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1. 发明授权

US07049188B2 Lateral doped channel 有权
标题翻译：横向掺杂通道
公开(公告)号：US07049188B2
公开(公告)日：2006-05-23
申请号：US10305724
申请日：2002-11-26
申请人： Nga-Ching Wong , Timothy Thurgate , Sameer S. Haddad
发明人： Nga-Ching Wong , Timothy Thurgate , Sameer S. Haddad
IPC分类号： H01L21/8238
CPC分类号： H01L27/11521 , H01L21/26586 , H01L27/105 , H01L27/1052 , H01L27/115 , H01L27/11568 , H01L29/1045 , H01L29/66825 , H01L29/66833
摘要： A lateral doped channel. A first doping material is implanted substantially vertically into a region adjacent to a gate structure. A diffusion process diffuses the first doping material into a channel region beneath the gate structure. A second doping material is implanted substantially vertically into the region adjacent to a gate structure. The second implantation forms source/drain regions and may terminate the channel region. The channel region thus comprises a laterally non-uniform doping profile which beneficially mitigates the short channel effect and is highly advantageous as compensation for manufacturing process variations in channel length.
摘要翻译：横向掺杂通道。第一掺杂材料基本上垂直地植入到与栅极结构相邻的区域中。扩散过程将第一掺杂材料扩散到栅极结构下方的沟道区域中。基本垂直地将第二掺杂材料注入到与栅极结构相邻的区域中。第二注入形成源极/漏极区域并且可以终止沟道区域。因此，通道区域包括横向不均匀的掺杂分布，其有利地减轻了短沟道效应，并且作为对通道长度的制造工艺变化的补偿是非常有利的。

2. 发明授权

US06518072B1 Deposited screen oxide for reducing gate edge lifting 有权
标题翻译：沉积的屏幕氧化物，用于减少门边缘提升
公开(公告)号：US06518072B1
公开(公告)日：2003-02-11
申请号：US09476906
申请日：2000-01-03
申请人： Carl Robert Huster , Daniel Sobek , Timothy Thurgate , Sameer S. Haddad
发明人： Carl Robert Huster , Daniel Sobek , Timothy Thurgate , Sameer S. Haddad
IPC分类号： H01L218247
CPC分类号： H01L29/66825 , H01L21/28273 , H01L29/42324
摘要： A method of manufacturing a flash memory device with a controllable amount of gate edge lifting including etching the ends of the tunnel oxide forming a cavity at each end of the tunnel oxide and anisotropically depositing and etching an oxide to form spacers on the sides of the gate stack. The spacers have a predetermined thickness that controls the amount of gate edge lifting. The predetermined thickness is determined during a characterization procedure that can be a computer modeling procedure or it can be determined empirically.
摘要翻译：一种制造具有可控量的栅极边缘提升的闪速存储器件的方法，包括蚀刻隧道氧化物的端部，在隧道氧化物的每一端处形成空腔，并各向异性沉积和蚀刻氧化物以在栅极的侧面上形成间隔物堆栈间隔物具有控制浇口边缘提升量的预定厚度。在可以是计算机建模过程的表征过程中确定预定厚度，或者可以凭经验确定。

3. 发明授权

US06268624B1 Method for inhibiting tunnel oxide growth at the edges of a floating gate during semiconductor device processing 有权
标题翻译：在半导体器件处理期间抑制浮栅的边缘处的隧道氧化物生长的方法
公开(公告)号：US06268624B1
公开(公告)日：2001-07-31
申请号：US09364982
申请日：1999-07-31
申请人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
发明人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
IPC分类号： H01L218247
CPC分类号： H01L21/28273
摘要： A method for making a ULSI MOSFET chip includes forming a MOSFET gate stack on a substrate, with a tunnel oxide layer being sandwiched between the gate stack and substrate. To prevent thickening of the tunnel oxide layer into a “gate edge lifting” profile during subsequent oxidation-causing steps, at least one protective barrier film is deposited or grown over the gate stack and tunnel oxide layer immediately after gate stack formation. Then, subsequent steps, including forming source and drain regions for the gate stack, can be undertaken without causing thickening of the tunnel oxide layer.
摘要翻译：制造ULSI MOSFET芯片的方法包括在衬底上形成MOSFET栅极叠层，其中隧道氧化层夹在栅叠层和衬底之间。为了防止隧道氧化物层在随后的氧化引发步骤期间增厚到“栅极边缘提升”轮廓中，在栅极堆叠形成之后立即沉积或生长至少一个保护性阻挡膜在栅极堆叠和隧道氧化物层上。然后，可以进行包括形成栅极堆叠的源极和漏极区域的后续步骤，而不会导致隧道氧化物层的增厚。

