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1. 发明申请

WO1996024177A1 INSULATOR AND HIGH-FREQUENCY CONNECTOR 审中-公开
标题翻译：绝缘子和高频连接器
公开(公告)号：WO1996024177A1
公开(公告)日：1996-08-08
申请号：PCT/JP1996000179
申请日：1996-01-31
申请人： NIPPON ZEON CO., LTD. , KONISHI, Yuichiro , TANISHO, Hajime , KOUSHIMA, Yuji , KOHARA, Teiji
发明人： NIPPON ZEON CO., LTD.
IPC分类号： H01R17/12
CPC分类号： H01R24/44 , H01B3/30 , H01B3/44 , H01B3/441 , H01B3/46 , H01R43/18 , H01R2103/00 , Y10S439/933
摘要： A high-frequency connector and insulator therefor composed of a thermoplastic norbornene resin having a voltage standing-wave ratio of 1.20 even in a high-frequency region of 2-3 GHz.
摘要翻译：一种高频连接器及其绝缘体，即使在2-3GHz的高频区域中也具有1.20的电压驻波比为1.20的热塑性降冰片烯树脂。

2. 发明申请

WO1996010611A1 SURFACE-TREATED FILLER AND COMPOSITION CONTAINING SAID FILLER 审中-公开
标题翻译：表面处理填料和含有填料的组合物
公开(公告)号：WO1996010611A1
公开(公告)日：1996-04-11
申请号：PCT/JP1995001973
申请日：1995-09-28
申请人： NIPPON ZEON CO., LTD. , KOUSHIMA, Yuji , TANISHO, Hajime , KOHARA, Teiji
发明人： NIPPON ZEON CO., LTD.
IPC分类号： C09C01/00
CPC分类号： C09C3/12 , C08K9/06 , H05K1/0373 , C08L65/00
摘要： A composition comprising a thermoplastic norbornene resin and, dispersed therein, particles of an inorganic filler coated with a silane compound comprising a silicon atom and, bonded thereto, four groups consisting of one or more alkyl groups and one or more hydrolyzable groups, such as trimethoxy-p-propylphenylsilane. The composition is excellent in tensile properties and impact resistance, has such a low coefficient of linear expansion as to be excellent in dimensional accuracy resistant to temperatue changes, and is excellent in moldability to give moldings having excellent surface accuracy.
摘要翻译：一种组合物，其包含热塑性降冰片烯树脂，并分散在其中涂覆有包含硅原子的硅烷化合物的无机填料的颗粒，并且与其键合，由一个或多个烷基和一个或多个可水解基团组成的四个基团，例如三甲氧基 -p-propylphenylsilane。该组合物的拉伸性能和耐冲击性优异，具有这样的低的线性膨胀系数，其耐温变性的尺寸精度优异，成型性优异，因此具有优异的表面精度。

3. 发明申请

WO1992022590A1 HYDROGENATED THERMOPLASTIC NORBORNENE POLYMER, PRODUCTION THEREOF, AND OPTICAL ELEMENT BASE, OPTICAL ELEMENT AND LENS MOLDED THEREFROM 审中-公开
标题翻译：加氢热塑性异腈聚合物，其制造方法和光学元件基体，光学元件和镜片成型
公开(公告)号：WO1992022590A1
公开(公告)日：1992-12-23
申请号：PCT/JP1992000737
申请日：1992-06-09
申请人： NIPPON ZEON CO., LTD. , HOSAKA, Tohru , MIZUNO, Hideharu , KOUSHIMA, Yuji , KOHARA, Teiji , NATSUUME, Tadao
发明人： NIPPON ZEON CO., LTD.
IPC分类号： C08F08/04
CPC分类号： G11B7/253 , C08F8/04 , Y10S428/913 , Y10S430/146 , C08F32/00
摘要： A hydrogenated thermoplastic norbornene polymer having excellent characteristics as an optical material is provided by reducing the amount of transition metal atoms originating in the polymerization catalyst used and remaining in the hydrogenate below 1 ppm. A desired reduction in the amount of the remaining metal atoms is attained by treating the reaction mixture with an adsorbent in the course of or after the hydrogenation of the polymer. The hydrogenated polymer has a wide application field including the raw material of optical products having excellent characteristics, such as optical element bases and lenses.

