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    • 4. 发明授权
    • Method of making field effect transistor in which the increase of parasitic capacitance is restrained by scale reduction
    • 制造场效应晶体管的方法,其中寄生电容的增加受缩小的限制
    • US06624034B2
    • 2003-09-23
    • US10173835
    • 2002-06-19
    • Yuji AbeNaruhisa MiuraKohei SugiharaToshiyuki OishiYasunori Tokuda
    • Yuji AbeNaruhisa MiuraKohei SugiharaToshiyuki OishiYasunori Tokuda
    • H01L21336
    • H01L29/6653H01L21/823807H01L21/823814H01L29/665H01L29/66628
    • A method of producing a semiconductor device includes forming a gate electrode on a channel region on a surface of a semiconductor region of a semiconductor substrate, the channel region having a depth in the semiconductor substrate; forming a first pair of side wall spacers on opposite sides of the gate electrode; forming elevated semiconductor layers, each elevated semiconductor layer being elevated relative to the channel region, on regions outside of the pair of side wall spacers and in which source and drain regions of a first conductivity type are to be formed; removing the pair of first side wall spacers; and forming a pair of pocket injection regions of a second conductivity type by introducing, after the side wall spacers are removed, a dopant impurity producing the second conductivity type deeper in the semiconductor substrate than a region where the side wall spacers were formed, the pair of pocket injection regions respectively covering only a neighborhood of respective side surface parts of the channel region, where the source and drain regions are to be formed, forming respective pn junctions only between the neighborhood of the side surface parts and the pocket injection regions.
    • 一种制造半导体器件的方法包括在半导体衬底的半导体区域的表面上的沟道区上形成栅电极,所述沟道区在半导体衬底中具有深度; 在栅电极的相对侧上形成第一对侧壁间隔物; 形成升高的半导体层,每个升高的半导体层相对于沟道区域升高,在一对侧壁间隔物外侧的区域上,并且将形成第一导电类型的源极和漏极区域; 移除所述一对第一侧壁间隔件; 以及形成第二导电类型的一对口袋注入区域,在除去侧壁间隔物之后,在半导体衬底中产生比形成侧壁间隔物的区域更深的第二导电类型的掺杂剂杂质,该对 分别仅覆盖要形成源极和漏极区的沟道区的各个侧表面部分的附近的口腔注入区域,仅在侧表面部分的附近和口袋注入区域之间形成相应的pn结。
    • 7. 发明授权
    • Heterojunction semiconductor device with element isolation structure
    • 具有元件隔离结构的异质结半导体器件
    • US07170109B2
    • 2007-01-30
    • US10864457
    • 2004-06-10
    • Kohei SugiharaKazunobu OtaHidekazu OdaTakahashi Hayashi
    • Kohei SugiharaKazunobu OtaHidekazu OdaTakahashi Hayashi
    • H01L31/072H01L31/109H01L31/0328H01L31/0336H01L23/48
    • H01L21/823481H01L21/76224H01L2924/0002H01L2924/00
    • A technique enabling to improve element isolation characteristic of a semiconductor device is provided. An element isolation structure is provided in a semiconductor substrate in which a silicon layer, a compound semiconductor layer and a semiconductor layer are laminated in this order. The element isolation structure is composed of a trench, a semiconductor film, and first and second insulating films. The trench extends through the semiconductor layer and extends to the inside of the compound semiconductor layer. The semiconductor film is provided on the surface of the trench, and the first insulating film is provided on the semiconductor film. The second insulting film is provided on the first insulating film and fills the trench. Since the semiconductor film is interposed between the compound semiconductor film which is exposed by the trench and the first insulating film, there is no possibility that the compound semiconductor layer is directly thermally oxidized even if the semiconductor film is thermally oxidized to form the first insulating film.
    • 提供了能够提高半导体器件的元件隔离特性的技术。 在其中硅层,化合物半导体层和半导体层依次层叠的半导体衬底中提供元件隔离结构。 元件隔离结构由沟槽,半导体膜以及第一和第二绝缘膜构成。 沟槽延伸穿过半导体层并延伸到化合物半导体层的内部。 半导体膜设置在沟槽的表面上,第一绝缘膜设置在半导体膜上。 第二绝缘膜设置在第一绝缘膜上并填充沟槽。 由于半导体膜介于通过沟槽暴露的化合物半导体膜和第一绝缘膜之间,即使半导体膜被热氧化以形成第一绝缘膜,化合物半导体层也不可能直接热氧化 。