4. 发明授权

US06911704B2 Memory cell array with staggered local inter-connect structure 失效
公开(公告)号：US06911704B2
公开(公告)日：2005-06-28
申请号：US10685044
申请日：2003-10-14
申请人： Mark W. Randolph , Sameer S. Haddad , Timothy Thurgate , Richard Fastow
发明人： Mark W. Randolph , Sameer S. Haddad , Timothy Thurgate , Richard Fastow
IPC分类号： G11C16/04 , H01L21/8246 , H01L21/8247 , H01L27/115 , H01L27/082
CPC分类号： H01L27/11568 , G11C16/0483 , H01L27/115 , H01L27/11521
摘要： A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.

5. 发明授权

US06337246B1 Method for inhibiting tunnel oxide growth at the edges of a floating gate during semiconductor device processing 有权
标题翻译：在半导体器件处理期间抑制浮栅的边缘处的隧道氧化物生长的方法
公开(公告)号：US06337246B1
公开(公告)日：2002-01-08
申请号：US09824841
申请日：2001-04-02
申请人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
发明人： Daniel Sobek , Timothy Thurgate , Carl R. Huster , Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad
IPC分类号： H01L218247
CPC分类号： H01L21/28273
摘要： A method for making a ULSI MOSFET chip includes forming a MOSFET gate stack on a substrate, with a tunnel oxide layer being sandwiched between the gate stack and substrate. To prevent thickening of the tunnel oxide layer into a “gate edge lifting” profile during subsequent oxidation-causing steps, at least one protective barrier film is deposited or grown over the gate stack and tunnel oxide layer immediately after gate stack formation. Then, subsequent steps, including forming source and drain regions for the gate stack, can be undertaken without causing thickening of the tunnel oxide layer.
摘要翻译：制造ULSI MOSFET芯片的方法包括在衬底上形成MOSFET栅极叠层，其中隧道氧化层夹在栅叠层和衬底之间。为了防止隧道氧化物层在随后的氧化引发步骤期间增厚到“栅极边缘提升”轮廓中，在栅极堆叠形成之后立即沉积或生长至少一个保护性阻挡膜在栅极堆叠和隧道氧化物层上。然后，可以进行包括形成栅极堆叠的源极和漏极区域的后续步骤，而不会导致隧道氧化物层的增厚。

6. 发明授权

US06974989B1 Structure and method for protecting memory cells from UV radiation damage and UV radiation-induced charging during backend processing 有权
标题翻译：用于保护记忆细胞免受后期处理中的紫外线辐射损伤和紫外线辐射诱导的充电的结构和方法
公开(公告)号：US06974989B1
公开(公告)日：2005-12-13
申请号：US10841933
申请日：2004-05-06
申请人： Cinti X. Chen , Boon-Yong Ang , Hajime Wada , Sameer S. Haddad , Inkuk Kang
发明人： Cinti X. Chen , Boon-Yong Ang , Hajime Wada , Sameer S. Haddad , Inkuk Kang
IPC分类号： H01L21/8246 , H01L21/8247 , H01L27/108 , H01L27/115
CPC分类号： H01L27/115 , H01L27/11521 , H01L27/11568
摘要： According to one exemplary embodiment, a structure comprises a substrate. The structure further comprises at least one memory cell situated on the substrate. The structure further comprises a first interlayer dielectric layer situated over the at least one memory cell and over the substrate. The structure further comprises an oxide cap layer situated on the first interlayer dielectric layer. According to this exemplary embodiment, the structure further comprises an etch stop layer comprising TCS nitride situated on the oxide cap layer, where the etch stop layer blocks UV radiation. The structure further comprises a second interlayer dielectric layer situated on the etch stop layer. The structure may further comprise a trench situated in the second interlayer dielectric layer and the etch stop layer, where the trench is filled with copper. The structure may further comprise an anti-reflective coating layer situated on the second interlayer dielectric layer.
摘要翻译：根据一个示例性实施例，一种结构包括基底。该结构还包括位于基板上的至少一个存储单元。所述结构还包括位于所述至少一个存储单元上并位于所述衬底之上的第一层间介电层。该结构还包括位于第一层间介电层上的氧化物覆盖层。根据该示例性实施例，该结构还包括位于氧化物覆盖层上的包含TCS氮化物的蚀刻停止层，其中蚀刻停止层阻挡UV辐射。该结构还包括位于蚀刻停止层上的第二层间介电层。该结构还可以包括位于第二层间电介质层和蚀刻停止层中的沟槽，其中沟槽被铜填充。该结构还可以包括位于第二层间介电层上的抗反射涂层。