4. 发明申请

WO1995002902A1 ELECTRONIC ELEMENT SEALING BODY 审中-公开
标题翻译：电子元件密封体
公开(公告)号：WO1995002902A1
公开(公告)日：1995-01-26
申请号：PCT/JP1994001157
申请日：1994-07-14
申请人： NIPPON ZEON CO., LTD. , KOUSHIMA, Yuji , KOHARA, Teiji , NATSUUME, Tadao
发明人： NIPPON ZEON CO., LTD.
IPC分类号： H01L23/29
CPC分类号： H01L33/56 , H01B3/30
摘要： An electronic element sealing body which has excellent moisture resistance and soldering heat resistance and in which an electronic element is sealed with a synthetic resin wherein at least the extending parts of the lead wires are sealed with a heat resistance composition containing (A) a thermoplastic norbornane resin and (B) heat-resistant resin whose heat deformation temperature is >/= 180 DEG C. An electronic element sealing body which has a transparent sealing part and a heat resistant sealing part, wherein the main body section of the electronic element is sealed with a thermoplastic norbornane resin and the extending parts of the lead wires are sealed with the above-mentioned heat-resistant composition.
摘要翻译：一种电子元件密封体，其具有优异的耐湿性和焊接耐热性，其中电子元件用合成树脂密封，其中至少引线的延伸部分用含有（A）热塑性降冰片烷的耐热组合物密封树脂和（B）热变形温度为> 180℃的耐热树脂。一种具有透明密封部分和耐热密封部分的电子元件密封体，其中电子元件的主体部分被密封用热塑性降冰片烷基树脂和引线的延伸部分用上述耐热组合物密封。

5. 发明申请

WO1994020575A1 RESIN COMPOSITION AND MOLDING PRODUCED THEREFROM 审中-公开
标题翻译：树脂组合物及其制造成型
公开(公告)号：WO1994020575A1
公开(公告)日：1994-09-15
申请号：PCT/JP1994000318
申请日：1994-02-28
申请人： NIPPON ZEON CO., LTD. , KOUSHIMA, Yuji , KOHARA, Teiji , NATSUUME, Tadao
发明人： NIPPON ZEON CO., LTD.
IPC分类号： C08L65/00
CPC分类号： C08K7/18 , C08L65/00
摘要： A resin composition comprising 30-95 parts by weight of a thermoplastic norbornene resin and 70-5 parts by weight of a spherical inorganic filler having an average particle diameter of 0.05-50 mu m; and a precision molding produced therefrom.
摘要翻译：一种树脂组合物，其包含30-95重量份的热塑性降冰片烯树脂和70-5重量份平均粒径为0.05-50μm的球形无机填料; 和由其制造的精密模制品。

