会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Polishing slurries and a process for the production thereof
    • 抛光浆料及其生产工艺
    • US5904159A
    • 1999-05-18
    • US751769
    • 1996-11-08
    • Hiroshi KatoKazuhiko HayashiHiroyuki Kohno
    • Hiroshi KatoKazuhiko HayashiHiroyuki Kohno
    • C09G1/02B08B7/00
    • C09G1/02
    • A polishing slurry is formed of a silica-dispersed solution obtained by dispersing, in an aqueous solvent, a fumed silica having an average primary particle size of from 5 to 30 nm, the silica-dispersed solution exhibiting a light scattering index (n) of from 3 to 6 at a silica concentration of 1.5% by weight, and the fumed silica dispersed therein having an average secondary particle size of from 30 to 100 nm on the weight basis. The polishing slurry is produced by pulverizing, using a high-pressure homogenizer, a silica-dispersed solution obtained by dispersing a fumed silica in an aqueous solvent, so that the fumed silica possesses an average secondary particle size of from 30 to 100 nm on the weight basis. The polishing slurry is used for polishing semiconductor wafers and inter-layer dielectric in an IC process.
    • 抛光浆料由二氧化硅分散溶液形成,其通过在水性溶剂中分散平均一次粒径为5〜30nm的热解法二氧化硅,显示出光散射指数(n)的二氧化硅分散溶液 3〜6,二氧化硅浓度为1.5重量%,分散在其中的热解法二氧化硅的重均分子量为30〜100nm。 抛光浆料通过使用高压均化器将通过将热解法二氧化硅分散在水性溶剂中获得的二氧化硅分散溶液进行粉碎来制备,使得煅制二氧化硅的平均二次粒径为30〜100nm, 重量基础。 抛光浆料用于在IC工艺中研磨半导体晶片和层间电介质。
    • 7. 发明授权
    • Substrate holding and rotating device, substrate treatment apparatus including the device, and substrate treatment method
    • 基板保持和旋转装置,包括该装置的基板处理装置和基板处理方法
    • US09385020B2
    • 2016-07-05
    • US13596848
    • 2012-08-28
    • Hiroshi Kato
    • Hiroshi Kato
    • H01L21/67H01L21/687
    • H01L21/68728H01L21/68792
    • A substrate holding and rotating device includes: a turntable rotatable; a rotative drive unit which rotates the turntable; a holding member which is provided on the turntable and horizontally holds a substrate in upwardly spaced relation to the turntable; a vertically movable protection disk disposed between the turntable and a substrate holding position; and a magnetic levitation mechanism including a first magnet attached to the protection disk, an annular second magnet which generates a repulsive force with respect to the first magnet, a support member which non-rotatably supports the second magnet, and a relative movement mechanism which moves the support member and the turntable relative to each other.
    • 基板保持旋转装置包括:转盘, 旋转驱动单元,其使转盘旋转; 保持构件,其设置在转台上并水平地保持与转台成向上间隔开的基板; 设置在所述转盘和基板保持位置之间的可垂直移动的保护盘; 以及磁悬浮机构,其包括附接到保护盘的第一磁体,相对于第一磁体产生排斥力的环形第二磁体,不可旋转地支撑第二磁体的支撑部件,以及相对移动机构,其移动 支撑构件和转台相对于彼此。
    • 8. 发明授权
    • Projection type display apparatus and method of cooling light source
    • 投影式显示装置及冷却光源的方法
    • US09223193B2
    • 2015-12-29
    • US13813404
    • 2010-08-02
    • Hiroshi Kato
    • Hiroshi Kato
    • G03B21/16G03B21/20
    • G03B21/16G03B21/2033
    • There is provided a projection-type display apparatus which solves the problem that when an amount of electric power applied to light sources is adjusted, the amount of electric power involved in the cooling of LEDs becomes greater than necessary. Coolers (107R, 107G, 107B) cool light sources (103R, 103G, 103B). Light sensor (111) detects the brightness of a surrounding area. Light case temperature detectors (112R, 112G, 112B) detect case temperatures which are the temperatures of cases of light sources (103R, 103G, 103B). Light source forward voltage detectors (113R, 113G, 113B) detect forward voltages of light sources (103R, 103G, 103B). Light source forward current detectors (114R, 114G, 114B) detect forward currents of light sources (103R, 103G, 103B). Adjuster (117) adjusts the amount of cooling power of coolers (107R, 107G, 107B) based on the forward voltage, the forward current, and the case temperatures.
    • 提供一种投影型显示装置,其解决了当调整施加到光源的电力的量时,LED的冷却所涉及的电力的量变得大于必要的问题。 冷却器(107R,107G,107B)冷却光源(103R,103G,103B)。 光传感器(111)检测周围区域的亮度。 光箱温度检测器(112R,112G,112B)检测作为光源(103R,103G,103B)的情况的温度的外壳温度。 光源正向电压检测器(113R,113G,113B)检测光源(103R,103G,103B)的正向电压。 光源正向电流检测器(114R,114G,114B)检测光源(103R,103G,103B)的正向电流。 调节器(117)根据正向电压,正向电流和外壳温度调节冷却器(107R,107G,107B)的冷却功率。