7. 发明授权

US06808996B1 Method for protecting gate edges from charge gain/loss in semiconductor device 有权
标题翻译：在半导体器件中保护栅极边缘免受电荷增益/损耗的方法
公开(公告)号：US06808996B1
公开(公告)日：2004-10-26
申请号：US09376659
申请日：1999-08-18
申请人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
发明人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
IPC分类号： H01L21336
CPC分类号： H01L27/11521 , H01L27/115
摘要： A method for making a ULSI MOSFET includes covering core gate stacks with a first protective layer, etching away the first layer such that intended source regions of the substrate are exposed, and implanting dopant into the source regions. A second protective layer is then deposited over the first layer and is etched back to conform to the first layer, covering only the sides of the gate stacks, and exposing intended drain regions of the substrate. Dopant is then implanted into the drain regions. During subsequent manufacturing steps including ILD formation and metallization, mobile ions and other process-induced charges are blocked from entering the floating gates of the gate stacks by the protective layers, thereby preventing unwanted charge gain/loss.
摘要翻译：制造ULSI MOSFET的方法包括用第一保护层覆盖芯栅极叠层，蚀刻掉第一层，使得衬底的预期源极区域暴露，并将掺杂剂注入到源极区域中。然后在第一层上沉积第二保护层，并将其回蚀刻以符合第一层，仅覆盖栅极堆叠的侧面，并暴露衬底的预期漏极区域。然后将掺杂剂注入漏区。在包括ILD形成和金属化的后续制造步骤期间，阻止移动离子和其它工艺感应电荷被保护层进入栅极堆叠的浮置栅极，从而防止不必要的电荷增益/损耗。

8. 发明授权

US06795357B1 Method for reading a non-volatile memory cell 失效
标题翻译：读取非易失性存储单元的方法
公开(公告)号：US06795357B1
公开(公告)日：2004-09-21
申请号：US10283590
申请日：2002-10-30
申请人： Zhizheng Liu , Yi He , Mark W. Randolph , Sameer S. Haddad
发明人： Zhizheng Liu , Yi He , Mark W. Randolph , Sameer S. Haddad
IPC分类号： G11C700
CPC分类号： G11C16/0491 , G11C16/0475 , G11C16/26
摘要： A method of detecting a charge stored on a charge storage region of a first dual bit dielectric memory cell within an array of dual bit dielectric memory cells comprises applying a source voltage to a first bit line that is the source of the selected memory cell and applying a drain voltage to a second bit line that forms a drain junction with the channel region. The source voltage may be a small positive voltage and the drain voltage may be greater than the source voltage. A read voltage is applied to a selected one of the word lines that forms a gate over the charge storage region and a bias voltage is applied to non-selected word lines in the array. The bias voltage may be a negative voltage.
摘要翻译：检测存储在双位介质存储器单元阵列内的第一双位介质存储单元的电荷存储区域上的电荷的方法包括将源电压施加到作为所选存储单元的源的第一位线并施加到与沟道区形成漏极结的第二位线的漏极电压。源极电压可以是小的正电压，并且漏极电压可能大于源极电压。将读取电压施加到在电荷存储区域上形成栅极的所选择的一条字线，并且将偏置电压施加到阵列中的未选择的字线。偏置电压可以是负电压。

