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1. 发明授权

US08035214B1 Conductive connecting pin for package substance 有权
标题翻译：封装基板导电连接针
公开(公告)号：US08035214B1
公开(公告)日：2011-10-11
申请号：US09830949
申请日：1999-11-17
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译：一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

2. 发明申请

US20100032200A1 CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE 有权
标题翻译：导电连接引脚和封装基板
公开(公告)号：US20100032200A1
公开(公告)日：2010-02-11
申请号：US12581205
申请日：2009-10-19
申请人： Naohiro HIROSE , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro HIROSE , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H05K1/11
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译：一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与主板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的焊盘16，用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口局部暴露于外部。导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

3. 发明授权

US08110917B2 Package substrate with a conductive connecting pin 有权
标题翻译：封装衬底，带导电连接引脚
公开(公告)号：US08110917B2
公开(公告)日：2012-02-07
申请号：US12581205
申请日：2009-10-19
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译：一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与主板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的焊盘16，用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口局部暴露于外部。导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

4. 发明授权

US07902659B2 Conductive connecting pin and package substrate 有权
标题翻译：导电连接销和封装基板
公开(公告)号：US07902659B2
公开(公告)日：2011-03-08
申请号：US12359663
申请日：2009-01-26
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译：一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

5. 发明授权

US08536696B2 Conductive pin attached to package substrate 有权
标题翻译：导电针连接到封装衬底
公开(公告)号：US08536696B2
公开(公告)日：2013-09-17
申请号：US12546950
申请日：2009-08-25
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/12 , H01L21/00 , H05K7/00
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.
摘要翻译：包括最外层间树脂绝缘层，形成在最外层间树脂绝缘层上的焊盘结构的封装基板，用于与另一基板建立电连接的导电连接引脚，所述导电连接引脚通过焊料固定在焊盘结构上，以及通过最外层间树脂绝缘层形成的通孔，并且将焊盘结构电连接到在最外层间树脂绝缘层下形成的一个或多个导电电路，通孔位于焊盘结构的正下方。

6. 发明授权

US07847393B2 Conductive connecting pins for a package substrate 有权
标题翻译：用于封装基板的导电连接引脚
公开(公告)号：US07847393B2
公开(公告)日：2010-12-07
申请号：US12257501
申请日：2008-10-24
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.
摘要翻译：一种包含衬底的封装衬底310，该衬底设置有导体层5，导电连接销100被布置成与母板建立电连接并固定到衬底的表面，其中提供用于固定导电连接销的衬垫16 用于封装衬底310.衬垫16被具有开口18的有机树脂绝缘层15覆盖，衬垫16通过该开口部分地暴露于外部。导电连接销100通过导电粘合剂17通过开口固定到暴露于外部的焊盘，从而防止例如当执行安装时发生例如导电连接销100从基板的溶液。

7. 发明申请

US20090053459A1 CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE 有权
公开(公告)号：US20090053459A1
公开(公告)日：2009-02-26
申请号：US12257501
申请日：2008-10-24
申请人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
发明人： Naohiro Hirose , Hitoshi Ito , Yoshiyuki Iwata , Masanori Kawade , Hajime Yazu
IPC分类号： B32B1/04
CPC分类号： H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
摘要： A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented.

