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    • 7. 发明申请
    • HEATING AND COOLING MODULE
    • 加热和冷却模块
    • US20070215602A1
    • 2007-09-20
    • US11684895
    • 2007-03-12
    • Masuhiro NatsuharaTomoyuki AwazuHirohiko NakataAkira Mikumo
    • Masuhiro NatsuharaTomoyuki AwazuHirohiko NakataAkira Mikumo
    • H05B3/10
    • H05B3/143H01L21/67103H01L21/67109
    • A heating and cooling module wherein the calorific value can be increased in a heater for mounting and heating a semiconductor chip, and the heating and cooling module is not damaged when the semiconductor chip is rapidly heated and cooled. The heating and cooling module of the includes a ceramic heater for mounting and heating a treated object, a cooling mechanism for cooling the ceramic heater, and a holder between the ceramic heater and the cooling mechanism, wherein the ceramic heater is an aluminum nitride heater having one or more internally disposed heating element layers. An intermediate layer is preferably inserted between the ceramic heater and the holder. An intermediate layer is also preferably inserted between the holder and the cooling mechanism.
    • 一种加热和冷却模块,其中在用于安装和加热半导体芯片的加热器中可以增加热值,并且当半导体芯片被快速加热和冷却时,加热和冷却模块不被损坏。 其加热和冷却模块包括用于安装和加热被处理物体的陶瓷加热器,用于冷却陶瓷加热器的冷却机构和陶瓷加热器与冷却机构之间的保持器,其中陶瓷加热器是具有 一个或多个内部设置的加热元件层。 中间层优选插入陶瓷加热器和保持器之间。 中间层也优选地插入保持器和冷却机构之间。