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    • 3. 发明授权
    • Method of manufacturing a semiconductor device comprising a non-volatile memory with memory cells
    • 包括具有存储单元的非易失性存储器的半导体器件的制造方法
    • US06969645B2
    • 2005-11-29
    • US10482185
    • 2002-07-03
    • Jurriaan SchmitzFranciscus Petrus WiddershovenMichiel Slotboom
    • Jurriaan SchmitzFranciscus Petrus WiddershovenMichiel Slotboom
    • H01L21/8247H01L21/28H01L21/336H01L27/115H01L29/423H01L29/788H01L29/792H01L21/8238
    • H01L21/28273H01L29/42328
    • A method of manufacturing a semiconductor device comprising a non-volatile memory with memory cells (Mij) including a select transistor (T1) with a select gate (1) and including a memory transistor (T2) with a floating gate (2) and a control gate (3). In a semiconductor body (10), active semiconductor regions are formed which are mutually insulated by field oxide regions (12). Next, the surface (11) is provided with a gate oxide layer (14) and a first layer of a conductive material wherein the select gate (1) is etched. Subsequently, the walls of the select gate extending perpendicularly to the surface are provided with an isolating material (17). The gate oxide next to the select gate is replaced by a layer of tunnel oxide (18). Next, a second layer of a conductive material (21), an interlayer dielectric (25) and a third layer of a conductive material (26) are deposited. The control gate (3) extending above and next to the select gate is formed in the third layer. Using the control gate as a mask, the floating gate (2) is subsequently etched in the second layer of conductive material. In this method, the second layer is deposited in a larger thickness than the select gate, after which this layer is planarized prior to the deposition of the interlayer dielectric and the third layer of conductive material. In this manner, a compact memory cell can be manufactured.
    • 一种制造包括非易失性存储器的半导体器件的方法,所述非易失性存储器具有包括具有选择栅极(1)并且包括具有浮置栅极(2)的存储晶体管(T 2)的选择晶体管(T 1)的存储器单元(Mij) 和控制门(3)。 在半导体本体(10)中,形成由场氧化物区域(12)相互绝缘的有源半导体区域。 接下来,表面(11)设置有栅极氧化物层(14)和其中蚀刻选择栅极(1)的导电材料的第一层。 随后,垂直于表面延伸的选择栅的壁设置有隔离材料(17)。 选择栅极旁边的栅极氧化层被隧道氧化物层(18)代替。 接下来,沉积第二层导电材料(21),层间电介质(25)和第三层导电材料(26)。 在第三层中形成在选择栅极上方和下方延伸的控制栅极(3)。 使用控制栅极作为掩模,随后在第二层导电材料中蚀刻浮栅(2)。 在该方法中,第二层被沉积成比选择栅极更大的厚度,然后在沉积层间电介质和第三层导电材料之前将该层平坦化。 以这种方式,可以制造紧凑的存储单元。
    • 4. 发明授权
    • Method of manufacturing a semiconductor device with non-volatile memory comprising a memory cell with an access gate and with a control gate and a charge storage region
    • 制造具有非易失性存储器的半导体器件的方法,包括具有存取栅极的存储单元以及控制栅极和电荷存储区域
    • US06984558B2
    • 2006-01-10
    • US10485496
    • 2002-06-04
    • Michiel SlotboomFranciscus Petrus Widdershoven
    • Michiel SlotboomFranciscus Petrus Widdershoven
    • H01L21/336
    • H01L27/11568H01L21/28273H01L27/11521H01L29/42328H01L29/66825H01L29/7883
    • Method of manufacturing a semiconductor device comprising a semiconductor body (1) which is provided at a surface (2) with a non-volatile memory comprising a memory cell with a gate structure (4) with an access gate (19) and a gate structure (3) with a control gate (5) and a charge storage region situated between the control gate (5) and the semiconductor body (1), such as a floating gate (6). In this method on the surface (2) of the semiconductor body (1) a first one of said gate structures is formed with side walls (10) extending substantially perpendicular to the surface, a conductive layer is deposited (13) on and next to said first gate-structure, the conductive layer is subjected to a planarizing treatment until the first gate structure is exposed and the so planarized conductive layer is patterned so as to form at least a part of the other gate structure adjoining the first gate structure. Said patterning of the planarized conductive layer is performed in that the planarized conductive layer (14) is etched back so as to expose an upper portion (15) of the side walls of the first gate structure, a spacer (18) is formed on the exposed upper portion (15) of the side walls of first gate structure and the conductive layer (16) is etched anisotropically using the spacer as a mask. Thus very small memory cells can be realized.