8. 发明授权

US09420697B2 Method for manufacturing printed wiring board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US09420697B2
公开(公告)日：2016-08-16
申请号：US13536056
申请日：2012-06-28
申请人： Yoshiyuki Iwata , Masaru Hori , Hajime Sakamoto
发明人： Yoshiyuki Iwata , Masaru Hori , Hajime Sakamoto
IPC分类号： H05K3/02 , H05K3/00 , H05K3/42
CPC分类号： H05K3/027 , H05K3/0035 , H05K3/0055 , H05K3/421 , H05K2203/095
摘要： A method for manufacturing a printed wiring board includes forming an interlayer insulation layer on a conductive circuit, applying laser to a portion of the interlayer insulation layer such that an opening reaching to the conductive circuit is formed for a via conductor, subjecting the opening to a plasma treatment using a processing gas which includes a reactive gas including a fluorovinyl ether gas having a double bond of two carbon atoms and a fluoroalkyl ether group, forming an upper conductive circuit on the interlayer insulation layer, and forming a via conductor in the opening such that the via conductor connects the conductive circuit and the upper conductive circuit.
摘要翻译：一种制造印刷电路板的方法，包括在导电电路上形成层间绝缘层，向层间绝缘层的一部分施加激光，使通孔导体形成达到导电电路的开口，使开口处于使用包括包含具有两个碳原子的双键的氟乙烯基醚气体和氟烷基醚基团的反应性气体的处理气体进行等离子体处理，在层间绝缘层上形成上导电电路，以及在开口中形成通孔导体通孔导体连接导电电路和上导电电路。

9. 发明申请

US20130194686A1 SAFETY CONFIRMATION MIRROR 有权
标题翻译：安全确认镜
公开(公告)号：US20130194686A1
公开(公告)日：2013-08-01
申请号：US13877723
申请日：2011-10-13
申请人： Sakae Komiyama , Hiroshi Nishiyama , Katsumi Machida , Hisanaga Takeda , Yoshiyuki Iwata
发明人： Sakae Komiyama , Hiroshi Nishiyama , Katsumi Machida , Hisanaga Takeda , Yoshiyuki Iwata
IPC分类号： G02B5/09
CPC分类号： G02B5/09 , G02B5/1861 , G02B5/1876
摘要： Provided is a safety confirmation mirror whereby a blind spot near a corner of a passageway can be easily seen more clearly. The safety confirmation mirror includes, as a reflective surface (2), a portion of a Fresnel mirror (3) offset to one side of the widthwise center (C1). Accordingly, when the safety confirmation mirror is installed on a wall surface of a passageway at a T-shaped, L-shaped, or cross intersection, the reflective surface 2 reflects the blind spot of a passageway in one direction that a person is going to turn, and the person can see the conditions thereof. Moreover, the reflective surface 2 does not reflect the conditions in the unnecessary direction. Accordingly, the person looking at the safety confirmation mirror (1) is not confused by the unnecessary image and can easily see the blind spot near the corner of the passageway more clearly.
摘要翻译：提供了一种安全确认镜，其中可以更清楚地看到通道拐角附近的盲点。安全确认镜包括作为反射面（2）的偏转到宽度方向中心（C1）一侧的菲涅耳镜（3）的一部分。因此，当将安全确认镜安装在T字形，L字形或十字交叉路口的通道的墙壁表面上时，反射表面2以一个人的方向反射通道的盲点转身，人可以看到其条件。此外，反射面2不反映不必要方向的状态。因此，看着安全确认镜（1）的人不会被不需要的图像所困惑，并且可以更清楚地看到通道角附近的盲点。

10. 发明授权

US08197659B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US08197659B2
公开(公告)日：2012-06-12
申请号：US13240626
申请日：2011-09-22
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/06 , C25D5/08 , C25D5/22 , H05K3/02 , H05K3/06 , H05K3/42
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.
摘要翻译：一种多层印刷电路板的制造方法，其特征在于，具有提供具有贯通孔的芯基板，在所述基板的表面上形成无电镀膜和所述贯通孔的内壁面，对所述基板进行电解电镀，同时相对于在所述基板的表面上与所述基板的表面接触的绝缘构件，使得在所述无电镀膜上形成电解电镀膜，所述贯通孔内的开口空间填充有电解材料，在导电孔中形成空穴导体结构，在电解镀膜上形成具有开口图案的抗蚀剂，并且除去由开口图案露出的电解电镀膜的露出图案，以及将化学镀膜的图案使得在基板的表面上形成导体电路。

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