100倍的范围内。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2005212000A Vacuum suction device 审中-公开
标题翻译：真空吸尘装置
公开(公告)号：JP2005212000A
公开(公告)日：2005-08-11
申请号：JP2004019205
申请日：2004-01-28
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： SATO SHINYA , OGURA TOMOYUKI , UMEKI AKIKO , SHIOGAI TATSUYA
IPC分类号： B25J15/06
摘要： PROBLEM TO BE SOLVED: To largely improve flat processing accuracy of a wafer, by eliminating a level difference and clearance of a joining part of a placing part and a support part by forming an eaves-shaped thin part overhanging to the placing part side in an upper surface inner peripheral part of the support part of a vacuum suction device.
SOLUTION: This vacuum suction device has the placing part composed of a porous body having an opening air hole and the support part composed of a dense body. The device is constituted so that the placing part and the support part are substantially closely and directly joined, and the eaves-shaped thin part overhanging to the placing part side is formed in the upper surface inner peripheral part of the support part.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了大大提高晶片的平面加工精度，通过形成向配置部件伸出的檐形薄部件，消除了放置部件和支撑部件的接合部分的水平差和间隙在真空抽吸装置的支撑部分的上表面内周部分中。该真空抽吸装置具有由具有开口孔的多孔体和由致密体构成的支撑部构成的放置部。该装置构造成使得放置部分和支撑部分基本上紧密且直接地接合，并且在支撑部分的上表面内周部分中形成悬垂到放置部分侧的檐形薄部分。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2005205507A Vacuum-sucking device and its manufacturing method 审中-公开
标题翻译：真空吸收装置及其制造方法
公开(公告)号：JP2005205507A
公开(公告)日：2005-08-04
申请号：JP2004012057
申请日：2004-01-20
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： SATO SHINYA , OGURA TOMOYUKI , UMEKI AKIKO , SHIOGAI TATSUYA
IPC分类号： B25J15/06 , B23Q3/08 , B24B37/30 , H01L21/304 , H01L21/677 , H01L21/68 , H01L21/683 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a vacuum sucking device and its manufacturing method for maintaining the flatness of a sucking surface even in use, by having the sucking surface superior in the flatness. SOLUTION: This vacuum-sucking device 10 is composed of a placing part 11 having a porous structure having an opening air hole and sucking and holding a wafer W by its surface, and a support part 12 for supporting the placing part 11. A recess-projection part 18 is formed at the inside bottom of the support part 12, and a recess-projection part 19 fitted to this recess-projection part 18, is formed on an under surface of the placing part 11, and the placing part 11 and the support part 12 are substantially closely and directly joined. A groove part 13a communicating with the opening air hole possessed by the placing part 11 is arranged on a projecting wall 18a of the recess-projection part 18 as a sucking air hole for generating vacuum suction force in the placing part 11. A first through-hole 13b is arranged in the support part 12 so as to communicate with this groove part 13a. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种真空吸附装置及其制造方法，其特征在于，即使在使用中也能够使吸附面的平坦度维持在平坦度以上。该真空吸引装置10由具有开放空气孔的多孔结构的放置部11及其表面吸附保持晶片W构成，以及用于支撑放置部11的支撑部12。凹部突起部18形成在支撑部12的内侧底部，并且嵌合在该凹凸部18上的凹凸部19形成在放置部11的下表面上， 11和支撑部分12基本上紧密地并且直接接合。与放置部11所具有的开口孔连通的槽部13a配置在凹凸部18的突出壁18a上，作为在放置部11中产生真空吸引力的吸气孔。孔13b布置在支撑部分12中以便与该沟槽部分13a连通。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005057214A Electrostatic chuck and its manufacturing method 有权
标题翻译：静电卡车及其制造方法
公开(公告)号：JP2005057214A
公开(公告)日：2005-03-03
申请号：JP2003289262
申请日：2003-08-07
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： OGURA TOMOYUKI , UMEKI AKIKO , SHIOGAI TATSUYA
IPC分类号： H01L21/683 , H01L21/68 , H02N13/00
摘要： PROBLEM TO BE SOLVED: To provide an electrostatic chuck which exerts withstand voltage characteristics without allowing separation of an upper insulating layer even when the upper insulating layer has a large thickness, and also to provide its manufacturing method. SOLUTION: The electrostatic chuck comprises a substrate, a lower insulating layer formed on an upper surface of the substrate, an electrode layer formed on the lower insulating layer, and the upper insulating layer formed on the lower insulating layer so as to cover the electrode layer. An edge of the upper insulating layer is arranged to have a tapered form. Thus, while it is necessary to thicken the upper insulating layer in order to ensure electrostatic chuck of large holding power, which, in turn, eliminates the problem of allowing occurrences of separation of an insulating film from an end of the electrostatic chuck. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使当上绝缘层具有大的厚度时，也可提供施加耐电压特性而不允许上绝缘层分离的静电卡盘，并提供其制造方法。解决方案：静电卡盘包括基板，形成在基板的上表面上的下绝缘层，形成在下绝缘层上的电极层，以及形成在下绝缘层上的上绝缘层，以覆盖电极层。上绝缘层的边缘被布置成具有锥形。因此，为了确保具有大的保持力的静电卡盘而需要加厚上绝缘层，这进而消除了使绝缘膜与静电卡盘的端部分离的问题。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2006093492A Vacuum suction apparatus 有权
标题翻译：真空吸尘装置
公开(公告)号：JP2006093492A
公开(公告)日：2006-04-06
申请号：JP2004278719
申请日：2004-09-27
申请人： Taiheiyo Cement Corp , 太平洋セメント株式会社
发明人： SATO SHINYA , OGURA TOMOYUKI , UMEKI AKIKO , SHIOGAI TATSUYA
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a vacuum suction apparatus which has a superior durability and can secure a good planarity for a suction surface and can be easily manufactured. SOLUTION: The vacuum suction apparatus 10 comprises a placement 11 formed of a ceramic/glass composite porous material and an annular placement 12 formed of a ceramic/glass composite porous material and arranged around the placement 11, which are for sucking and supporting a semiconductor wafer W; and a support 13 which contains suction holes 14 communicating with pores of the placement 11 and supports the placement 11 and the annular placement 12. There is essentially no space between the placement 11 and the annular placement 12, and these two are directly joined together. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有优异的耐久性并且可以确保吸引表面的良好平坦度并且可以容易地制造的真空抽吸装置。解决方案：真空抽吸装置10包括由陶瓷/玻璃复合多孔材料形成的放置11和由陶瓷/玻璃复合多孔材料形成的环形放置件12，并布置在放置位置11周围，用于吸附和支撑半导体晶片W; 以及支撑件13，其包含与放置件11的孔连通并且支撑放置件11和环形放置件12的抽吸孔14.在放置件11和环形放置件12之间基本上没有空间，并且这两个直接连接在一起。版权所有（C）2006，JPO＆NCIPI

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