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1. 发明授权

EP2383808B1 Light emitting device package having leads with a recess for the chip mount area, and corresponding manufacturing methods 有权
公开(公告)号：EP2383808B1
公开(公告)日：2018-08-29
申请号：EP11164125.4
申请日：2011-04-28
申请人： Nichia Corporation
发明人： Hayashi, Masaki , Kuramoto, Masafumi
IPC分类号： H01L33/62 , H01L23/00 , H01L33/48
CPC分类号： H01L33/62 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/85385 , H01L2224/97 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： The light emitting device (100) includes a resin package (20) provided with a recess portion (27), a light emitting element (10) housed in the recess portion (27), a sealing member (30) filled in the recess portion (27) and covering the light emitting element (10), in which the resin package (20) has leads (22a, 22b) which are not exposed two opposing outer side surfaces (20d) but are exposed from two opposing outer side surfaces which are perpendicular with the outer side surfaces (20d) , a resin portion (25) is integrally molded with the leads (22a, 22b), the upper surfaces of the leads (22a, 22b) are exposed from the resin portion 25 to the inner bottom surface (27a) of the recess portion (27), and the top surfaces of the leads (22a, 22b) are formed such that the region constituting the inner bottom surface of the recess portion (27) are lower than their peripheral region.

2. 发明授权

EP2485286B1 Light emitting device 有权
公开(公告)号：EP2485286B1
公开(公告)日：2018-03-21
申请号：EP12153247.7
申请日：2012-01-31
申请人： Nichia Corporation
发明人： Hayashi, Masaki
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： F21V23/001 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2924/01322 , H01L2924/00014
摘要： A light emitting device (10) with high reliability is provided. The light emitting device according to the present invention includes a resin molded body (11) having a recess (111), a first electrically conductive member (121) and a second electrically conductive member (122) each having terminal portions respectively exposed from a first outer side surface (112a) and second outer side surface (112b) which are opposite outer side surfaces among the outer side surfaces of the resin molded body (11), and a light emitting element (13) mounted on the first electrically conductive member exposed at a bottom surface of the recess. The recess has a first bottom surface (111a) on which the light emitting element (13) is mounted and a second bottom surface (111b) arranged at a higher position of the outer periphery of the first bottom surface (111a). The first electrically conductive member (121) has a first bend portion (121b) which is at a position spaced apart from a center line connecting the center of the first outer side surface (112a) and the center of the second outer side surface (112b) and which extends upward away from the first bottom surface (111a). The first electrically conductive member (121) also has a first exposed portion (121c) which is continuous to the first bend portion (121b) and is exposed at the second bottom surface (111b).

3. 发明公开

EP2485286A2 Light emitting device 有权
标题翻译： Lichtemittierende Vorrichtung
公开(公告)号：EP2485286A2
公开(公告)日：2012-08-08
申请号：EP12153247.7
申请日：2012-01-31
申请人： Nichia Corporation
发明人： Hayashi, Masaki
IPC分类号： H01L33/62
CPC分类号： F21V23/001 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2924/01322 , H01L2924/00014
摘要： A light emitting device (10) with high reliability is provided. The light emitting device according to the present invention includes a resin molded body (11) having a recess (111), a first electrically conductive member (121) and a second electrically conductive member (122) each having terminal portions respectively exposed from a first outer side surface (112a) and second outer side surface (112b) which are opposite outer side surfaces among the outer side surfaces of the resin molded body (11), and a light emitting element (13) mounted on the first electrically conductive member exposed at a bottom surface of the recess. The recess has a first bottom surface (111a) on which the light emitting element (13) is mounted and a second bottom surface (111b) arranged at a higher position of the outer periphery of the first bottom surface (111a). The first electrically conductive member (121) has a first bend portion (121b) which is at a position spaced apart from a center line connecting the center of the first outer side surface (112a) and the center of the second outer side surface (112b) and which extends upward away from the first bottom surface (111a). The first electrically conductive member (121) also has a first exposed portion (121c) which is continuous to the first bend portion (121b) and is exposed at the second bottom surface (111b).
摘要翻译：提供了具有高可靠性的发光装置（10）。根据本发明的发光器件包括具有凹部（111），第一导电构件（121）和第二导电构件（122）的树脂成型体（11），每个端子部分分别从第一外侧表面（112a）和第二外侧表面（112b），其与树脂模制体（11）的外侧表面中的外侧表面相对，以及安装在第一导电构件上的发光元件（13）暴露在凹部的底面。所述凹部具有安装有所述发光元件（13）的第一底面（111a）和布置在所述第一底面（111a）的外周的较高位置的第二底面（111b）。第一导电构件（121）具有第一弯曲部（121b），该第一弯曲部位于与连接第一外侧面（112a）的中心和第二外侧面（112b）的中心的中心线），并且其从第一底表面（111a）向上延伸。第一导电构件（121）还具有与第一弯曲部分（121b）连续并且在第二底面（111b）处露出的第一暴露部分（121c）。