6. 发明申请

WO1994014878A1 MOLDING WITH HARD-COATING LAYER AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：用硬涂层成型及其生产方法
公开(公告)号：WO1994014878A1
公开(公告)日：1994-07-07
申请号：PCT/JP1993001870
申请日：1993-12-24
申请人： NIPPON ZEON CO., LTD. , KONISHI, Yuichiro , HOSAKA, Tohru , TADA, Mitsushi , NATSUUME, Tadao , TAKAHASHI, Nobukazu , KOHARA, Teiji
发明人： NIPPON ZEON CO., LTD.
IPC分类号： C08J07/04
CPC分类号： C08J7/04 , C08J2365/00 , Y10T428/31667 , Y10T428/31924 , Y10T428/31935
摘要： A molding with a hard-coating layer having an adhesion of at least 50 squares per 100 squares in the cross cut adhesion test, an adhesion of at least 40 squares per 100 squares even after being held in water at 70 DEG C for 1 hour, a haze value of 1.0 % or less in Taber's abrasion resistance test and a pencil hardness of 2H or above. The production process comprises either modifying the surface of a base material comprising a thermoplastic norbornene resin by, for example, corona discharge to give a surface tension of at least 50 dyn/cm or forming on the surface a primary primer layer comprising a copolymer composed of a vinylaromatic compound and a conjugated diene and modified by introducing a polar group thereinto, then forming a primer layer for a silicone-base hard-coating agent on the modified surface or the formed primary primer layer, and finally forming thereon a silicone-base hard-coating layer.
摘要翻译：在十字切割粘合试验中，每100平方厘米具有至少50个正方形的粘合性的硬涂层的成型体，即使在70℃下保持1小时后，每100平方厘米至少40个正方形的粘合力，泰伯耐磨性试验的浊度值为1.0％以下，铅笔硬度为2H以上。生产方法包括通过例如电晕放电改变包含热塑性降冰片烯树脂的基材的表面，以产生至少50dyn / cm 2的表面张力，或在表面上形成包含由乙烯基芳族化合物和共轭二烯构成的共聚物，并通过在其中引入极性基团进行改性，然后在改性表面或形成的初级底漆层上形成硅氧烷基硬涂层的底漆层，最后在其上形成硅氧烷基硬涂层。

7. 发明申请

WO1992017529A1 THERMOPLASTIC SATURATED NORBORNENE RESIN SHEET AND PRODUCTION THEREOF 审中-公开
标题翻译：热塑性饱和异丁烯树脂片及其生产
公开(公告)号：WO1992017529A1
公开(公告)日：1992-10-15
申请号：PCT/JP1992000374
申请日：1992-03-27
申请人： NIPPON ZEON CO., LTD. , TAKAHASHI, Nobukazu , HANI, Tsutomu , KOHARA, Teiji , NATSUUME, Tadao
发明人： NIPPON ZEON CO., LTD.
IPC分类号： C08J05/18
CPC分类号： C08J5/18 , C08J2345/00
摘要： A thermoplastic saturated norbornene resin sheet having properties suitable for an optical material, a lowered birefringence and a reduced deterioration of the optical properties. A sheet having a birefringence of at most 20 nm and made from a thermoplastic norbornene resin with a glass transition point of 110 °C or above and a remaining solvent concentration of 0.5 wt % or less, which is obtained by dissolving a thermoplastic satured norbornene resin in a solvent with a boiling point of 100 °C or above, casting the resulting solution, drying the cast film at a maximum temperature of 100 °C or below until the concentration of the remaining solvent is reduced to 10 wt % or less, and further drying it at 110 °C or above until the concentration of the remaining solvent is reduced to 0.5 wt % or less.

8. 发明申请

WO1989006254A1 HYDROGENATED DERIVATIVE OF RING-OPENING POLYMER AND PROCESS FOR ITS PRODUCTION 审中-公开
标题翻译：开环聚合物的加氢衍生物及其制备方法
公开(公告)号：WO1989006254A1
公开(公告)日：1989-07-13
申请号：PCT/JP1988001331
申请日：1988-12-26
申请人： NIPPON ZEON CO., LTD. , NISHI, Yoshikatsu , OHSHIMA, Masayoshi , KOHARA, Teiji , NATSUUME, Tadao
发明人： NIPPON ZEON CO., LTD.
IPC分类号： C08G61/08
CPC分类号： C08G61/08
摘要： A hydrogenated derivative of a polycyclic norbornene ring-opening copolymer and a process for its production are disclosed. The hydrogenated derivative contains 5 to 85 mol % of (A) repeating units represented by general formula (I) or alkyl-substituted derivative thereof, (B) repeating units represented by general formula (II) or alkyl-substituted derivative thereof and, if necessary, (C) at least one kind of repeating units represented by general formula (III), alkyl-substituted derivative thereof, repeating units represented by general formula (IV), alkyl-substituted derivative and alkylidene-substituted derivative thereof. In the said formulas, the symbol --- represents either a single or a double bond.

