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1. 发明专利

JP2008166651A Adhesive sheet for working semiconductor substrate 有权
标题翻译：用于工作半导体基板的粘合片
公开(公告)号：JP2008166651A
公开(公告)日：2008-07-17
申请号：JP2007000359
申请日：2007-01-05
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： YAMAMOTO AKIYOSHI , SHINTANI TOSHIAKI , ASAI FUMITERU , HASHIMOTO KOICHI
IPC分类号： H01L21/683 , C09J4/02 , C09J4/06 , C09J7/02 , C09J201/00 , H01L21/301
CPC分类号： H01L21/6836 , C08G18/672 , C08L61/00 , C08L2666/16 , C09D175/16 , C09J7/385 , C09J133/02 , C09J2201/622 , C09J2203/326 , C09J2205/31 , H01L2221/68327 , Y10T428/28 , Y10T428/2809 , Y10T428/2852 , Y10T428/2883 , Y10T428/2891
摘要： PROBLEM TO BE SOLVED: To provide a stable adhesive sheet for showing the deteriorating property of stable adhesive force, and for almost completely preventing a paste residue on the surface of resin after emitting ultraviolet rays and/or radiation regardless of the resin composition of a semiconductor device or the like, the type of additive, the type of release and their quantities. SOLUTION: This adhesive sheet for working a semiconductor substrate is provided with a base material having transparency to ultraviolet rays and/or radiation and an adhesive layer which makes a superimpose hardening reaction by the ultraviolet rays and/or radiation, and the adhesive layer is formed by using multiacrylate system oligomer and/or monomer having double coupling, and the multiacrylate system oligomer and/or monomer blending is carried out so that a total average molecular weight calculated from the weight average molecular weight of the multiacrylate system oligomer and/or monomer blending can contain double coupling per 225 to 8,000. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供稳定的粘合力的劣化性能的稳定的粘合片，并且无论树脂组合物如何，几乎完全防止在发射紫外线和/或辐射之后树脂表面上的糊料残留物半导体器件等，添加剂的类型，释放类型及其数量。解决方案：用于加工半导体衬底的粘合片设置有对紫外线和/或辐射具有透明性的基材和通过紫外线和/或辐射进行叠加硬化反应的粘合剂层，并且粘合剂通过使用具有双重偶合的多丙烯酸酯系低聚物和/或单体形成层，并且进行多丙烯酸酯体系低聚物和/或单体共混，使得由多丙烯酸酯系低聚物的重均分子量计算的总平均分子量和/ 或单体共混可以包含225至8,000的双偶合。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008163276A Pressure-sensitive adhesive sheet for use in processing semiconductor substrate 审中-公开
标题翻译：用于加工半导体基板的压敏粘合片
公开(公告)号：JP2008163276A
公开(公告)日：2008-07-17
申请号：JP2007000362
申请日：2007-01-05
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHINTANI TOSHIAKI , YAMAMOTO AKIYOSHI , ASAI FUMITERU , HASHIMOTO KOICHI
IPC分类号： C09J7/02 , C09J4/00 , C09J133/06 , C09J163/00 , C09J175/04 , H01L21/301
CPC分类号： C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/31 , C09J2433/00 , H01L21/568 , H01L21/6835 , H01L2221/68381 , H01L2924/0002 , Y10T428/265 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a stable pressure-sensitive adhesive sheet which can almost perfectly prevent laser printing from disappearing and can almost perfectly prevent adhesive deposit at the time of cutting the substrate from occurring. SOLUTION: This pressure-sensitive adhesive sheet for processing semiconductor substrate is equipped with a substrate having transmissivity to a UV-ray and/or a radiation and a pressure-sensitive adhesive layer which reacts to be polymerized and cured with the UV-ray and/or the radiation, where the thickness of the pressure-sensitive adhesive layer is 7-15 μm. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供几乎完全防止激光打印消失的稳定的压敏粘合片，并且几乎可以完全防止在切割基材时发生粘合剂沉积。解决方案：用于处理半导体衬底的压敏粘合片具有对紫外线和/或辐射具有透射性的基底和压敏粘合剂层，其与UV- 射线和/或辐射，其中压敏粘合剂层的厚度为7-15μm。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008103516A Adhesive sheet for processing semiconductor wafer and/or substrate 有权
标题翻译：用于加工半导体晶片和/或基板的粘合片
公开(公告)号：JP2008103516A
公开(公告)日：2008-05-01
申请号：JP2006284493
申请日：2006-10-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHINTANI TOSHIAKI , YAMAMOTO AKIYOSHI , ASAI FUMITERU , HASHIMOTO KOICHI
IPC分类号： H01L21/683 , B32B7/10 , C09J7/02 , C09J11/00 , C09J133/04 , C09J201/00 , H01L21/301
CPC分类号： C09J11/06 , C09J7/38 , C09J11/08 , C09J2203/326 , C09J2205/102 , C09J2205/31 , C09J2433/00 , H01L21/67005 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , Y10T428/31855