4. 发明公开

EP2485286A3 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：EP2485286A3
公开(公告)日：2014-08-27
申请号：EP12153247.7
申请日：2012-01-31
申请人： Nichia Corporation
发明人： Hayashi, Masaki
IPC分类号： H01L33/62
CPC分类号： F21V23/001 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2924/01322 , H01L2924/00014
摘要： A light emitting device (10) with high reliability is provided. The light emitting device according to the present invention includes a resin molded body (11) having a recess (111), a first electrically conductive member (121) and a second electrically conductive member (122) each having terminal portions respectively exposed from a first outer side surface (112a) and second outer side surface (112b) which are opposite outer side surfaces among the outer side surfaces of the resin molded body (11), and a light emitting element (13) mounted on the first electrically conductive member exposed at a bottom surface of the recess. The recess has a first bottom surface (111a) on which the light emitting element (13) is mounted and a second bottom surface (111b) arranged at a higher position of the outer periphery of the first bottom surface (111a). The first electrically conductive member (121) has a first bend portion (121b) which is at a position spaced apart from a center line connecting the center of the first outer side surface (112a) and the center of the second outer side surface (112b) and which extends upward away from the first bottom surface (111a). The first electrically conductive member (121) also has a first exposed portion (121c) which is continuous to the first bend portion (121b) and is exposed at the second bottom surface (111b).
摘要翻译：提供了一种具有高可靠性的发光装置（10）。根据本发明的发光器件包括具有凹部（111），第一导电构件（121）和第二导电构件（122）的树脂成型体（11），每个导电构件具有分别从第一在所述树脂成形体（11）的外侧面中的相对的外侧面中的相对的外侧面（112a）和第二外侧面（112b）;以及发光元件（13），其安装在所述第一导电构件暴露的在凹陷的底部表面处。凹部具有安装发光元件（13）的第一底面（111a）和配置在第一底面（111a）的外周的高位置的第二底面（111b）。第一导电构件121具有第一弯曲部121b，该第一弯曲部121b位于从连接第一外侧面112a的中心和第二外侧面112b的中心的中心线离开的位置）并且从第一底表面（111a）向上延伸。第一导电构件（121）还具有与第一弯曲部分（121b）连续并且在第二底表面（111b）处暴露的第一暴露部分（121c）。

5. 发明公开

EP2383808A3 Light emitting device package having leads with a recess for the chip mount area 有权
标题翻译：的光与所述导体芯片的安装区域中的凹部的发光装置。
公开(公告)号：EP2383808A3
公开(公告)日：2014-08-27
申请号：EP11164125.4
申请日：2011-04-28
申请人： Nichia Corporation
发明人： Hayashi, Masaki , Kuramoto, Masafumi
IPC分类号： H01L33/62 , H01L23/00 , H01L33/48
CPC分类号： H01L33/62 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/85385 , H01L2224/97 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： The light emitting device (100) includes a resin package (20) provided with a recess portion (27), a light emitting element (10) housed in the recess portion (27), a sealing member (30) filled in the recess portion (27) and covering the light emitting element (10), in which the resin package (20) has leads (22a, 22b) which are not exposed two opposing outer side surfaces (20d) but are exposed from two opposing outer side surfaces which are perpendicular with the outer side surfaces (20d) , a resin portion (25) is integrally molded with the leads (22a, 22b), the upper surfaces of the leads (22a, 22b) are exposed from the resin portion 25 to the inner bottom surface (27a) of the recess portion (27), and the top surfaces of the leads (22a, 22b) are formed such that the region constituting the inner bottom surface of the recess portion (27) are lower than their peripheral region.