9. 发明申请

WO1998008217A1 DISC MEDIUM SUBSTRATE AND DISC DEVICE 审中-公开
标题翻译： DISC介质基板和光盘设备
公开(公告)号：WO1998008217A1
公开(公告)日：1998-02-26
申请号：PCT/JP1997002927
申请日：1997-08-22
申请人： SONY CORPORATION , NIPPON ZEON CO., LTD. , OYANAGI, Eiki , SASA, Takeshi , IMAI, Yasuyuki , TAKINO, Hiroshi , KOHARA, Teiji , OSHIMA, Masayoshi
发明人： SONY CORPORATION , NIPPON ZEON CO., LTD.
IPC分类号： G11B05/82
CPC分类号： G11B23/0021 , B29C70/64 , C08F32/04 , G11B5/59633 , G11B5/6011 , G11B5/7315 , G11B5/82 , G11B5/8404 , G11B21/21 , Y10S428/913 , Y10T428/21
摘要： A disc medium substrate which is made of resin and used for a disc, for instance a magnetic disc, on/from which information is recorded/reproduced with a floating head. Protrusions higher than 50 nm are not formed on the surface of the substrate which is scanned by the floating head. The substrate is so molded that the number of particles in the molding material whose particle diameters are larger than 5 mu m is not more than 10000/g. The molding can be injection molding. Thermoplastic norvolnene system resin can be employed as the molding material. Projections and recesses corresponding to recording tracks may be provided on the substrate.
摘要翻译：由树脂制成并用于盘的磁盘介质基板，例如磁盘，用浮动头记录/再现信息。在由浮动头扫描的基板的表面上不形成高于50nm的突起。将基板成形为粒径大于5μm的成型材料中的粒子数不超过10000个/ g。成型可以是注塑成型。可以使用热塑性降冰片烯系树脂作为成型材料。可以在基板上设置与记录轨迹相对应的突出和凹陷。

10. 发明申请

WO1994016965A1 PRESS-THROUGH PACKAGE 审中-公开
标题翻译：新闻包
公开(公告)号：WO1994016965A1
公开(公告)日：1994-08-04
申请号：PCT/JP1994000122
申请日：1994-01-28
申请人： NIPPON ZEON CO., LTD. , MATSUI, Toshiyasu , HANI, Tsutomu , KOHARA, Teiji , NATSUUME, Tadao
发明人： NIPPON ZEON CO., LTD.
IPC分类号： B65D75/34
CPC分类号： B65D75/32 , B65D75/326 , B65D75/327 , Y10T428/1352 , Y10T428/1379
摘要： A press-through package produced by inserting an article in a stoage pocket formed by a vaccuum molding method on a sheet, which consists of a thermoplastic norbornene resin, more preferably a hydrogenated ring-opening polymer of dicyclopentadiene; and then packaging the article by sealing the opening of the pocket with metal foil. Since the packaged article can be seen from the pocket, and since the package has excellent moisture-proofing characteristics, the deterioration, which is ascribed to the moisture occurring in the article, of the article can be prevented reliably, and the manufacturing efficiency of the package becomes high.
摘要翻译：通过将由真空成型法形成的储藏袋中的物品插入由热塑性降冰片烯树脂组成的片材上制成的压入包装，更优选为二环戊二烯的氢化开环聚合物; 然后通过用金属箔密封袋的开口来包装物品。由于可以从口袋中看到包装物品，并且由于包装具有优异的防潮特性，因此可以可靠地防止因制品中发生的湿气而导致的劣化，并且可以有效地制造包装变高。

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