    • 一种制造半导体器件的方法,包括:半导体本体(1),其在表面(2)处设置有非易失性存储器,所述非易失性存储器包括具有栅极结构(4)的存储单元,所述存储单元具有存取栅极(19)和栅极结构 (5)和位于控制栅极(5)和半导体本体(1)之间的电荷存储区域(例如浮动栅极)。 在这种方法中,在半导体本体(1)的表面(2)上,第一个所述栅极结构形成有大致垂直于所述表面延伸的侧壁(10),导电层被沉积(13) 所述第一栅极结构,对导电层进行平坦化处理,直到第一栅极结构暴露,并且将如此平坦化的导电层图案化,以形成与第一栅极结构相邻的另一栅极结构的至少一部分。 平面化导电层的所述图案化是以平坦化的导电层(14)被回蚀以便露出第一栅极结构的侧壁的上部(15)来实现的,间隔物(18)形成在 使用间隔物作为掩模,各向异性地蚀刻第一栅极结构的侧壁的暴露的上部(15)和导电层(16)。 因此,可以实现非常小的存储单元。
    • 6. 发明授权
    • Method of fabricating a dual gate FET
    • 制造双栅极FET的方法
    • US07741182B2
    • 2010-06-22
    • US11815100
    • 2006-01-23
    • Wibo Daniel Van NoortFranciscus Petrus WiddershovenRadu Surdeanu
    • Wibo Daniel Van NoortFranciscus Petrus WiddershovenRadu Surdeanu
    • H01L21/336
    • H01L29/785H01L29/66795H01L29/7854
    • The invention provides a method of fabricating an extremely short-length dual-gate FET, using conventional semi-conductor processing techniques, with extremely small and reproducible fins with a pitch and a width that are both smaller than can be obtained with photolithographic techniques. On a protrusion (2) on a substrate (1), a first layer (3) and a second layer (4) are formed, after which the top surface of the protrusion (2) is exposed. A portion of the first layer (3) is selectively removed relative to the protrusion (2) and the second layer (4), thereby creating a fin (6) and a trench (5). Also a method is presented to form a plurality of fins (6) and trenches (5). The dual-gate FET is created by forming a gate electrode (7) in the trench(es) (5) and a source and drain region. Further a method is presented to fabricate an extremely short-length asymmetric dual-gate FET with two gate electrodes that can be biased separately.
    • 本发明提供了一种使用常规半导体处理技术制造极短的双栅极FET的方法,其具有非常小且可重现的鳍,其间距和宽度都小于可以用光刻技术获得的。 在基板(1)上的突起(2)上形成第一层(3)和第二层(4),然后露出突起(2)的上表面。 相对于突起(2)和第二层(4),第一层(3)的一部分被选择性地去除,从而形成翅片(6)和沟槽(5)。 还提出了形成多个翅片(6)和沟槽(5)的方法。 通过在沟槽(5)中形成栅电极(7)和源极和漏极区域来产生双栅极FET。 此外,提出了一种制造具有可分别偏置的两个栅电极的极短的非对称双栅极FET的方法。
    • 8. 发明授权
    • Circuit for providing a constant current
    • US06559711B2
    • 2003-05-06
    • US09902219
    • 2001-07-10
    • Franciscus Petrus WiddershovenAnne Johan Annema
    • Franciscus Petrus WiddershovenAnne Johan Annema
    • G05F110
    • G05F3/30
    • Two substantially identical currents (I1,a, I1,b) are subtracted from each other, while being generated by elements (10, 11) in such a way that noise in the current value of said two currents (I1,a, I1,b) is determined by shot noise. The differential current, determined only by shot noise, is supplied to a capacitor (13). A second current (I2) is used to charge a second capacitor (22, 29). It is periodically determined whether the value of a voltage across the first capacitor (13) is within or outside a range bounded by the (negative and positive values of the) voltage of the second capacitor (22, 29) which has been charged over the same period of time. The currents (I1,b, Ib) are set in dependence on the result of the comparison. The signal to set the currents (I1,b, Ib) also serves as control signal for an element (43) connected as a constant current source. The setting signal and thus the constant current (I0) delivered by the element (43) connected as a current source is to a high degree independent of the temperature sensitivity of different components of the circuit and is determined essentially solely by the ratio of values of similar components (10, 11, 20, 27, 43) of the circuit. By choosing components whose ratio appears in a value of the constant current (I0) delivered by the circuit and which have the same temperature dependence, it is achieved that the temperature dependence disappears completely or substantially completely from the constant current (I0) delivered by the circuit.