9. 发明授权

US06548334B1 Capping layer 失效
标题翻译：封盖层
公开(公告)号：US06548334B1
公开(公告)日：2003-04-15
申请号：US10179061
申请日：2002-06-24
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L21337
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： A method of fabricating an improved flash memory device having core stacks and periphery stacks which are protected with an oxide layer, a protective layer and an insulating layer. A high energy dopant implant is used to pass the dopant through the insulating layer, the protective layer and oxide layer into the substrate to create source and drain regions, without using a self aligned etch. The flash memory device has an intermetallic dielectric layer placed over the core stacks and the periphery stacks. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The use of a high energy dopant implant to pass through dopant through the insulating layer, the protective layer and the oxide layer into the substrate without the use of a self aligned source etch, reduces damage to the core stacks and periphery stacks caused by various etches during the production of the flash memory device and provides insulation to reduce unwanted current between the tungsten plug and the stacks.
摘要翻译：一种制造具有由氧化层，保护层和绝缘层保护的芯堆叠和外围堆叠的改进的闪存器件的方法。使用高能掺杂剂注入来使掺杂剂通过绝缘层，保护层和氧化物层进入衬底以产生源区和漏区，而不使用自对准蚀刻。闪存器件具有放置在芯堆叠和外围堆叠体上的金属间介电层。将钨塞放置在金属间介电层中以提供与闪存器件的漏极的电连接。使用高能掺杂剂注入物通过掺杂剂通过绝缘层，保护层和氧化物层进入衬底而不使用自对准源蚀刻，减少了由各种蚀刻引起的芯堆叠和外围堆叠的损坏在制造闪速存储器件期间提供绝缘以减少钨插头和堆叠之间的不必要的电流。

10. 发明授权

US06252803B1 Automatic program disturb with intelligent soft programming for flash cells 有权
标题翻译：自动程序干扰与闪存单元的智能软编程
公开(公告)号：US06252803B1
公开(公告)日：2001-06-26
申请号：US09692881
申请日：2000-10-23
申请人： Richard Fastow , Sameer S. Haddad , Lee E. Cleveland , Chi Chang
发明人： Richard Fastow , Sameer S. Haddad , Lee E. Cleveland , Chi Chang
IPC分类号： G11C1616
CPC分类号： G11C16/16
摘要： A method of erasing a flash electrically-erasable programmable read-only memory (EEPROM) device is provided which includes a plurality of memory cells. An erase pulse is applied to the plurality of memory cells. The plurality of memory cells is overerase verified and an overerase correction pulse is applied to the bitline to which the overerased memory cell is attached. This cycle is repeated until all cells verify as not being overerased. The plurality of memory cells is erase verified and another erase pulse is applied to the memory cells if there are undererased memory cells and the memory cells are again erase verified. This cycle is repeated until all cells verify as not being undererased. After erase verify is completed, the plurality of memory cells is soft program verified and a soft programming pulse is applied to the those memory cells in the plurality of memory cells which have a threshold voltage below a pre-defined minimum value. This cycle is repeated until all of those memory cells in the plurality of memory cells which have a threshold voltage below the pre-defined minimum value are brought above the pre-defined minimum value. The erase method is considered to be finished when there are no memory cells in the plurality of memory cells which have a threshold voltage below the pre-defined minimum value.
摘要翻译：提供擦除闪存电可擦除可编程只读存储器（EEPROM）设备的方法，其包括多个存储器单元。擦除脉冲被施加到多个存储单元。多个存储器单元被过度验证，并且过高修正脉冲被施加到被过度存储的存储单元附着的位线。重复此循环，直到所有的单元格都被验证为不被过高。多个存储器单元被擦除验证，并且如果存在未存储的存储器单元并且存储器单元再次被擦除验证，则另一个擦除脉冲被施加到存储器单元。重复此循环，直到所有单元格都被验证为不被忽略。在擦除验证完成之后，多个存储器单元被软件程序验证，并且将软编程脉冲施加到具有低于预定义最小值的阈值电压的多个存储单元中的那些存储单元。重复该循环，直到具有低于预定义最小值的阈值电压的多个存储器单元中的所有那些存储器单元高于预定义的最小值。当多个存储单元中没有存储单元的阈值电压低于预先定义的最小值时，擦除方法被认为是完成的。

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