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    • 3. 发明申请
    • METHOD FOR MANUFACTURING DIELECTRIC ELEMENT
    • 制造电介质元件的方法
    • US20090246361A1
    • 2009-10-01
    • US12409886
    • 2009-03-24
    • Hitoshi SAITANaoto TSUKAMOTOAkira SHIBUEKenji HORINO
    • Hitoshi SAITANaoto TSUKAMOTOAkira SHIBUEKenji HORINO
    • B05D5/12
    • H01L21/02197H01G4/1227H01G4/33H01L21/02282H01L21/02356H01L21/31691H01L27/016H01L28/55
    • The present invention provides a method for manufacturing a dielectric element in which a dielectric film is formed by a chemical solution deposition method, with enhanced tolerance of the dielectric film of wet processes. A method for manufacturing a dielectric element comprises a process of heating a film of a solution of a precursor on a metal layer in an oxidizing atmosphere, to form a calcined film comprising a dielectric material generated from the precursor, and a process of annealing the calcined film to form a dielectric film comprising the dielectric material that has been crystallized. The dielectric material is a metal oxide which forms a perovskite-structure crystal having A sites and B sites. The solution of the precursor comprises an element occupying A sites and an element occupying B sites in the dielectric film, at a molar ratio of the element occupying A sites to the element occupying B sites of 0.85 or higher and 1.00 or lower. The annealing temperature of the solution film is 400 to 480° C.
    • 本发明提供了一种电介质元件的制造方法,其中通过化学溶液沉积法形成电介质膜,其具有增强的湿法电介质膜的耐受性。 制造电介质元件的方法包括在氧化气氛中在金属层上加热前体溶液的膜以形成包含由前体产生的介电材料的煅烧膜的方法,以及将煅烧过的 以形成包括已经结晶的电介质材料的电介质膜。 介电材料是形成具有A位点和B位点的钙钛矿型结构的金属氧化物。 前体溶液包含占据A位置的元素和占据电介质膜中B位的元素,占据A位置的元素与占据B位点的元素的摩尔比为0.85以上且1.00以下。 溶液膜的退火温度为400〜480℃。
    • 5. 发明申请
    • THIN-FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD
    • 薄膜电容器和电子电路板
    • US20100265632A1
    • 2010-10-21
    • US12756520
    • 2010-04-08
    • Hitoshi SAITANaoto TSUKAMOTOAkira SHIBUEKenji HORINO
    • Hitoshi SAITANaoto TSUKAMOTOAkira SHIBUEKenji HORINO
    • H01G4/10
    • H01G4/33C04B35/4682C04B2235/3224C04B2235/3239C04B2235/3251C04B2235/3262C04B2235/441C04B2235/764C04B2235/79H01G4/1227H01L27/016H01L28/40H05K1/185
    • The present invention provides a thin-film capacitor having an insulation resistance value higher than that conventionally available and high reliability. The thin-film capacitor of the present invention comprises a dielectric thin film and electrodes opposing each other through the dielectric thin film interposed therebetween; wherein the dielectric thin film contains a perovskite-type composite oxide having a composition expressed by the following chemical formula (1), Mn, and at least one kind of element M selected from the group consisting of V, Nb, and Ta; wherein the dielectric thin film has an Mn content of 0.05 to 0.45 mol with respect to 100 mol of the composite oxide; and wherein the dielectric thin film has a total element M content of 0.05 to 0.5 mol with respect to 100 mol of the composite oxide: AyBO3  (1) where A is at least one kind of element selected from the group consisting of Ba, Sr, Ca, and Pb, B is at least one kind of element selected from the group consisting of Ti, Zr, Hf, and Sn, and 0.97≦y≦0.995.
    • 本发明提供一种绝缘电阻值高于现有技术和高可靠性的薄膜电容器。 本发明的薄膜电容器包括介电薄膜和介于其间的电介质薄膜彼此相对的电极; 其特征在于,所述电介质薄膜含有由以下化学式(1)表示的组成为Mn的钙钛矿型复合氧化物和选自V,Nb,Ta中的至少一种元素M; 其中所述电介质薄膜相对于所述复合氧化物100摩尔的Mn含量为0.05〜0.45摩尔; 并且其中所述电介质薄膜相对于100摩尔所述复合氧化物的总元素M含量为0.05至0.5摩尔:AyBO 3(1)其中A是选自Ba,Sr, Ca和Pb,B是选自Ti,Zr,Hf和Sn中的至少一种元素,以及0.97和nlE; y≦̸ 0.995。