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    • 2. 发明专利
    • CONSTRUCTING METHOD OF MASK FOR X-RAY EXPOSURE
    • JPH02281726A
    • 1990-11-19
    • JP10434289
    • 1989-04-24
    • NIPPON TELEGRAPH & TELEPHONE
    • OKI SHIGEHISAODA MASATOSHIOZAWA AKIRAOKUBO TAKASHI
    • G03F1/22H01L21/027
    • PURPOSE:To obtain a mask for X-ray exposure having a high positional precision, by using an X-ray transmitting thin film having a specified stress-film thickness product which enables prevention of deformation of a mask substrate. CONSTITUTION:An X-ray transmitting thin film 7 having the value of a stress- film thickness product given by formula I when the film thickness of the X-ray transmitting thin film 7 is denoted by tm, the Young's modulus by Em, a stress so defined that a positive sign is given when the direction of the stress of the X-ray transmitting thin film 7 is directed to the center of an X-ray mask substrate 6, by deltam, the diameter of the mask substrate 6 whereon the X-ray transmitting thin film 7 is formed, by D, the Young's mudulus thereof by Es, the Poisson ratio thereof by nus, the diameter of an X-ray transmitting window formed on the mask substrate 6 for transmitting X-rays by (d), and the degree of interlayer superposition allowance of an integrated circuit formed by using a plurality of X-ray masks, by p, is employed. Thereby the deformation of an Si substrate due to the stress of the X-ray transmitting thin film can be prevented and a mask for X-ray exposure satisfying a demanded precision in superposition can be obtained.
    • 3. 发明专利
    • METHOD AND DEVICE FOR DRY-ETCHING HIGH MELTING POINT METAL
    • JPH08250474A
    • 1996-09-27
    • JP5222395
    • 1995-03-13
    • NIPPON TELEGRAPH & TELEPHONE
    • OZAWA AKIRAOKI SHIGEHISAMATSUDA KOREHITO
    • H01L21/302H01L21/027H01L21/3065
    • PURPOSE: To form a protective film on the patterned side wall of a high melting point metallic film which is a sample to be worked formed on a substrate carrying the metallic film and to etch the rectangular cross section of the metallic film with high accuracy by faithfully following the dimension of a mask pattern by setting the substrate in an oxygen atmosphere. CONSTITUTION: After a sample 7 is set on a sample stage 4 in a vacuum vessel 1, the vessel 1 is evacuated to a prescribed degree of vacuum. After evacuation, a prescribed amount of an etching gas is introduced to a plasma generating chamber 1" through an etching gas introducing port 9 and another prescribed amount of an oxygen gas for forming a protective film on the side wall of a pattern is introduced to an etching chamber 1' through a gas introducing port 10. Then an altered layer and oxygen adsorbing layer are removed by actuating a main magnet coil 2 and introducing electric power from an RF power source 6 and microwaves 5 to the vessel 1, and then, exposing the sample 7 to a plasma flow for a prescribed period of time. Successively, the sample 7 is etched for a prescribed period of time by introducing argon gas to the vessel 1 from an etching gas introducing port 20 and adjusting the power source 6.
    • 5. 发明专利
    • DRY ETCHING DEVICE
    • JPS6258633A
    • 1987-03-14
    • JP19784285
    • 1985-09-09
    • NIPPON TELEGRAPH & TELEPHONE
    • ODA MASATOSHIYAGI YOSHIJIOKI SHIGEHISA
    • H01L21/302H01L21/3065
    • PURPOSE:To perform dry etching process with high precision by a method wherein the surface of an electrode opposing to another electrode loaded with a substrate is coated with a material containing C, H as components which is assumed as the supply source of gas to be polymerized. CONSTITUTION:Within a reaction chamber 27 provided with a pair of discharge electrodes 23, reaction gas under specified pressure is fed to the reaction chamber 27 to excite glow discharge for etching a substrate 24 arranged on one of the discharge electrodes 23. At this time, the surface of discharge electrode 23 opposing to the other discharge electrode 23 loaded with the substrate 24 is coated with a material 25 containing C, H as components. A polyimide film with excellent thermal resistance is applicable to said material containing C, H as components. When the substrate 24 is etched, the surface of polyimide film 25 is also polymerized in plasma to be sticked on the surface of substrate 24. Through these procedures, dry etching process with high precision can be performed.
    • 7. 发明专利
    • JPH05251322A
    • 1993-09-28
    • JP19582892
    • 1992-03-06
    • NIPPON TELEGRAPH & TELEPHONE
    • SAITO YASUNAOOKI SHIGEHISA
    • H01L21/027
    • PURPOSE:To easily mount a wafer stage in a state that it has been positioned by means of the reference face of a cassette main body by positioning and arranging it by using pins for positioning use by a method wherein the wafer stage is attached to the cassette main body by positioning it to the pins for positioning use by means of the reference face. CONSTITUTION:In a relationship that a line connecting two pins 6, 7 for wafer front and back positioning use is made parallel with the reference face 1S of a cassette main body 4, a wafer stage 9 is attached to the cassette main body 4 in such a way that the pins 6, 7 for positioning use are positioned to the cassette main body 4 by means of the reference face 1S. In addition, the surface of a wafer 14 which is mounted on the face, for wafer mounting use, of the wafer stage is set to a height position which is higher than the surface 2 of the cassette main body 4. As a result, the wafer stage is fixed and attached via leaf springs 17. A ring-shaped plate 18 for wafer fixation use is attached to the surface 2 of the cassette main body 4 by using screws 19 so as to be freely detachable in a state that the wafer 14 has been pressed down against the leaf springs 17.