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2. 发明公开

EP2933848A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：EP2933848A1
公开(公告)日：2015-10-21
申请号：EP15163161.1
申请日：2015-04-10
申请人： Nichia Corporation
发明人： Kuramoto, Masafumi , Imura, Toshifumi , Tanisada, Tomoki
IPC分类号： H01L33/54 , H01L33/56
摘要： The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor element (20) bonded on the base body via an adhesive member (30), wherein the adhesive member (30) contains surface-treated particles (40), or particles (40) that coexist with a dispersing agent, and at least a part of the marginal portion (301) of the adhesive member is a region where the particles (40) are unevenly distributed.
摘要翻译：本发明提供一种半导体装置，其中抑制了用于将半导体元件接合在基体上的粘合元件的湿扩散。本发明的半导体器件（100）是一种半导体器件，其包括基体（10）和经由粘合构件（30）粘合在基体上的半导体元件（20），其中粘合构件（30）包含表面处理颗粒（40）或与分散剂共存的颗粒（40），并且粘合构件的边缘部分（301）的至少一部分是颗粒（40）不均匀分布的区域。

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