摘要： PROBLEM TO BE SOLVED: To provide a stable adhesive sheet which provides a sufficient adhesive force by sufficiently following the unevenness of a pasting face of the surface of a semiconductor wafer being an adhering body and/or a substrate, etc. regardless of the unevenness of the surface, while reducing its adhesiveness to the optimum value for pick-up, etc. after being irradiated with ultraviolet rays and/or radiation rays, and hence prevents the adhesive from staying behind in the adhered body. SOLUTION: The adhesive sheet for processing a semiconductor wafer and/or a substrate comprises a base material which permits ultraviolet rays and/or radiation to pass through it, and an adhesive layer which is polymerized and cured by ultraviolet rays and/or radiation. The adhesive layer contains at least a tackifier and a surfactant. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种稳定的粘合片，其通过充分地跟随作为粘合体和/或基底等的半导体晶片的表面的粘贴面的不均匀性而提供足够的粘合力，而不管表面的不均匀性，同时在用紫外线和/或辐射线照射之后降低其对于拾取的最佳值的粘附性，因此防止粘合剂滞留在粘附体中。解决方案：用于处理半导体晶片和/或基板的粘合片包括允许紫外线和/或辐射穿过的基材，以及通过紫外线和/或其它方法聚合和固化的粘合剂层辐射。粘合层至少含有增粘剂和表面活性剂。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2005243818A Dust removal member of substrate processor 有权
标题翻译：基板处理器的除尘构件
公开(公告)号：JP2005243818A
公开(公告)日：2005-09-08
申请号：JP2004050028
申请日：2004-02-25
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HASHIMOTO KOICHI , OTA YOSHIO
IPC分类号： B08B1/02 , B05D1/00 , B08B7/00 , B32B9/04 , H01L21/02 , H01L21/304 , H01L21/677 , H01L21/68 , H05K3/26
CPC分类号： B08B7/0028 , H05K3/26 , Y10T428/31504
摘要： PROBLEM TO BE SOLVED: To provide the dust removal member of a substrate processor which can securely be conveyed into the inner part of the substrate processor and can easily and securely remove deposited contamination, and to provide a dust removal method of the substrate processor using the member. SOLUTION: The dust removal member of the substrate processor has a dust removal layer where time required to attenuate free induction attenuation signal strength measured by a pulse NMR-Solid Echo method to 37% of an initial value at a measuring temperature 100°C is not more than 1,000μ second. In a conveyance member with dust removal function, especially, a dust removal sheet has the dust removal layer with the structure on a support body, and the dust removal sheet with the structure is stuck onto the conveyance member. The dust removal method of the substrate processor conveys the conveyance member with dust removal function with the structure into the substrate processor. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够可靠地输送到基板处理器的内部的基板处理器的除尘构件，并且可以容易且可靠地去除沉积的污染物，并且提供基板的除尘方法处理器使用该成员。解决方案：基板处理器的除尘构件具有除尘层，其中需要时间来将通过脉冲NMR固体回波法测量的自由感应衰减信号强度衰减到测量温度100°的初始值的37％ C不超过1000μ秒。在具有除尘功能的搬送构件中，特别地，除尘片具有在支撑体上具有结构的除尘层，并且将具有结构的除尘片粘贴到输送构件上。基板处理器的除尘方法将具有结构的除尘功能的输送部件输送到基板处理器。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004022784A Adhesive sheet for processing wafer 审中-公开
公开(公告)号：JP2004022784A
公开(公告)日：2004-01-22
申请号：JP2002175414
申请日：2002-06-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HASHIMOTO KOICHI , MATSUMURA TAKESHI , NAKATSUKA YASUO
IPC分类号： C09J7/02 , C09J201/00 , H01L21/301 , H01L21/304 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a wafer, which transfers contaminants less to the wafer. SOLUTION: An adhesive layer is provided on either or both sides of a base film to form the adhesive sheet used for processing the wafer. The adhesive sheet is pasted on the silicon wafer, the adhesive sheet holding the silicon wafer is made to stand for 60 minutes at a temperature of 60°C, and then, when the adhesive sheet is separated from the silicon wafer at a peel angle of 180° at a peel rate of 300 mm/min, an increased volume of organic contaminants on the surface of the wafer is 40,000 pg/cm 2 or below in terms of n-hexadecane. COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2000355678A RE-RELEASING TYPE PRESSURE-SENSITIVE ADHESIVE AND RE- RELEASING TYPE PRESSURE-SENSITIVE ADHESIVE SHEET 失效
公开(公告)号：JP2000355678A
公开(公告)日：2000-12-26
申请号：JP16755399
申请日：1999-06-14
申请人： NITTO DENKO CORP
发明人： HASHIMOTO KOICHI , FUKUOKA TAKAHIRO , AKAZAWA MITSUHARU , NAKAGAWA YOSHIO , KUBOZONO TATSUYA
IPC分类号： H01L21/304 , C09J4/00 , C09J7/02 , C09J9/00
摘要： PROBLEM TO BE SOLVED: To obtain re-releasing type pressure-sensitive adhesives whose adhesion is satisfactorily reduced by the curing reaction by irradiation and which can control warpage of an adhered due to the shrinkage force to be caused by the curing reaction to a low level. SOLUTION: A re-releasing type pressure-sensitive adhesive has a radiation reactive polymer having an intramolecular side chain having one carbon-carbon double bond and a chain length of 6 or more atoms as the major component and a shrinkage force to be caused by the curing reaction by irradiation with radiation of not greater than 30 MPa. This re-releasing type pressure-sensitive adhesive may contain 0.1-150 pts.wt. radiation reactive oligomer based on 100 pts.wt. radiation reactive polymer. A re-releasing type pressure-sensitive sheet can be obtained by providing a pressure-sensitive adhesive layer composed of the re-releasing type pressure-sensitive adhesive on a base film.