6. 发明公开

EP2196501A1 Thermoseting epoxy resin composition and semiconductor device 有权
标题翻译： ämeäare ung ung ung ung ung ung ung ung ung ung ung ung ung
公开(公告)号：EP2196501A1
公开(公告)日：2010-06-16
申请号：EP09252742.3
申请日：2009-12-07
申请人： Nichia Corporation
发明人： Hayashi, Masaki , Taguchi, Yusuke , Tomiyoshi, Kazutoshi , Tada, Tomoyoshi
IPC分类号： C08L63/00 , H01L23/29
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by:

R 11 -COO-R 12 (1)

wherein R 11 and R 12 are C n H 2n+1 , and n is 1 to 30 and a compound represented by:

wherein R 1 , R 2 , and R 3 are selected from H, -OH, -OR, and -OCOC a H b with the proviso that at least one includes -OCOC a H b ; R is C n H zn+1 (wherein n is an integer of 1 to 30), a is 10 to 30, and b is 17 to 61.
摘要翻译：一种热固性环氧树脂组合物，其包含（A）三嗪衍生物环氧树脂和酸酐的反应混合物，其中所述环氧基当量相对于酸酐当量为0.6-2.0; （B）内部脱模剂; （C）反射材料; （D）无机填料; 和（E）固化催化剂。组分（B）的内部脱模剂包括由以下物质表示的羧酸酯：ƒ€ƒ€ƒ€ƒ€ƒ€ƒR 11 -COO-R 12€ƒ€ƒ€ƒ€ƒ （1）其中R 11和R 12为C n H 2n + 1，n为1至30，由下式表示的化合物：其中R 1，R 2和R 3选自H，-OH，-OR，和-OCOC a H b，条件是至少一个包括-OCOC a H b; R为C n H zn + 1（其中n为1〜30的整数），a为10〜30，b为17〜61。

7. 发明公开

EP2383808A2 Light emitting device package having leads with a recess for the chip mount area 有权
标题翻译： Lichtemittierende Vorrichtung mit einer Vertiefung in den Leiternfürden Montagebereichs des Chips。
公开(公告)号：EP2383808A2
公开(公告)日：2011-11-02
申请号：EP11164125.4
申请日：2011-04-28
申请人： Nichia Corporation
发明人： Hayashi, Masaki , Kuramoto, Masafumi
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/48095 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/85385 , H01L2224/97 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： The light emitting device (100) includes a resin package (20) provided with a recess portion (27), a light emitting element (10) housed in the recess portion (27), a sealing member (30) filled in the recess portion (27) and covering the light emitting element (10), in which the resin package (20) has leads (22a, 22b) which are not exposed two opposing outer side surfaces (20d) but are exposed from two opposing outer side surfaces which are perpendicular with the outer side surfaces (20d) , a resin portion (25) is integrally molded with the leads (22a, 22b), the upper surfaces of the leads (22a, 22b) are exposed from the resin portion 25 to the inner bottom surface (27a) of the recess portion (27), and the top surfaces of the leads (22a, 22b) are formed such that the region constituting the inner bottom surface of the recess portion (27) are lower than their peripheral region.
摘要翻译：发光装置（100）包括设置有凹部（27）的树脂封装（20），容纳在凹部（27）中的发光元件（10）），填充在凹部（27）中的密封部件（27）并且覆盖所述树脂封装（20）具有引导（22a，22b）的所述发光元件（10），所述引线（22a，22b）没有暴露于两个相对的外侧表面（20d），但是从两个相对的外侧表面露出与外侧表面（20d）垂直，树脂部分（25）与引线（22a，22b）整体模制，引线（22a，22b）的上表面从树脂部分25露出到内部凹部（27）的底面（27a）和引线（22a，22b）的上表面形成为使得构成凹部（27）的内底面的区域比周边区域低。

8. 发明授权

EP2196501B1 Thermosetting epoxy resin composition and semiconductor device 有权
标题翻译：热固性环氧树脂组合物和半导体器件
公开(公告)号：EP2196501B1
公开(公告)日：2011-05-04
申请号：EP09252742.3
申请日：2009-12-07
申请人： Nichia Corporation
发明人： Hayashi, Masaki , Taguchi, Yusuke , Tomiyoshi, Kazutoshi , Tada, Tomoyoshi
IPC分类号： C08L63/00 , H01L23/29
CPC分类号： C08G59/3245 , C08G59/186 , C08G59/42 , C08L63/00 , C08L63/06 , H01L23/24 , H01L23/293 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L33/56 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/97 , H01L2924/01322 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

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