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    • 2. 发明申请
    • METHOD AND SYSTEM FOR OVERLAY MEASUREMENT
    • 用于覆盖测量的方法和系统
    • WO03075099A2
    • 2003-09-12
    • PCT/IL0300176
    • 2003-03-06
    • NOVA MEASURING INSTR LTDFINAROV MOSHESCHEINER DAVID
    • FINAROV MOSHESCHEINER DAVID
    • G01B11/00G03F7/20G03F9/00H01L21/027
    • G03F7/70633
    • An optical measurement method and system are presented for imaging two target structures T1, T2 in two parallel layers L1, L2, respectively, of a sample W, to enable determination of a registration between the two target structures along two mutually perpendicular axes of the layer L1. The sample is illuminated with incident radiation to produce a radiation response of the sample. The radiation response is collected by an objective lens arrangement 14, and the collected radiation response is split into two spatially separated radiation components B1res, B2res. The split radiation components are directed towards at least one imaging plane 24 or 26 along different optical channels characterized by optical paths of different lengths S1, S2, respectively. The two split radiation components are detected in said at least one imaging plane, and two image parts are thereby acquired, each image part containing images of the two target structures.
    • 提出了一种光学测量方法和系统,用于分别对样本W的两个平行层L1,L2中的两个目标结构T1,T2进行成像,以便能够沿着层的两个相互垂直的轴确定两个目标结构之间的配准 L1。 用入射辐射照射样品以产生样品的辐射响应。 辐射响应由物镜装置14收集,并且收集的辐射响应被分成两个空间上分离的辐射分量B1res,B2res。 分离的辐射分量被引导到沿着不同的光通道的至少一个成像平面24或26,其特征在于分别具有不同长度S1,S2的光路。 在所述至少一个成像平面中检测到两个分离的辐射分量,从而获得两个图像部分,每个图像部分包含两个目标结构的图像。
    • 3. 发明申请
    • METHOD AND SYSTEM FOR OVERLAY MEASUREMENT
    • 用于覆盖测量的方法和系统
    • WO03075099A8
    • 2005-02-17
    • PCT/IL0300176
    • 2003-03-06
    • NOVA MEASURING INSTR LTDFINAROV MOSHESCHEINER DAVID
    • FINAROV MOSHESCHEINER DAVID
    • G01B11/00G03F7/20G03F9/00H01L21/027
    • G03F7/70633
    • An optical measurement method and system are presented for imaging two target structures (T1, T2) in two parallel layers (L1, L2), respectively, of a sample (W), to enable determination of a registration between the two target structures along two mutually perpendicular axes of the layer (L1). The sample is illuminated with incident radiation to produce a radiation response of the sample. The radiation response is collected by an objective lens arrangement (14), and the collected radiation response is split into two spatially separated radiation components (B(1)res, B(2)res). The split radiation components are directed towards at least one imaging plane (24 or 26) along different optical channels characterized by optical paths of different lengths (S1, S2), respectively. The two split radiation components are detected in said at least one imaging plane, and two image parts are thereby acquired, each image part containing images of the two target structures.
    • 提出了一种光学测量方法和系统,用于分别对样本(W)的两个并联层(L1,L2)成像两个目标结构(T1,T2),以便确定两个目标结构之间的对准 层(L1)的相互垂直的轴。 用入射辐射照射样品以产生样品的辐射响应。 辐射响应由物镜装置(14)收集,所收集的辐射响应被分成两个空间上分离的辐射分量(B(1)res,B(2)res)。 沿着沿着不同长度的光路(S1,S2)分别表征的不同的光通道,分开的辐射分量指向至少一个成像平面(24或26)。 在所述至少一个成像平面中检测到两个分离的辐射分量,从而获得两个图像部分,每个图像部分包含两个目标结构的图像。
    • 4. 发明申请
    • OPTICAL SYSTEM AND METHOD FOR MEASUREMENT OF ONE OR MORE PARAMETERS OF VIA-HOLES
    • 用于测量一个或多个通道参数的光学系统和方法
    • WO2009074984A3
    • 2010-03-11
    • PCT/IL2008001599
    • 2008-12-10
    • NOVA MEASURING INSTR LTDSCHEINER DAVID
    • SCHEINER DAVID
    • G01B5/02
    • G01B11/00G01B11/02G01B11/08G01B11/12G01B11/22G01B11/24G01B2210/56G01R31/2853G01R31/311G06T7/0004G06T2207/30148H01L22/12H01L2924/0002H01L2924/00
    • The present invention provides a novel system and method for obtaining at least one of a cross-section profile, depth, width, slope, undercut and other parameters of via-holes by non-destructive technique. The optical system comprises an illumination system for producing at least one light beam and directing it on a sample in a region of the structure containing at least one via-hole; a detection system configured and operable to collect a pattern of light reflected from the illuminated region, the light pattern being indicative of one or more parameters of said via-hole; and, a control system connected to the detection system, the control system comprising a memory utility for storing a predetermined theoretical model comprising data representative of a set of parameters describing via-holes reflected pattern, and a data processing and analyzing utility configured and operable to receive and analyze image data indicative of the detected light pattern and determine one or more parameters of said via-hole.
    • 本发明提供了一种用于通过非破坏性技术获得通孔的横截面轮廓,深度,宽度,斜率,底切和其它参数中的至少一个的新颖系统和方法。 光学系统包括用于产生至少一个光束并将其引导到包含至少一个通孔的结构的区域中的样品的照明系统; 检测系统,被配置和可操作以收集从所述被照射区域反射的光的图案,所述光图案指示所述通孔的一个或多个参数; 以及连接到所述检测系统的控制系统,所述控制系统包括用于存储预定理论模型的存储器实用程序,所述预定理论模型包括表示描述通孔反射模式的一组参数的数据,以及数据处理和分析实用程序, 接收和分析指示检测到的光图案的图像数据,并确定所述通孔的一个或多个参数。
    • 10. 发明申请
    • METHOD AND SYSTEM FOR MEASURING THE TOPOGRAPHY OF A SAMPLE
    • 测量样品地形的方法和系统
    • WO03014659A2
    • 2003-02-20
    • PCT/IL0200657
    • 2002-08-08
    • NOVA MEASURING INSTR LTDSCHEINER DAVID
    • SCHEINER DAVID
    • G01B11/25G01B11/00
    • G01B11/254
    • An imaging method and system are presented for detecting the topography of a sample's surface. Illuminating light is directed to the sample (S) by sequentially passing the illuminating light through a grating (20) and an objective lens arrangement (18). The grating (20) has a pattern formed by spaced-apart transparent regions (Rtr) spaced by non-transparent regions (Rop), and is specifically oriented with respect to the optical axis (OA) of the objective lens arrangement (18). Light, specularly reflected from the sample, is collected by the same objective lens arrangement (18) and is directed to an imaging detector (14) through the same grating (20), thereby enabling creation of an image of the illuminated sample (S) indicative of the topography of the sample's surface.
    • 提出了用于检测样品表面的形貌的成像方法和系统。 通过依次使照射光通过光栅(20)和物镜装置(18),照明光被引导至样品(S)。 光栅(20)具有由间隔开的透明区域(Rtr)形成的图案,间隔开的透明区域由非透明区域(Rop)隔开,并且相对于物镜装置(18)的光轴(OA)具体定向。 从样品镜面反射的光被相同的物镜配置(18)收集并且通过相同的光栅(20)被引导到成像检测器(14),从而能够产生被照明样品(S)的图像, 指示样品表面的形貌。