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    • 7. 发明申请
    • MANUFACTURING METHOD AND INTEGRATED CIRCUIT HAVING A LIGHT PATH TO A PIXILATED ELEMENT
    • 制造方法和集成电路有一个光线路到一个被粉碎的元素
    • WO2009113004A2
    • 2009-09-17
    • PCT/IB2009050964
    • 2009-03-09
    • NXP BVNGUYEN HOANG VIETSURDEANU RADUBATAILLOU BENOIT
    • NGUYEN HOANG VIETSURDEANU RADUBATAILLOU BENOIT
    • H01L27/146
    • H01L27/14625H01L27/14621H01L27/14636H01L27/14685
    • The present invention relates to a manufacturing method of an integrated circuit (IC) comprising a substrate (10) comprising a pixilated element (12) and a light path (38) to the pixilated element (12). The IC comprises a first dielectric layer (14) covering the substrate (10) but not the pixilated element (12), a first metal layer (16) covering a part of the first dielectric layer (14), a second dielectric layer (18) covering a further part of first dielectric layer (14), a second metal layer (20) covering a part of the second dielectric layer (18) and extending over the pixilated element (12) and a part of the first metal layer (16), the first metal layer (16) and the second metal layer (20) forming an air-filled light path (38) to the pixilated element (12). The air-filled light path (38) is formed by creation of holes in the first dielectric layer (14) and the second dielectric layer (18), filling the holes with sacrificial materials, and removal of the sacrificial materials after deposition and patterning of the second metal layer (20). This yields an IC having a low-loss light path to the pixilated element (12). The light path may act as a color filter, e.g. a Fabry-Perot color filter.
    • 本发明涉及一种集成电路(IC)的制造方法,所述集成电路(IC)包括基板(10),所述基板(10)包括像素化元件(12)和到所述像素化元件(12)的光路(38)。 所述IC包括覆盖所述衬底(10)而不是所述像素化元件(12)的第一介电层(14),覆盖所述第一介电层(14)的一部分的第一金属层(16),第二介电层(18) )覆盖第一电介质层(14)的另一部分,覆盖第二电介质层(18)的一部分并在像素化元件(12)上方延伸的第二金属层(20)和第一金属层(16)的一部分 ),所述第一金属层(16)和所述第二金属层(20)形成到所述像素化元件(12)的空气填充光路(38)。 充气光路(38)通过在第一电介质层(14)和第二电介质层(18)中产生孔而形成,用牺牲材料填充孔,并且在沉积和图案化之后去除牺牲材料 第二金属层(20)。 这产生具有到像素化元件(12)的低损耗光路的IC。 光路可以用作滤色器,例如, 法布里 - 珀罗滤镜。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 半导体器件和制造半导体器件的方法
    • WO2008007259A3
    • 2008-06-12
    • PCT/IB2007052291
    • 2007-06-15
    • NXP BVNGUYEN HOANG VIET
    • NGUYEN HOANG VIET
    • H01L23/528
    • H01L23/5283H01L2924/0002H01L2924/09701H01L2924/00
    • The invention relates to a semiconductor device comprising a substrate (1) and at least one interconnect layer located at a surface of the substrate (1), the interconnect layer comprising a first wire (20") and a second wire (20') which are located in the interconnect layer, the first wire (20") having a first thickness (T1) and the second wire (20') having a second thickness (T2) that is different from the first thickness, the thickness (T1,T2) being defined in a direction perpendicular to said surface. The invention further relates to a method of manufacturing a semiconductor device comprising a substrate (1) and an interconnect layer located at a surface of the substrate (1), the interconnect layer comprising a first wire (20") and a second wire (20') which are located in the interconnect layer.
    • 本发明涉及包括衬底(1)和位于衬底(1)的表面处的至少一个互连层的半导体器件,所述互连层包括第一导线(20“)和第二导线(20'),所述第一导线 位于互连层中,具有第一厚度(T1)的第一导线(20“)和具有不同于第一厚度的第二厚度(T2)的第二导线(20'),厚度(T1,T2 )被定义在垂直于所述表面的方向上。 本发明还涉及一种制造半导体器件的方法,所述半导体器件包括衬底(1)和位于所述衬底(1)的表面处的互连层,所述互连层包括第一导线(20“)和第二导线(20 '),它们位于互连层中。