7. 发明专利

JPH10223615A METHOD FOR COLLECTIVELY REMOVING RESIST MATERIAL AND SIDE WALL PROTECTION FILM 失效
公开(公告)号：JPH10223615A
公开(公告)日：1998-08-21
申请号：JP2739997
申请日：1997-02-12
申请人： NITTO DENKO CORP , HITACHI LTD
发明人： TOYODA HIDESHI , NAMIKAWA AKIRA , HASHIMOTO KOICHI , SHIRAI SEIICHIRO
IPC分类号： C09J7/02 , C09J5/00 , G03F7/34 , H01L21/02 , H01L21/027 , H01L21/302 , H01L21/3065 , H01L21/3213
摘要： PROBLEM TO BE SOLVED: To simplify the semiconductor manufacturing process, etc., by removing resist materials and side wall protection films disused after dry etching by a sidewall protection process. SOLUTION: The method comprises dry etching by a sidewall protection process using a resist pattern on a semiconductor substrate 2 as a mask and the step of removing disused resist materials 3 and sidewall protection films 4 deposited on the pattern side wall 22. At this time, adhesive sheets 1 are adhered to the substrate 2, heated and pressed to wall adhere adhesives 11 up to pattern side walls 4 and the sheets 1, resist materials 3 and protection films 4 formed in a body are peeled off.

8. 发明专利

JPH10158602A PRESSURE-SENSITIVE ADHESIVE TAPE FOR REMOVING RESIST AND METHOD FOR REMOVING RESIST 失效
公开(公告)号：JPH10158602A
公开(公告)日：1998-06-16
申请号：JP31943796
申请日：1996-11-29
申请人： NITTO DENKO CORP
发明人： CHIKADA YASU , HASHIMOTO KOICHI , SEKIDO TATSUYA
IPC分类号： C09J7/02 , C09J7/04 , C09J133/00 , C09J183/04 , C09J201/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To release and remove the unnecessary resist from an article without fail by means of a pressure-sensitive adhesive tape by stably concentrating the stress of release at the interface between the resist and the article. SOLUTION: A pressure-sensitive adhesive layer 12 is formed on a supporting film 11 to form a pressure-sensitive adhesive tape 1. This tape 1 is stuck to a resist-containing article in the production process for precision electronic components such as semiconductors and liquid crystal display panels, irradiated with an actinic radiation when the tape is of the type of actinic-radiation- pardonable one to harden the layer 12 and released from the article, whereupon the resist can be firmly fixed on the layer 12 for removal from the article.

9. 发明专利

JPH09213604A METHOD FOR REMOVING RESIST FILM IMAGE 失效
公开(公告)号：JPH09213604A
公开(公告)日：1997-08-15
申请号：JP1420296
申请日：1996-01-30
申请人： NITTO DENKO CORP
发明人： OKAWA YUJI , HASHIMOTO KOICHI , CHIKADA YASU
IPC分类号： G03F7/26 , G03F7/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To easily and surely remove any unnecessary resist material by controlling the maximum temperature of a product wherein ultraviolet ray setting adhesive sheet group and a resist film image are existent to be within a specific temperature range. SOLUTION: After sticking ultraviolet ray setting adhesive sheet group on a product wherein a resist film image is existent, this adhesive sheet group is irradiated with ultraviolet ray in the irradiation amount within a specific using an ultraviolet ray irradiating lamp to set the adhesive layer. In this case, the temperature is controlled to make the maximum temperature of the product wherein the ultraviolet ray setting adhesive and the resist film image are existent to be within the range of almost 30-140 deg.C. Through these procedures, the unnecessary resist material on the product can be removed easily and surely without being affected by the decomposition, etc., of a surface layer due to ion implantation.

10. 发明专利

JPH06322338A RELEASABLE ADHESIVE AND ADHESIVE MEMBER USING THE SAME 失效
公开(公告)号：JPH06322338A
公开(公告)日：1994-11-22
申请号：JP13122493
申请日：1993-05-07
申请人： NITTO DENKO CORP
发明人： SATSUMA MICHIO , TOZAKI YUTAKA , HASHIMOTO KOICHI
IPC分类号： C08F2/30 , C08F2/24 , C08F20/10 , C08F20/18 , C09J7/02 , C09J133/00 , C09J133/04
摘要： PURPOSE:To provide a releasable type emulsion adhesive extremely not leaving stain substances by releasing without requiring an extraction treatment using a solvent, and to provide an adhesive member using the same adhesive. CONSTITUTION:The releasable adhesive comprises an emulsion and, if necessary, a cross-linking agent to form an adhesive layer having a THF-insoluble content of >= 90% and a degree of swelling of >=10 times in THF. The emulsion contains an acrylic polymer which may be a cross-linked one and is formed by gradually emulsion-copolymerizing at least an acrylic acid 4-12C alkyl ester, a nonionic surfactant having a copolymerizable unsaturated group, and a functional or cross-linkable monomer in the presence of a small amount of a water- soluble orgnaic radical polymerization initiator. An adhesive member having the layer of the adhesive on a support substrate. The adhesive gives an adhesive layer little in the content of free substances, and excellent water resistance, adherend deterioration prevention, adhesive balance between adhesiveness and releasability, etc.

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